UC Berkeley partners with Applied Materials EPIC Center for semiconductor research

Applied Materials announced that the University of California, Berkeley will join the company’s EPIC Center in Silicon Valley as a research collaborator. UC Berkeley faculty and students will work with Applied’s scientists and engineers on research programs focused on material and pro

From 98% Imported to 98% Local: How Felcon and Four-C-Tron Are Building India's Semiconductor Cleanroom Ecosystem

For more than three decades, UK-based cleanroom specialist Felcon Limited and Bengaluru-based Four-C-Tron have quietly built some of India's most important semiconductor infrastructure  starting with the country's earliest wafer fab and continuing through today's wave of OSAT facilities an

Intel Foundry Begins High-Volume Production Using ASML's High NA EUV Technology

ASML Holding N.V. has announced that Intel Foundry is now using ASML's High NA EUV technology on the Intel 18A process node to produce a subset of its Intel Core Ultra Series 3 processors, code-named Panther Lake. The milestone marks an important step in proving High NA EUV readiness within an

European Commission Approves €659 Million German State Aid for Four Semiconductor Facilities

The European Commission has approved €659 million in German State aid to support the construction of four first-of-a-kind facilities in the semiconductor value chain. The aid measures align with the objectives of the Commission's Communication 'A Chips Act for Europe' and the 2024-2029 Polit

SILITH, UMC Reach Mass Production Milestone in Silicon Photonics Manufacturing

TSMC Reports Surging June 2026 Revenue, Driving 12% Q2 Growth

TSMC has released its net revenue report for June 2026, showcasing massive year-over-year growth that highlights the foundry's sustained momentum and high demand in the semiconductor sector.On a consolidated basis, TSMC's revenue for June 2026 reached approximately NT$442.68 billion. This mar

Intel Announces €5 Billion Investment for Capacity Expansion at Ireland Semiconductor Campus

Intel has announced a €5 billion ($5.7 billion) capital investment at its Leixlip campus in Ireland as the next phase of site capacity expansion. The move follows global demand for AI and high-performance computing that requires advanced silicon for AI Factories. The investment scales

Inside Toho Koki's Push Into India's Semiconductor Manufacturing Ecosystem

Japanese semiconductor equipment maker Toho Koki Seisakusho Co., Ltd. is steadily building a foothold in India, courting academic institutions, state-run innovation hubs, and private companies as it positions the country as a key partner for future semiconductor manufacturing.

Kurita Water Industries Establishes Kurita Membrane India Joint Venture for Semiconductor Water Treatment

Japan based Kurita Water has established Kurita Membrane India Private Limited as a joint venture with Membrane Group India Private Limited  and commenced operations. The JV focuses on water treatment solutions for the electronics industry, primarily the semiconductor sector, in India. <

Infineon Opens Smart Power Fab in Dresden, Doubling Power Semiconductor Capacity with €5 Billion Investment

Infineon Technologies AG opened its Smart Power Fab in Dresden today, several months ahead of schedule. The facility, representing a €5 billion investment, the largest single investment in the company's history and is described as the world's largest factory for intelligent power semiconduct

SK Keyfoundry Develops On-Chip EMC Protection Technology to Boost Automotive Semiconductor Reliability

SK Keyfoundry, a South Korean 8-inch pure-play semiconductor foundry, has developed and entered mass production of a new on-chip electromagnetic compatibility protection technology for automotive semiconductors. Built around a Bi-directional Silicon Controlled Rectifier structur

Applied Materials Introduces New Systems for DRAM and Advanced Packaging Supporting AI Chip 3D Architectures

Applied Materials introduced a suite of new chipmaking systems for building advanced 3D chip architectures used in next-generation AI. The announcement addresses constraints in AI compute where model scale and data movement demands outpace gains in bandwidth, capacity and energy efficiency