VeriSilicon introduced a wireless IP platform based on GlobalFoundries’ 22FDX (22nm FD-SOI) process technology, designed for developing energy-efficient, integrated chips for IoT and consumer electronics. The platform supports wireless connectivity standards including Bluetooth Low Energy (BLE), Bluetooth Dual Mode (BTDM), NB-IoT, Cat.1/Cat.4, 802.11ah, 802.15.4g, and GNSS, providing RF, baseband, and software protocol stacks with optimized power, performance, and area (PPA) characteristics.
The platform has been used in mass-produced chips, including low-power BLE MCUs, Wi-Fi 802.11ah-based home security cameras, and high-precision GNSS SoCs, with over 100 million chips shipped. VeriSilicon has licensed over 60 FD-SOI IPs to 45 customers, totaling more than 300 licenses, and applied FD-SOI Adaptive Body Biasing (ABB) technology in mass-produced chips. The company has customized FD-SOI chips for 43 customers, with 33 designs in mass production for applications such as satellites, automotive, and smart glasses.
The platform supports emerging applications like Wi-Fi 6, satellite communications, millimeter-wave radar, and hearing aids, leveraging the low-power and high-integration features of FD-SOI technology.
