Cadence Launches AuraStack AI Super Agent for PCB and Advanced Packaging Design

Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, described as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning through to final product within a single AI-native environment. Accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, the AuraStack AI Super Agent coordinates domain-specific AI agents across planning, implementation, and tightly integrated multiphysics analysis to compress the system-design cycle through manufacturing. With this launch, Cadence says it becomes the only provider offering agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design through advanced packaging and PCB design, building on its existing ChipStack™, InnoStack™, and ViraStack™ AI Super Agents.

Michael Jackson, Corporate Vice President of R&D for System Design and Analysis at Cadence, said the next era of AI infrastructure, spanning data centers, automotive, aerospace, and physical AI, will be defined not just by silicon, but by the systems that connect, power, and cool it. He said that as hyperscale data centers deploy massive AI clusters and other industries build increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. He s...