Component Engineering

Qualcomm Finalizes Deal to Acquire AI Software Company Modular
AI

Qualcomm Finalizes Deal to Acquire AI Software Company Modular

Qualcomm has completed its acquisition of Modular, a company known for AI-native software infrastructure. Modular's platform gives developers a single way to optimize and deploy generative and agentic AI workloads across heterogeneous computing systems, meaning setups that combine different typ

3 min read
Kioxia Unveils UFS 5.0 Flash Memory to Speed Up On-Device AI
Memory

Kioxia Unveils UFS 5.0 Flash Memory to Speed Up On-Device AI

Kioxia America has introduced a new line of UFS 5.0 embedded flash memory, aimed at giving AI-enabled mobile and edge devices the storage speed, efficiency, and capacity needed to run increasingly demanding AI workloads locally. The company plans to demonstrate the technology next week at the FMS

3 min read
Texas Instruments India WiSH Program Records 33% Rise in Registrations for Semiconductor Careers
India Semiconductor

Texas Instruments India WiSH Program Records 33% Rise in Registrations for Semiconductor Careers

Texas Instruments (TI) India has concluded the fifth edition of its Women in Semiconductors and Hardware (WiSH) program, an initiative focused on women engineering students in semiconductors, hardware,

3 min read
India Revamps Customs Duty Structure to Accelerate Electronics Manufacturing
EMS Equipment

India Revamps Customs Duty Structure to Accelerate Electronics Manufacturing

The Indian Ministry of Finance has moved to lower input costs for domestic electronics and battery manufacturing, issuing three customs notifications  Nos. 25, 26, and 27 of 2026-Customs  on July 8, 2026. Together, the notifications exempt or reduce Basic Customs Duty (BCD) on select co

6 min read
d-Matrix's Corsair AI Inference Platform Reaches Full Production
AI

d-Matrix's Corsair AI Inference Platform Reaches Full Production

8 min read
RFMW Names Mark Perhacs Vice President of Sales
RF

RFMW Names Mark Perhacs Vice President of Sales

RFMW, a Division of Exponential Technology Group, Inc. and a premier distributor of RF, microwave, and power components, has announced the promotion of Mark Perhacs to Vice President of Sales 

3 min read
Vishay Launches 40V TrenchFET Gen IV MOSFETs Designed to Cut Noise in Motor Control Applications
Analog

Vishay Launches 40V TrenchFET Gen IV MOSFETs Designed to Cut Noise in Motor Control Applications

4 min read
Lantronix Acquires Vecima Networks Industrial IoT Business and Nero Global Tracking SaaS Platform
Component Engg

Lantronix Acquires Vecima Networks Industrial IoT Business and Nero Global Tracking SaaS Platform

Lantronix  has announced an agreement to acquire the assets of Vecima Networks industrial IoT business, including its Nero Global Tracking software-as-a-service platform. The transaction is expected to close in the near term, subject to customary closing conditions. The acquisition ad

5 min read
Sirin Software Named Authorized Design House in Alif Semiconductor Partner Ecosystem
Processors

Sirin Software Named Authorized Design House in Alif Semiconductor Partner Ecosystem

Sirin Software, an embedded software and IoT engineering services provider, has announced that it has officially joined the Alif Semiconductor partner ecosystem as an authorized Design House. The collaboration brings together Alif's

2 min read
Longsys Hits One Million Units in Monthly mSSD Production, Boosting Edge AI Storage Rollout
AI

Longsys Hits One Million Units in Monthly mSSD Production, Boosting Edge AI Storage Rollout

5 min read
North American EMS Book-to-Bill Ratio Reaches 1.36 in May 2026 Amid Rising Shipments
Component Engg

North American EMS Book-to-Bill Ratio Reaches 1.36 in May 2026 Amid Rising Shipments

The Global Electronics Association has released the May 2026 results from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio for the period stands at 1.36. Total North American EMS shipments in May 2026 increased 5.2% compared to May 202

3 min read
Bourns Introduces CDDFN2-T3V3SC and CDDFN2-T5V0SC TVS Diodes in DFN-2 (0402) Package
Component Engg

Bourns Introduces CDDFN2-T3V3SC and CDDFN2-T5V0SC TVS Diodes in DFN-2 (0402) Package

Bourns has announced the Model CDDFN2-T3V3SC and CDDFN2-T5V0SC bidirectional Surface-Mount Transient Voltage Suppressor (TVS) Diodes. The devices are designed for ESD, EFT, and surge protection in space-constrained designs using a DFN-2 (0402) footprint. The CDDFN2-T3V3SC operates at a wor

3 min read
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