Multi-Die Chiplets, AI-Driven Testing & Silent Data Corruption Take Center Stage at International Test Conference 2026

As advanced node manufacturing, heterogeneous integration, and silicon photonics drive exponential growth in testing complexity, industry leaders gathered at the International Test Conference (ITC) 2026 to address critical challenges and emerging solutions in semiconductor test and reliability.

MetaOptics to Install Metalens Direct Laser Writer at University of Arizona to Support U.S. Expansion

MetaOptics, a Singapore-based company, has agreed to deploy its Direct Laser Writer, a system used to produce metalenses, at the University of Arizona's Center of Semiconductor Manufacturing. The move is a key part of the company's broader push into the U.S. market, with installation expected to

Siemens to Buy Precision Innovations, Adding AI-Driven Chip Planning to Its EDA Lineup

Siemens has agreed to acquire Precision Innovations, a privately held electronic design automation (EDA) company, adding AI-driven chip planning tools to its EDA lineup. The idea is to help chipmakers optimize power, performance, and area, known in the industry as PPA, earlier in the system-on-ch

Cadence Launches AuraStack AI Super Agent for PCB and Advanced Packaging Design

Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, described as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning through to final product within a single AI-native environment.

Intel Foundry Begins High-Volume Production Using ASML's High NA EUV Technology

ASML Holding N.V. has announced that Intel Foundry is now using ASML's High NA EUV technology on the Intel 18A process node to produce a subset of its Intel Core Ultra Series 3 processors, code-named Panther Lake. The milestone marks an important step in proving High NA EUV readiness within an

PI Introduces Objective Focusing Stages for High-Resolution Metrology and Microscopy Applications

DTI Introduces Hybrid MVDC Circuit Breaker for Safe DC Power in Ships and Data Centers

e-peas Raises USD 22 Million to Strengthen Position in the Ambient IoT Market

Imec, Diraq Achieve Coherent Operation of Eight-Qubit Silicon Spin Array in CMOS Foundry Process

Should You Build Your Own AI-Assisted Silicon IP and EDA Tools? A Brutally Honest Analysis

The question lands on the desk of every engineering VP at a growing fabless firm, usually after a painful licensing renewal: Do we keep paying ARM and Synopsys indefinitely, or do we build our own stack? It is not a hypothetical anymore. India's Saankhya

CDAC Offers VEGA RISC-V Processors and Peripheral IPs Free for MPW

CDAC has announced that its VEGA processors and peripheral IPs are now available free of cost for multi-project wafer (MPW) runs. The organization is also providing 100% free technical support to all licensing partners. The VEGA series consists of processors developed under the microproces

Soliton Demonstrates Language-Agnostic, Scalable Test Solutions Powered by AI

Soliton Technologies, a leading provider of software-powered post-silicon test and automation services, showcased its advanced solutions for semiconductor validation at the IESA Vision Summit 2026, held on February 25–26 at The Leela Bhartiya City Convention Centre. The company speci