Newsletter for the 3rd week of May 2025

Key market and technology trends driving Indian VLSI semiconductor design services: Top vendors listed, analysed and ranked

India is a hub for semiconductor design, with more than 80%

Read more: https://www.eeherald.com/section/news/p20250520nwbelliindiavchip.html

Booming AI in semiconductor chip design: Transforming EDA, market trends, and innovators coming out of stealth

In 2024, the industry spent approximately $20 billion on EDA

Read more: https://www.eeherald.com/section/news/p20250522nwchinnavlsiai.html

Chip design EDA: The three popular and latest P&R tools for advanced nodes including open-source

Synopsys IC Compiler II (ICC2) is widely used by

Read more: https://www.eeherald.com/section/new-products/p20231415nw001a.html

Top 12 cutting-edge operational amplifiers for precision electronics system design in 2025

12 recently released op amps from leading manufacturers, including

Read more: https://www.eeherald.com/section/new-products/p20250521bellinpopamp34.html

Evolution of semiconductor-powered ADAS Systems of Tesla and BYD: A guide for ADAS chip design engineers

In 2015, Tesla’s Model S introduced Autopilot, a Level 2 ADAS

Read more: https://www.eeherald.com/section/news/p20250518nwbelliadas.html

Current sensing in electric vehicles: Practical details of key technologies

EVs operate with battery packs, typically lithium-ion cells arranged in

Read more: https://www.eeherald.com/section/news/p20250522inamcurrentsensr.html

A decade of semiconductor growth from 2014-2024: Equipment outperform chips in growth

In 2014, semiconductor equipment revenue stood at 37.5

Read more: https://www.eeherald.com/section/news/p20250518bellisemi56.html

Deep dive in CPO tech with the launch of 3rd gen 200G/Lane from Broadcom

Broadcom’s CPO development started in 2021 with the Tomahawk 4-Humboldt

Read more: https://www.eeherald.com/section/new-products/p20250520nwbroadcomcpo.html

Modem semiconductor chips: 5G and 6G RAN chipset market ignites fierce competition in 2025

5G is transforming industries and consumer experiences worldwide

Read more: https://www.eeherald.com/section/news/p20250518belli-rf-modem.html

System-in-Package (SiP) with good business development strategy is still relevant for Indian ESDM OEMs

System-in-Package (SiP) integrates multiple integrated circuits

Read more: https://www.eeherald.com/section/news/p20250521contributeshart.html

STMicroelectronics boosts Singapore’s Lab-in-Fab for Piezoelectric MEMS development

The initiative builds on the original Lab-in-Fab, established in 2020

Read more: https://www.eeherald.com/section/news/p20250522nwstmlabfab.html

Marvell and NVIDIA partner to integrate NVLink Fusion with custom silicon for AI Infrastructure

The integration of Marvell custom silicon with NVLink Fusion

Read more: https://www.eeherald.com/section/news/p20250519n.html

Qualcomm and Advantech partner to enhance Edge AI for IoT at COMPUTEX 2025

Qualcomm Technologies and Advantech are providing a tool chain for edge AI

Read more: https://www.eeherald.com/section/news/p20250520nwqualladvantech.html

Synaptics appoints Rahul Patel as President and CEO

Patel brings over 30 years of experience in the semiconductor industry

Read more: https://www.eeherald.com/section/news/p20250522nwsynapceo.html

SEMI and Purdue university introduce AI and data analysis online courses for semiconductor industry

SEMI University offers over 800 online courses in multiple languages

Read more: https://www.eeherald.com/section/news/p20250522nwsemiperdue.html

ROHM introduces compact surface-mount near-infrared LEDs for VR/AR and industrial applications

The new models include three package types: two ultra-compact

Read more: https://www.eeherald.com/section/new-products/p20250522nprohm.html

Intel introduces Arc Pro B60 and B50 GPUs and Gaudi 3 AI Accelerators at Computex 2025

