News
Memory Chip Leader Micron Selects Bechtel for First Phase Construction of New York Semiconductor Fab in Clay
Micron Technology, Inc. and Bechtel announced that Micron has selected Bechtel as its partner for the engineering, procurement, and construction (EPC) of the first phase of its leading-edge memory manufacturing complex in Clay, New York. Bechtel will mobilize immediately at the White Pine
3 min read
Taiwan-India Sign First Semiconductor-Focused Academia-Industry MOU in Chennai
Director-General Stephen Hsu of the Taipei Economic and Cultural Center (TECC) in Chennai attended and witnessed the signing of a Memorandum of Understanding (MOU) on industry-academia collaboration among Chennai Institute of Technology (CIT), National Formosa University (NFU) of Taiwan, and Air
4 min read
Sterling and Wilson Signs MoU with South Korea's Shinsung E&G for Cleanroom HVAC Projects in Semiconductor, Battery and Display Sectors
Sterling and Wilson Pvt. Ltd., an Indian MEP and EPC company, has signed a Memorandum of Understanding (MoU) with Shinsung E&G, a South Korean HVAC and MEP company. The MoU covers joint bidding, participation, acquisition and execution of cleanroom and dryroom HVAC projects for semiconductor,
3 min read
President Droupadi Murmu Virtually Inaugurates Semiconductor Training Fab at IISc CeNSE
President Smt. Droupadi Murmu virtually inaugurated the Semiconductor Training Fabrication (Fab) Facility at the Centre for Nano Science and Engineering (CeNSE), Indian Institute of Science (IISc), on 3 June 2026. Prof. Govindan Rangarajan, Director of IISc, unveiled the commemorative plaque for
2 min read
AMD Makes a £2 Billion, Five-Year Commitment to the UK's AI and Computing Ecosystem
AMD announced a commitment of up to £2 billion over five years to strengthen the United Kingdom's artificial intelligence infrastructure, scientific research capabilities, and technical workforce. Announced by AMD Chair and CEO Dr. Lisa Su at London Tech Week, the investment spans new strat
5 min read
SDG&E, Qualcomm, and UC San Diego Deploy Edge AI System for Real-Time Wildfire and Extreme Weather Detection
San Diego Gas & Ele
8 min read
DVCon U.S. 2027 Opens Call for Technical Submissions, Deadline September 7, 2026
The Design and Verifica
6 min read
MediaTek and Samsung Complete First 3Tx 5-Layer 5G Uplink Test Reaching 670 Mbps
MediaTek announced a joint achievement with Samsung in which the two companies completed the industry’s first test of a 3Tx 5-layer uplink configuration. The test utilized MediaTek’s M90 5G modem platform together with Samsung’s virtualized RAN (vRAN), Massive-MIMO radios (MMU),
3 min read
Cadence and Intel Foundry Deepen Partnership to Co-Optimize the Intel 14A Process Node for HPC and Mobile
Cadence and Intel Foundry have announced a multi-ye
8 min read
SK hynix and NVIDIA Announce Multi-Year Partnership on Next-Generation Memory for AI Factories
SK hynix and NVIDIA have announced a multi-year technology partnership to advance next-generation memory aligned with NVIDIA’s AI infrastructure roadmap and to support the global buildout of AI factories. The agreement addresses the extended development cycles, advanced f
3 min read
Valeo and Calyos Sign MoU to Develop Passive Two-Phase Chip Cooling Solutions for Mobility and Data Centers
Valeo and Calyos have signed a Memorandum of Understanding (MoU) to develop and industrialize high-performance, standalone chip cooling solutions using passive advanced two-phase technology. The partnership addresses rising thermal challenges in the mobility sector, including vehicle electrificat
4 min read
Arm and Sumo Digital Develop Neural Dawn Game introduces Arm Neural Technology and Unreal Engine MegaLights
Arm and Sumo Digital have developed Neural Dawn, a mobile game that demonstrates the capabilities of Arm Neural Technology in next-generation Arm Mali GPUs scheduled for Arm CSS for mobile later this year. Neural Dawn is the first mobile game to use Unreal Engine MegaLights. It is built usi
3 min read
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