EDA
Modelithics Qorvo GaN Library v26.5.11 Adds 200W QPD2562L GaN Model
Modelithics has released version 26.5.11 of its Modelithics Qorvo GaN Library. For more than 12 years, the library has given RF and microwave engineers up-to-date, highly accurate nonlinear models based on real-world measurements, helping speed up design cycles, impro
3 min read
Three Ex-Synopsys Engineers, One Trillion-Dollar Bet: Inside CaretEDA's Open Source, AI-Native Approach to Chip Design
Three former Synopsys colleagues have joined forces to launch CaretEDA, a startup betting that agentic AI and open source tools can make chip design faster, cheaper, and more accessible — without compromising the rigor the semiconductor industry demands. In a wide-ranging conversation with
10 min read
Vayavya Labs Announces General Availability of TVP Agentic AI for SystemC Modeling
Vayavya Labs has announced the general availability of TVP (Tvastaa VP), an agentic AI system that automatically generates optimized SystemC models, test plans, and test vectors directly from design specifications. The system enables semiconductor and system companies to build software models to
2 min read
DVCon India 2026: Agentic Plenty — AI Moves Into the Roots, Stem, Flower and Fruit of the EDA Tree
There was an invisible soul hovering over DVCon India 2026 visible in every keynote slide, every tutorial title, and every hallway conversation. That soul was agentic AI. From the three biggest names in EDA to the newest startups walking onto the stage for the first time, everyone at the Bengalur
8 min read
Lyptus Technologies acquires Aarohin Technologies to enhance ESL modeling
Bengaluru based Lyptus Technologies, a provider of semiconductor design and verification solutions, has announced the acquisition of Aarohin Technologies, a company focused on Electronic System Level (ESL) modeling and virtual prototyping. The move expands Lyptus Technologies’ capabilities
3 min read
DVCon India 2026 Scheduled for September 1-3 in Bengaluru with Focus on AI-Driven Design and Verification Methodologies
DVCon India 2026 will take place from September 1-3, 2026, at Radisson Blu in Marathahalli, Bengaluru. The conference addresses the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated circuits. EEHerald is the offi
7 min read
Silvaco Integrates NVIDIA AI and Accelerated Computing for Semiconductor Digital Twins
Silvaco and NVIDIA announced a collaboration to integrate NVIDIA accelerated computing and AI with Silvaco’s physics-based simulation portfolio for digital twins in semiconductor design and manufacturing. Silvaco is combining its physics-based modeling with NVIDIA’s accelerated
4 min read
Multi-Die Chiplets, AI-Driven Testing & Silent Data Corruption Take Center Stage at International Test Conference 2026
As advanced node manufacturing, heterogeneous integration, and silicon photonics drive exponential growth in testing complexity, industry leaders gathered at the International Test Conference (ITC) 2026 to address critical challenges and emerging solutions in semiconductor test and reliability.
5 min read
Cadence Launches AuraStack AI Super Agent for PCB and Advanced Packaging Design
Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, described as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning through to final product within a single AI-native environment.
8 min read
VeriSilicon Launches CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
VeriSilicon announced the CPP2000 Camera Post-Processing (CPP) IP, which expands its Image Signal Processing (ISP) solutions with advanced post-processing capabilities. The CPP2000 is designed to improve image quality and visual perception for moving-camera systems in robotics, drone
3 min read
Synopsys Releases First Multiphysics Fusion Solutions for Chip Design
Synopsys, announced the availability of its first Multiphysics Fusion solutions for customer deployment. The solutions integrate golden signoff multiphysics analysis into timing signoff, design closure, multi-die, and analog workflows. They enable SPICE-accurate multiphysics timing analysis with
4 min read
How GeniSys is Fueling India’s Semiconductor Dreams
In an interactive talk hosted by Srinivasa Reddy N, Editor of EEHerald, executives from GeniSys GmbH shared insights into the company’s software solutions for advanced semiconductor manufacturing and their relevance to India’s expanding ecosystem of design centers and upcoming fabrica
5 min read
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