Silicon Sovereignty: How CDAC's VEGA Core, CDIL and Suchi Semicon Anchored India's Homegrown Chip Stack

Behind the multinational investment headlines, a quieter story ran through SEMICON India 2026: an indigenous processor architecture, developed by a government lab, is now showing up in commercial products, hackathon-winning prototypes and India's first fully domestic System-on-Module. C-DA

Siemens and TSMC enhance AI-driven semiconductor design automation collaboration

Siemens announced continued collaboration with TSMC on AI-powered automation and advanced semiconductor design enablement. The work builds on their relationship within the TSMC Open Innovation Platform (OIP) ecosystem and expands design enablement across semiconductor design workflows. Sieme

VeriFast Launches AI-Powered VeriQuest Solution for Verification Challenges at DVCon India 2026

VeriFast introduced its new AI solution, VeriQuest, at DVCon India 2026. In a brief interaction with the Editor of EEHerald, Nishith Shukla, Head of Engineering at VeriFast, outlined the company’s offering and its plans to address key pain points faced by verification engineers. Veri

Real Intent CEO Details Microarchitecture Analysis Breakthrough for Static Sign-Off at DVCon India 2026

DVCon India 2026 opened with a keynote vision talk by Dr. Prakash Narain, President and CEO of Real Intent, focused on transforming static sign-off through microarchitectural analysis and artificial intelligence. Prakash defined static sign-off as a verification approach that relies on str

Agnisys CEO Discusses AI Disruption and Golden Specification Focus at DVCon India 2026

At DVCon India 2026, Anupam Bakshi, CEO of Agnisys, shared observations on the rapid rise of artificial intelligence in electronic design automation during a brief interaction with me. Agnisys has exhibited at the event and presenting its latest solutions for accelerating semiconductor developmen

Multi-Die Chiplets, AI-Driven Testing & Silent Data Corruption Take Center Stage at International Test Conference 2026

As advanced node manufacturing, heterogeneous integration, and silicon photonics drive exponential growth in testing complexity, industry leaders gathered at the International Test Conference (ITC) 2026 to address critical challenges and emerging solutions in semiconductor test and reliability.

MetaOptics to Install Metalens Direct Laser Writer at University of Arizona to Support U.S. Expansion

MetaOptics, a Singapore-based company, has agreed to deploy its Direct Laser Writer, a system used to produce metalenses, at the University of Arizona's Center of Semiconductor Manufacturing. The move is a key part of the company's broader push into the U.S. market, with installation expected to

Siemens to Buy Precision Innovations, Adding AI-Driven Chip Planning to Its EDA Lineup

Siemens has agreed to acquire Precision Innovations, a privately held electronic design automation (EDA) company, adding AI-driven chip planning tools to its EDA lineup. The idea is to help chipmakers optimize power, performance, and area, known in the industry as PPA, earlier in the system-on-ch

Cadence Launches AuraStack AI Super Agent for PCB and Advanced Packaging Design

Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, described as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning through to final product within a single AI-native environment.

Intel Foundry Begins High-Volume Production Using ASML's High NA EUV Technology

ASML Holding N.V. has announced that Intel Foundry is now using ASML's High NA EUV technology on the Intel 18A process node to produce a subset of its Intel Core Ultra Series 3 processors, code-named Panther Lake. The milestone marks an important step in proving High NA EUV readiness within an

PI Introduces Objective Focusing Stages for High-Resolution Metrology and Microscopy Applications

DTI Introduces Hybrid MVDC Circuit Breaker for Safe DC Power in Ships and Data Centers