Intel also announced the availability of Intel Gaudi 3 AI accelerators

Read more: https://www.eeherald.com/section/new-products/p20250520npintelh.html

Global TWS market grows 18% in Q1 2025, driven by regional expansion and open-ear devices

Vendors like Xiaomi and Huawei are expanding in regions such as

Read more: https://www.eeherald.com/section/news/p20250522nwomdiacanalys.html

Survey finds 53% of manufacturers adopting industrial robots to improve quality

The survey included responses from manufacturing engineers to

Read more: https://www.eeherald.com/section/news/p20250522nwabiresearch.html

Red Hat and AMD expand collaboration for AI and virtualization at Red Hat Summit 2025

The collaboration enables AMD Instinct GPUs on Red Hat OpenShift AI

Read more: https://www.eeherald.com/section/news/p20250520npamdredhat.html

Cognichip emerges from stealth with $33M seed funding for Artificial Chip Intelligence

Aalaei, with 25 years in the semiconductor industry,

Read more: https://www.eeherald.com/section/new-products/p20250517nwcognichip.html

CMTI launches level 2 laboratory training on semiconductor packaging in Bengaluru

The training, conducted at CMTI’s Sensor Technology Development

Read more: https://www.eeherald.com/section/new-products/p20250515nwcmti.html

Large wafer AI semiconductor chip expert Cerebras launches Qwen3-32B on its AI inference platform

Cerebras has fastest time to first answer token for Qwen-3 32B

Read more: https://www.eeherald.com/section/new-products/p20250517nwcererbras.html

L&T-Cloudfiniti partners with QpiAI to advance quantum computing

L&T-Cloudfiniti and QpiAI will conduct joint R&D programs

Read more: https://www.eeherald.com/section/new-products/p20250515nw001landt.html

Semiconductor and electronics market: ASIC SoC market was valued at USD 27 Billion in 2024, to reach 43.39 Billion by 2030

The increasing use of Internet of Things (IoT) devices is driving

Read more: https://www.eeherald.com/section/new-products/p20250517nw001marketedit.html

Kioxia introduces CM9 Series Enterprise NVMe SSD with 8th gen BiCS FLASH technology

Compared to the previous KIOXIA CM7 Series, the CM9 Series

Read more: https://www.eeherald.com/section/new-products/p20250517npkioxia.html

xMEMS introduces Sycamore-W speaker for smart watches and wearable fitness bands

The Sycamore-W offers a low-frequency response

Read more: https://www.eeherald.com/section/new-products/p20250515npmemsspeaker.html

2025 Device Research Conference to showcase advances in semiconductor device technology

The DRC 2025 program includes three plenary sessions, six keynotes

Read more: https://www.eeherald.com/section/new-products/p20250515nwdrcevent.html

Rambus announces client chipsets for AI PC memory modules

The chipsets support LPCAMM2, CUDIMM, and CSODIMM

Read more: https://www.eeherald.com/section/new-products/p20250515np1rambus.html

POLYN Technology announces first tapeout of NASP chip

The NASP technology enables on-chip AI for IoT devices, supporting applications in automotive

Read more: https://www.eeherald.com/section/news/p20250514nppolyn1.html

CyberLink partners with AMD to expand on-device Generative AI access

The collaboration also supports Promeo, CyberLink’s creative studio for online selling and marketing

Read more: https://www.eeherald.com/section/new-products/p20250515nwfaceme.html

Global rising stars of silicon in year 2025: How emerging semiconductor startups are redefining AI, storage, and connectivity

Others are pioneering digital lidar and piezoMEMS technologies

Read more: https://www.eeherald.com/section/news/p20250512nw003starsemi.html

RISC-V, OpenRISC, and SPARC: A comparative analysis of Open-Source processor ISAs

