Longsys Hits One Million Units in Monthly mSSD Production, Boosting Edge AI Storage Rollout

OpenAI, Broadcom Introduce New Intelligence Processor Built for LLM Inference

 OpenAI and Broadcom have introduced Jalapeño, OpenAI's first Intelligence Processor, an accelerator built around OpenAI's approach to LLM inference and the first chip in a multi-generation compute platform the two companies are developing together. The goal is to make advanced AI fas

Qualcomm Unveils Data Center Strategy, Eyes Multiple Growth Inflection Points Over Next 3-5 Years

At its 2026 Investor Day, Qualcomm laid out an accelerated diversification strategy alongside a new, comprehensive push into data center infrastructure, positioning the move as the next stage of growth spanning its full range of comp

DEEPX and Sixfab Bring Edge AI to Raspberry Pi with New AI Acceleration Board

DEEPX, a South Korean on-device AI s

TinyML AI Chipset Shipments Forecast to Surpass 4.1 Billion by 2031

Global technology intelligence firm ABI Research forecasts that TinyML AI chipset shipments, excluding personal and work devices, will grow at a 37% CAGR through 2031, surpassing 4.1 billion units. Related revenue is projected to exceed US$7.8 billion. The growth reflects embedded AI moving

Qualcomm Launches Snapdragon START Program for Personal AI Devices

Qualcomm Technologies announced the Snapdragon Scalable Turnkey AI-Ready Toolkit (START) at Augmented World Expo. The program combines hardware modules powered by Snapdragon platforms with an AI-agnostic full software stack and a network of manufacturing partners. Snapdragon START enables

AMD and Rackspace Technology Sign Agreement for 30 MW Phased AMD AI Compute Deployment

AMD and Rackspace Technology have signed a definitive agreement for the phased deployment of an initial 30 MW footprint of AMD-based compute across Rackspace’s global data centers. The deployment is scheduled to begin in late 2026 and continue through 2028. The agreement operationalizes the

Tensordyne Tapes Out Napier AI Inference Processor on TSMC 3nm, Reports 17x Tokens Per Watt vs NVIDIA Blackwell

Tensordyne, a new entrant into AI Inference chip world,  has announced the tape-out of its Tensordyne Napier (TDN) AI inference system. The system is designed to address the trade-off between inference speed and cost efficiency. The platform was developed in partnership with Broadcom

GlobalFoundries Partners with U.S. Department of Energy’s Genesis Mission for AI Semiconductor Development

GlobalFoundries  announced a strategic partnership with the U.S. Department of Energy’s Genesis Mission as an industry partner. The agreement provides Genesis Mission researchers  including those from National Laboratories, universities, industry partners, and startups  acces

GSOC Solutions and Andes Technology Partner to Integrate RISC-V CPU Portfolio into Ocean SoC and Chiplet Platform

GSOC Solutions, an ASIC development center based in Tel-Aviv, Israel, and Andes Technology (TWSE: 6533), a supplier of RISC-V processor cores, have announced a strategic partnership. The agreement integrates Andes’ full range of RISC-V CPU IP into GSOC’s Ocean platform, a configurable

AI Server Revenues Forecast to Reach Over $523 Billion by 2030 as Agentic AI and Finetuning Workloads Offset Frontier Model Training Slowdown: ABI Research

AI workload growth, including Agentic AI, finetuning, and frontier model training, will vary over the decade, influenced by large model training saturation and the scaling of enterprise AI. Hyperscaler CAPEX is set to grow in 2025, topping 2024 levels and injecting growth into the Artifici

Alibaba Releases Zhenwu M890 AI Semiconductor Chip and Panjiu AL128 128-Card Supernode at 2026 Cloud Summit

At the 2026 Alibaba Cloud Summit held on 20th May 2026, Alibaba released a 128-card supernode server based on Pingtouge’s (T-Head) new-generation AI Semiconductor chip, the Zhenwu M890. Equipped with the ICN Switch 1.0 interconnect chip,  delivering communication latency  in 100s