System-in-Package (SiP) with good business development strategy is still relevant for Indian ESDM OEMs

India is a rising force in the global semiconductor industry, contributing nearly 30% of the world’s VLSI design workforce and building capabilities in semiconductor assembly (OSAT/ATMP). However, to achieve true leadership in semiconductor product development, India must strengthen the link between design and manufacturing. This link comprises two critical components: the post-tape-out ecosystem, driven by System-in-Package (SiP) technology, and a strategic sales/business development approach. For Indian OEMs and electronics design and manufacturing companies, SiP offers a transformative opportunity to innovate, compete globally, and create high-value products. This article explores how SiP can empower Indian companies and how a robust BD strategy can amplify its impact.

System-in-Package – The Catalyst for Indian Innovation

System-in-Package (SiP) integrates multiple integrated circuits (ICs), and in some cased passive components, and other elements into a single package, delivering a complete system with enhanced performance, reduced size, and lower costs. Unlike traditional chip design requiring tape-outs, SiP leverages existing components to create market-ready solutions. For Indian OEMs and electronics companies, SiP offers the following advantages: