Products
TI launches multiaxial coreless Hall-effect current sensor for EV inverters
Texas Instruments has introduced the TMCS2100-Q1, which it describes as the industry's first multiaxial coreless Hall-effect current sensor designed for hybrid electric vehicle and electric vehicle (HEV/EV) traction inverter applications. Hall-effect sensors
5 min read
XCENA MX1 architecture integrates memory expansion and near-memory computing
XCENA presented the architecture and measured performance of MX1, its computational CXL memory system, during the Memory session at Hot Chips 2026. The presentation, led by Harry Kim, XCENA's chief product officer, was selected through the Hot Chips program committee's technical review process, a
6 min read
Hirose launches 1000V compact wire-to-board connector for automotive powertrains
Hirose has announced commercial availability of its ZE150HV Series high-voltage wire-to-board connector, designed for electric vehicle (EV) and hybrid electric vehicle (HEV) powertrains. The connector features a 4.5mm pitch, meaning the spacing between indiv
4 min read
EPC starts mass production of EPC2370 GaN FET for AI power systems
Efficient Power Conversion (
5 min read
Nordson ASYMTEK Vantage XL fluid dispensing system for panel-level packaging
Nordson Electronics Solutions has introduced the ASYMTEK Vantage XL, a new fluid dispensing system designed specifically to handle the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging processes.
3 min read
LitePoint and STMicroelectronics Validate Next-Generation UWB Technology
LitePoint, a provider of communication test solutions, has successfully validated the physical layer (PHY) performance of STMicroelectronics ST64UWB chip family using LitePoint's next-generation ultra-wideband (UWB) test system, IQgig-UWB+. The collabo
4 min read
Semtech LR2022 and LR2012 transceivers now in production for LoRa Plus family
Semtech has expanded its LoRa Plus family of chips with two new transceivers, the LR2022 and LR2012, both now available in production. Together with the previously released LR2021, this brings the LoRa Plus portfolio to three production-ready transceivers, c
4 min read
Universal Display Corporation Unveils OLEDX, a New Technology Platform for OLED Efficiency and Performance
Universal Display Corporation (UDC) has introduced OLEDX, a new device architecture designed to improve how light is extracted and used within an OLED display, while giving display makers more control over how that light reaches the viewer. UDC unveiled the
5 min read
JCET achieves 79.4% YoY growth in H1 2026 net profit, expands advanced packaging
JCET Group, a provider of integrated circuit back-end manufacturing and testing services, reported its financial results for the first half of 2026. Revenue for the six-month period reached RMB 19.53 billion, up 5.0% year over year and a record for any first-half period in the company's history.
5 min read
TDK Expands SensEI Edge Intelligence Portfolio with edgeRX Pro Sensor Module
TDK Corporation has launched the TDK SensEI edgeRX Pro, a new high-performance sensor node that expands the company's edgeRX predictive maintenance platform. The edgeRX Pro combines vibration, acoustic, magnetic, temperature, and rotational motion sen
3 min read
Delta showcases dual-arm robot platform and AI-enhanced digital twins at Automation Taipei 2026
Delta Electronics is partici
7 min read
Manz Asia launches 310/510/700mm ECD and wet process platforms for panel-level packaging
Manz Asia, a provider of semiconductor advanced packaging equipment and process solutions, has developed production-ready electrochemical deposition (ECD) platforms supporting three panel formats: 310mm, 510mm, and 700mm. ECD is a manufacturing process that deposits metal layers onto a surface us
6 min read
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