Advanced Semiconductor
NHanced Semiconductors and University of Florida to Present on Advanced Packaging for Photonics at SMTAI 2026
The upcoming SMTA International Conference will feature a paper titled "Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration" presented by Dr. Charles Woychik, vice president at NHanced Semiconductors, and Dr. Navid Asadizanjani
5 min read
Velaura AI Raises $110 Million Series A to Advance Ultra-Low-Power AI Compute Infrastructure
Velaura AI, a company developing ultra-low-power silicon and software for AI compute infrastructure, has raised $110 million in Series A funding, bringing its total valuation above $1 billion. The company says the round reflects investor confidence in its establishe
7 min read
VIGOR and Celanese Sign Strategic Partnership to Develop Lightweight Plastic Joints for Humanoid Robots
Celanese Corporation, a specialty materials and chemical company known for high-performance engineering plastics, and VIGOR Precision, a manufacturer of precision plastic gears and components, have signed a strategic partnership agreement aimed at developing and com
5 min read
Lam Research and NY Creates Partner to Train University Students for the Semiconductor Workforce
Lam Research and NY Creates have announced a collaboration aimed at training roughly 3,500 students in semiconductor process integration over the next five years. NY Creates is a New York-based nonprofit that owns and operates the Albany NanoTech Complex, described
5 min read
Seoul Semiconductor wins permanent injunction in India, following U.S. and Europe victories
Seoul Semiconductor and its affiliate Seoul Viosys, both South Korean opto-semiconductor technology companies, have secured a permanent injunction in India blocking infringement of Seoul's opto-semiconductor patents, adding to similar injunctions the companies previ
5 min read
Littelfuse Marks Five Years of Power Electronics Research by Dr. Martin Schulz
Littelfuse is recognizing five consecutive years of original research presented by Dr. Martin Schulz, its global principal application engineer, at PCIM, a leading power electronics conference. Schulz's work has repeatedly pushed back on long-standing assumptions in power semiconductor design,
4 min read
Vishay Introduces TSOP15300 Series IR Receivers Supporting All Major Remote Control Codes
Vishay Intertechnology has introduced a new series of infrared (IR) receiver modules, the TSOP15300 series, designed to work as a single-component universal remote control solution. Unlike standard IR receivers, which are typically tuned to a single frequency and can only recognize the specific
3 min read
Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics
Micross Components, a provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, and industrial applications, has agreed to acquire AEMtec, a Berlin-based company specializing in complex micro- and optoelectronic modules, advanced packaging, and t
4 min read
Nikon's Litho Booster 1000 Improves Overlay Accuracy in 3D Chip Manufacturing
Nikon will release the Litho Booster 1000, a new alignment station, in January 2027, offering roughly 35% better measurement accuracy and about 10% higher productivity compared to its predecessor. The system works by scanning the entire surface of a wafer before it goes through exposure, the step
4 min read
Dymax Introduces 9310 Adhesive for Reinforcing PCB Components
Dymax, a manufacturer of light-curing materials and equipment, has launched a new adhesive called 9310, designed to reinforce small, closely spaced, leadless components on printed circuit boards, the kind of tiny surface-mount parts increasingly common in advanced electronics and AI hardware.
3 min read
Qualcomm and Samsung Expand Partnership as Snapdragon Powers New Galaxy Devices Across Phones, Watches, and Smart Glasses
Qualcomm and Samsung are deepening their long-running partnership, with Qualcomm's Snapdragon chips now powering Samsung's latest lineup across smartphones, wearables, and intelligent eyewear. Announced at Samsung Unpacked, the Snapdragon 8 Elite Gen 5 Mobile Platform for Galaxy, Snapdragon Wear
4 min read
Cadence and NVIDIA Build Industry's First Silicon-to-System Agentic AI Engineering Platform
For decades, the semiconductor industry has dealt with rising design complexity in the same way: adding more engineers, more computing power, and more time. That worked when complexity grew gradually, but it no longer does. Design teams that once numbered in the dozens now run into the thousands,
6 min read
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