Component Engineering
Cadence Launches OrCAD Xplore Platform for Electronics Design and Component Procurement
Cadence Design Systems, Inc. has introduced the Cadence OrCAD Xplore Design Platform, a connected design environment built on OrCAD X Capture for individual engineers and small design teams. It brings component research, trusted content, supply-chain insight and procu
3 min read
Texas Instruments Marks 70 Years in Europe With Partnerships Across Robotics, Automotive and AI Infrastructure
Texas Instruments Incorporated (TI) is marking 70 years of operations in Europe, with partnerships supporting next-generation systems in robotics, vehicles, AI data centers and outdoor products. The anniversary coincides with TI's participation at electronica 2026, No
3 min read
Marvell Earns LEAP Award for 1.6T Optical DSP Platform Portfolio
Marvell has received Design World's 2026 LEAP (Leadership in Engineering Achievement) Award in the connectivity category for its 1.6T optical DSP platform portfolio, which spans Ara T, Ara X, Aquila M and Petra. Marvell says Ara T i
2 min read
STMicroelectronics Launches STM32G5 MCUs for AI Datacenter Power and Robotics
STMicroelectronics has introduced the STM32G5 series of mixed-signal microcontrollers for digital power and motor control in AI datacenters, robotics, and other applications. Built around an Arm Cortex-M33 core running at 280MHz, the MCUs deliver twice the compute per
4 min read
Murata Signs Three-Year Accenture Partnership for AI and Data in Manufacturing
Murata Manufacturing Co., Ltd. has signed a three-year strategic partnership with Accenture to accelerate manufacturing transformation through AI and data utilization. Murata will combine technologies, expertise and data accumulated
2 min read
Bourns Introduces Multifuse PPTC Resettable Fuses for Overcurrent Protection in 0402 Footprint
Bourns has announced the MF-ASMF Series Multifuse polymer positive temperature coefficient (PPTC) resettable fuses for overcurrent protection in portable electronics with limited PCB area. The series includes three models with hold-current ratings of 0.05 A, 0.08 A, and 0.10 A in a 0402 footprint
3 min read
GlobalFoundries Marks Dresden Expansion Milestone, Announces FDX Fusion for Physical AI
GlobalFoundries has announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips designed for demanding Physical AI applications and planned for development and manufacturing in Dresden. The announcement accompanied the topping-out of
3 min read
Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data
The Global Electronics Association has released IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2 e) Emissions for the Electronics Manufacturing Supply Chain, for collecting and reporting emissions data used in product carb
3 min read
MISUMI India Deploys Generative AI Chatbot for 24/7 E-Commerce Support
MISUMI INDIA Pvt. Ltd., a subsidiary of MISUMI Group Inc., fully deployed a generative AI-powered chatbot for customer inquiries on the MISUMI e-Commerce site in September 2026. The service is available free of charge and provides two core functions: technical support for confirming product speci
4 min read
SINTRONES to Showcase Edge AI Computing Platforms for Semiconductor Inspection at VISION 2026
SINTRONES Technology, a provider of rugged industrial and edge AI computing solutions, will showcase edge AI computing platforms for machine vision, automated optical inspection (AOI), and semiconductor inspection at VISION 2026, held at October 6-8 at Messe Stu
3 min read
The Sourcing Puzzle: Can India's Electronics Manufacturers Build Local Supply Chains Fast Enough?
Behind the polished booths at BIEC, a more practical conversation ran through electronica India and productronica India 2026 where, exactly, are Indian electronics manufacturers supposed to source their components and sub-assemblies from, and how much of that supply chain is genuinely local
7 min read
Cadence and TSMC Collaborate on Certified Tools and Industry-Leading, Silicon-Proven UALink IP on Advanced Processes
Cadence has announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. The company has achieved tool certification for TSMC's advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced
5 min read
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