RISC-V, initiated in 2010 at UC Berkeley by Krste Asanović

Read more: https://www.eeherald.com/section/news/p20250514nw001open.html

Unleashing Open-Source VLSI semiconductor Innovation: Find some of the powerful and flexible SoC chip framework and legacy

Central to open-source SoCs is a flexible instruction set architecture

Read more: https://www.eeherald.com/section/news/p20250513nwopesilicon.html

Global semiconductor OSAT industry in 2024: Top 10 companies and market dynamics

JCET, in third place, reported $5 billion in revenue

Read more: https://www.eeherald.com/section/news/p20250513nwosat01.html

UCIe: Chiplet connectivity with optical Interconnects and future THz wireless possibilities

While UCIe is primarily known for its electrical interconnects

Read more: https://www.eeherald.com/section/news/p20250513nwucie34.html

Union Cabinet approves ₹3,706 Crore HCL-Foxconn semiconductor unit in YEIDA, UP

Foxconn’s investment in India exceeds USD 1.4 billion in India as of

Read more: https://www.eeherald.com/section/news/p20250513nwfoxconnhcl.html

RISC-V International and RISE Project collaborate on Yocto Project support

The RISE Project, a collaboration of over 20 RISC-V member

Read more: https://www.eeherald.com/section/news/p20250513nwyocto.html

The Power-hungry brain of AI: Exponentially growing energy consumption in AI Data Centers

Imagine a single ChatGPT query as a spark of electricity

Read more: https://www.eeherald.com/section/news/p20250512nwaidatapower.html

TSMC posts record-breaking April 2025 revenue, signaling a strong AI semiconductor growth in 2nd quarter 2025

The April figures build on TSMC’s exceptional first-quarter performance

Read more: https://www.eeherald.com/section/news/p20250512nwtsmc.html

IISc Researchers harness hidden power of defects: Impact ionization in 2D transition metal dichalcogenide FETs

This study delves into the impact ionization in MoS2

Read more: https://www.eeherald.com/section/news/p20250505nw00fet.html

Uviquity secures $6.6M seed funding to advance solid-state far-UVC semiconductor technology for safe and scalable photonic disinfection

Uviquity is developing solid-state far-UVC (200-230 nm)

Read more: https://www.eeherald.com/section/news/p20250507npuvsensor.html

Siemens and Intel foundry collaborate on advanced IC and packaging solutions for 2D and 3D integration

Siemens’ industry-leading Calibre nmPlatform

Read more: https://www.eeherald.com/section/news/p20250506nwsiemens.html

IPC-8981: establishing global standards for quality and reliability in E-Textile wearables

Developed by the IPC E-Textiles Wearables Standard Task Group

Read more: https://www.eeherald.com/section/news/p20250506nwipc01.html

TDK introduces multilayer chip beads with 8 A rated current for power supply lines

Power circuits for in-vehicle ECUs, power trains, vehicle body control

Read more: https://www.eeherald.com/section/new-products/p20250513nptdk.html

Intel core ultra series 2 processors achieve full NPU support in MLPerf client v0.6 benchmark, leading AI compute performance

Highest NPU Throughput: With a throughput of 18.55 tokens

Read more: https://www.eeherald.com/section/news/p20250506nwintel01.html

Synaptics and Murata collaborate on advanced wi-fi and bluetooth modules for automotive applications

This collaboration leverages Synaptics’ Veros Wi-Fi

Read more: https://www.eeherald.com/section/news/p20250506nwsynaptics.html

SiFive and Kinara launch HiFive Xara X280 USB module for bare-metal RISC-V vector and edge AI development

At the heart of the Xara board is Kinara’s Ara-2 processor

Read more: https://www.eeherald.com/section/news/p20250509nwsifive.html

India’s silicon surge: Career opportunities and insights for budding engineers in semiconductor manufacturing and equipment

The semiconductor equipment industry is a unique convergence of

Read more: https://www.eeherald.com/section/news/p20250507manjunathkas.html