News
Murata Collaborates with Synopsys to Offer Simulation Models for Ansys HFSS and Icepak Tools
Murata Manufacturing has announced a collaboration with Synopsys, Inc. The partnership allows users of Synopsys simulation tools to navigate directly from the tools to Murata’s website to access and download the latest simulation models. The collaboration includes Synopsy
2 min read
SIA Statement Supports CHIPS Act Incentives for Coherent Indium Phosphide Facility Expansion
The Semiconductor Industry Association (SIA) today issued a statement from President and CEO John Neuffer regarding manufacturing incentives announced by the Commerce Department and Coherent for the expansion of Coherent’s indium phosphide manufacturing facility in Sherman, Texas. Th
2 min read
Smart Card Shipments Forecast to Reach 8.46 Billion by 2030 as eSIM Transition and Issuance Changes Reshape Markets
Global smart card shipments reached 8.32 billion units in 2025 and are projected to increase to 8.46 billion by 2030, according to ABI Research. The modest growth reflects the effects of inventory correction, eSIM adoption, and evolving card issuance strategies across SIM, payment, and government
3 min read
SEMI Smart MedTech Initiative Outlines Barriers to Scaling Wearable Biosensors for Clinical Use
The SEMI Smart MedTech Initiative has released a strategic outlook paper titled *Medicalizing Consumer Silicon* that examines obstacles and opportunities in moving wearable biosensors from wellness tracking to clinically accepted healthcare solutions. Despite advances in semiconductor tech
3 min read
Park Systems Launches Joint Development Program with imec for Metrology in 3D Packaging and Logic Research
Park Systems announced the launch of a new joint development program (JDP) with imec. Under the JDP, Park Systems will evaluate and develop measurement solutions using its product portfolio, including atomic force microscopy (AFM), white light interferometry (WLI), imaging spectroscopic ellipsome
2 min read
Agile Analog and Xiphera Collaborate on Post-Quantum Cryptography and Anti-Tamper IP Integration for Semiconductor Security
Cambridge, UK based Agile Analog has announced a collaboration with Xiphera. Agile Analog focuses on analog security IP. Xiphera focuses on hardware-based cryptographic solutions. The companies are integrating Agile Analog’s agileSecure anti-tamper sensor IP with Xiphera’s digital cry
3 min read
Tensordyne Tapes Out Napier AI Inference Processor on TSMC 3nm, Reports 17x Tokens Per Watt vs NVIDIA Blackwell
Tensordyne, a new entrant into AI Inference chip world, has announced the tape-out of its Tensordyne Napier (TDN) AI inference system. The system is designed to address the trade-off between inference speed and cost efficiency. The platform was developed in partnership with Broadcom
5 min read
Electron-on-Helium Qubits Advance as EeroQ Demonstrates Strong Microwave Photon Coupling in Nature Physics Study
EeroQ announced the first demonstration of the strong coupling of a microwave photon to the charge qubit state of an electron on helium. The peer-reviewed results were published in Nature Physics. EeroQ stated that the demonstration establishes the electron-on-helium (eHe) approach to quan
3 min read
Si2 Releases Public AI for EDA Ontology Repository for Agentic System Development
The Silicon Integration Initiative (Si2) AI/ML Schema/Ontology Working Group has announced the public release of its AI for EDA Ontology Repository. The repository supplies the semiconductor design community with an ontology and associated use cases to support experimentation with EDA agentic sys
3 min read
Adani and Jabil Announce Strategic Alliance for AI Data Center Infrastructure Manufacturing in India
Adani Group and Jabil have announced their intent to form a strategic alliance to establish a vertically integrated AI and data center infrastructure manufacturing platform in India. The alliance targets GW-scale AI rack and advanced infrastructure manufacturing to serve global data center build-
4 min read
Rapidus Signs MoU with Fondazione Chips-IT Following Japan-Italy Prime Ministerial Meetings on Semiconductor Cooperation
Rising Japan based advanced node foundry Rapidus Corporation announced that it has signed a Memorandum of Understanding with Fondazione Chips-IT, an Italian private-law foundation dedicated to semiconductor circuit design. The signing occurred as part of initiatives connected to the June 1
4 min read
CEA-Leti Demonstrates 22nm FeRAM with 3D HZO Capacitors at VLSI 2026
CEA-Leti announced the scaling of ferroelectric RAM (FeRAM) to the 22nm node using a 3D capacitor architecture. The development was presented at the VLSI Conference. The approach employs vertically integrated ferroelectric capacitors based on hafnium zirconium oxide (HZO) thin films. This
4 min read
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