News
Altair ALT1350 and ALT1550 Chipsets Integrate Iridium NTN Direct
Iridium Communications announced that Altair Semiconductor is integrating Iridium NTN Direct capability into Altair's ALT1350 and next-generation ALT1550 IoT chipset platforms. With terrestrial cellular IoT and Iridium satellite connectivity on a single chipset, device manufacturers, module maker
4 min read
GLS Launches Innovation Funnel Project on Great American ChipForge for AI Vehicle Sensors
Great Lakes Semiconductor (GLS) announced the first project on its Great American ChipForge platform, launched under the company's Innovation Funnel initiative. The project draws on multiple GLS design centers, ChipForge modular wafer fabrication, and FINPAT packaging and test, demonstratin
7 min read
Bolt Graphics Achieves Silicon Bring-Up of Zeus Test Chip and Opens Taipei Office for GPU Production
Bolt Graphics, Inc. (Bolt), a fabless semiconductor startup building hardware and software for high-performance computing (HPC), rendering and digital twin workloads, announced the bring-up of its Zeus test chip and the opening of its Taipei office to manage manufacturing partnerships as the comp
4 min read
XCENA Demonstrates CXL Memory Solutions for AI Inference at OCP Global Summit 2026
XCENA, a fabless semiconductor company developing next-generation memory infrastructure for the AI era, demonstrated its CXL-based memory solutions for AI inference at OCP Global Summit 2026. The event was held Oct. 12–15 at the San Jose McEnery Convention Center. The demonstrations address
4 min read
EHT Semi Integrates Bird RF Measurement Technology into Semiconductor Power Platforms for Process Control
EHT Semi announced the integration of Bird RF measurement technology into its semiconductor power platforms, including the Orion Direct RF System and tailored waveform generators. An embedded Bird probe, with NIST-traceable calibration, provides the primary measurement of power, voltage, current,
3 min read
AVL, VisIC Integrate High-Power GaN Traction Inverter in Vehicle Demonstrator
VisIC Technologies and AVL are advancing their collaboration with the integration of VisIC's D³GaN power module technology into AVL's vehicle demonstrator. The demonstrator vehicle showcases VisIC D³GaN power modules in an advanced AVL electric drivetrain, taking high-power GaN from tes
7 min read
Infineon and Wolfspeed Expand Long-Term Silicon Carbide Wafer Supply Agreement to Include 200 mm
Wolfspeed and Infineon Technologies AG announced the expansion and extension of their existing long-term silicon carbide (SiC) wafer supply agreement. The expanded agreement adds 200 mm silicon carbide wafers to the existing 150 mm supply and builds on a supply relationship between the two
2 min read
Talon Precision Acquires ADEM Precision Machining Firm to Enter West Coast and Semiconductor Equipment Supply Chain
Talon Precision announced the acquisition of ADEM, LLC (Advanced Design, Engineering & Manufacturing), a precision machining and engineering firm based in Santa Clara, CA. The transaction was completed on October 8. Following the close, ADEM, LLC will operate as ADEM Precision LLC. The
3 min read
ChipAgents and NVIDIA Launch Build-A-Chip-Bench for End-to-End Autonomous Chip Design Evaluation
ChipAgents, the agentic AI platform for semiconductor engineering, today introduced Build-A-Chip-Bench, a benchmark built in collaboration with NVIDIA. The joint benchmark is designed to test whether AI agents can carry an end-to-end digital chip-design task from specification through physical im
4 min read
Global X Asia Semiconductor ETF Tracks Regional Chip Design, Manufacturing and IP Index
Global X Management Company LLC, the New York-based provider of exchange-traded funds, announced the launch of the Global X Asia Semiconductor ETF (ticker ACHP). The fund seeks to invest in companies positioned to benefit from the growth and advancement of the Asian semiconductor ecosystem
4 min read
Foxconn and Mitsubishi Electric Finalize Automotive Equipment Alliance
Hon Hai Precision Industry (Foxconn) and Mitsubishi Electric have reached a final agreement on a strategic alliance for the joint operation of the automotive equipment business. The announcement was published Oct 16, 2026. Lin Yin International Investment Co.,
4 min read
High Density Packaging User Group and Global Electronics Association Release IPC-TM-650-2.2.23 Copper Profile Test Method
High Density Packaging User Group (HDP) and Global Electronics Association have released IPC-TM-650-2.2.23, a new copper profile test method based on results from HDP’s Non-Contact Copper Foil Profile project. “This is a
1 min read
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