Synopsys, announced the availability of its first Multiphysics Fusion solutions for customer deployment. The solutions integrate golden signoff multiphysics analysis into timing signoff, design closure, multi-die, and analog workflows. They enable SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes, up to 10x faster design closure with higher ECO success rates, and improved PPA. The portfolio also provides concurrent power integrity, electromagnetic, and thermal analysis across dies and packaging for system-level insights from exploration to signoff.
The Multiphysics Fusion solutions combine Synopsys AI-powered EDA tools with Ansys golden signoff analysis. They address signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics challenges in advanced nodes and multi-die architectures. The solutions were validated by Cisco, MediaTek, NVIDIA, and Samsung Foundry.
"Multiphysics is fundamentally reshaping how advanced semiconductor designs are engineered, driving a shift from costly overdesign to integrated, system-aware co-design," said Sanjay Bali, Senior Vice President of EDA Product Management and Strategy at Synopsys. "Our Multiphysics Fusion portfolio unifies Synopsys and Ansys technologies to embed physics directly into digital and analog workflows."
The first wave includes:
- Multiphysics Fusion for Timing Signoff: Integrates Synopsys PrimeTime with RedHawk-SC, RedHawk-SC Electrothermal, StarRC, and HFSS-IC for SPICE-accurate analysis incorporating IR, thermal, and stress effects.
- Multiphysics Fusion for Design Closure: Combines PrimeClosure with RedHawk-SC to embed power integrity into optimization.
- Multiphysics Fusion for Multi-die Designs: Uses 3DIC Compiler with RedHawk-SC, RedHawk-SC Electrothermal, and HFSS-IC for concurrent analysis.
- Multiphysics Fusion for Analog & Photonic Design: Integrates Custom Compiler with HFSS-IC and OptoCompiler with Lumerical for electromagnetic analysis and photonic systems.
The solutions use GPU-accelerated flows powered by NVIDIA CUDA-X libraries, including cuDSS.
Customer statements include:
MediaTek’s Harrison Hsieh noted that the technology provides earlier insight into cross-domain interactions and a runtime up to 10 times faster.
NVIDIA’s Tim Costa stated that the solutions deliver up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs, utilizing GPU acceleration up to 13x.
Samsung Electronics’ Hyung-Ock Kim highlighted SPICE-accurate correlation and margin recovery for timing signoff.
Cisco Silicon One is using the technology for unified IR drop effects in signoff design closure and timing-aware IR fixing.
The Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available now. More information is available at https://www.synopsys.com/solutions/multiphysics-fusion.html.
