Design Guide
Cadence Expands Collaboration with HPE on Digital Twin Platform for AI Data Center Modernization
Cadence has announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization for next-generation AI and high-performance computing (HPC) infrastructure. The collaboration integrates the Cadence Reality Digital Twin Platform, which virtualizes data c
4 min read
onsemi Launches GaNEXUS Gallium Nitride Power Portfolio with 40V to 650V FETs
onsemi has announced the launch of its GaNEXUS gallium nitride (GaN) power portfolio. The initial devices, now sampling, include GaNEXUS FETs across voltage ranges from 40V to 650V and 650V GaNEXUS Smart GaN FETs with integrated protection features. The portfolio targets applications in AI
3 min read
Should You Build Your Own AI-Assisted Silicon IP and EDA Tools? A Brutally Honest Analysis
The question lands on the desk of every engineering VP at a growing fabless firm, usually after a painful licensing renewal: Do we keep paying ARM and Synopsys indefinitely, or do we build our own stack? It is not a hypothetical anymore. India's Saankhya
13 min read
EMI Reduction in Automotive Power Devices: Design Strategies for Compliance, Safety, and Performance
EMI Reduction in Automotive Power Devices: Design Strategies for Compliance, Safety, and Performance by Giusy Gambino, Yasmin Abigail Chiarenza, and Sebastiano GrassoSTMicroelectronics, Cat
25 min read
Toshiba Develops Trench-Gate SiC MOSFET Technology for Lower On-Resistance and Enhanced Short-Circuit Robustness
Toshiba Electronic Devices & Storage Corporation has developed a technology for trench-gate silicon carbide (SiC) MOSFETs that reduces on-resistance while improving short-circuit robustness. The technology optimizes the bottom p-well structure formed under the trench and the design of the jun
2 min read
Why Aliro device makers are ready to unlock truly connected access control
The full release of Aliro 1.0 by the Connectivity Standards Alliance signals that the new industry standard for secure & interoperable access control is ready to offer a convenient alternative to proprietary solutions
8 min read
Fujitsu Launches Application Transform Powered by Kozuchi Generative AI Service for Legacy Source Code Analysis and Design Document Generation
Fujitsu announced the launch of Fujitsu Application Transform powered by Fujitsu Kozuchi, a generative AI service that analyzes source code and automatically generates design documents. The service reduces design document generation time by approximately 97%. It will be offere as a SaaS in Japan
3 min read
Copper Interconnects at the Breaking Point: Why They Are Failing in Sub-3 nm AI Chips
As artificial intelligence (AI) accelerators push toward 2 nm and below, the industry’s decades-long reliance on copper (Cu) interconnects in the back-end-of-line (BEOL) is facing fundamental physical limits. Gate-All-Around (GAA) nanosheet transistors—adopted by TSMC (N2), Intel (18A
6 min read
Securing India's Roads
By Amit Sethi, Sr. Marketing Manager, Connected Security, STMicroelectronics Pvt LtdIndia's automotive sector is accelerating toward a connected, electrified future, with millions
5 min read
Renesas Announces General Availability of Renesas 365 Cloud Platform for Embedded Development
Renesas announced the general availability of Renesas 365, Powered by Altium, on March 11, 2026. Renesas 365 is described as the first open end-to-end electronics development platform. It operates in a unified cloud environment and combines device exploration, model-based system development, devi
4 min read
NB-IoT Technology: A Transformative Enabler for IoT Applications with ST87M01 Module
NB-IoT Technology: A Transformative Enabler for IoT Applications with ST87M01 Module Indar SINGHAL, STMicroelectronics Pvt. Ltd , India
20 min read
Imec Unveils 7-Bit 175GS/s Time-Interleaved Slope-ADC at ISSCC 2026 with Record-Small Footprint
Imec presented a 7-bit, 175GS/s analog-to-digital converter (ADC) at the IEEE International Solid-State Circuits Conference (ISSCC) 2026. The ADC, implemented in 5nm FinFET technology, features a core area of 250 x 250 µm² and a conversion energy of 2.2 pJ per sample. It achieves one o
3 min read
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