SCREEN and IBM Collaborate on High NA EUV Lithography Cleaning Process Development

SCREEN Semiconductor Solutions Co., Ltd. and IBM have entered into an agreement to develop cleaning processes for next-generation EUV lithography, focusing on High NA (High Numerical Aperture) EUV technology. This collaboration extends a partnership spanning over a decade, previously centered on cleaning processes for nanosheet device technology.

The agreement addresses the increasing importance of EUV lithography in advanced semiconductor manufacturing, driven by demand for miniaturization beyond the 2nm node. High NA EUV is critical for these processes, where even minor particles or scratches on wafers can impair patterning performance, making advanced cleaning technologies essential.

The collaboration leverages IBM’s expertise in semiconductor process integration and SCREEN’s wafer cleaning technology to develop solutions for High NA EUV. Mukesh Khare, GM of IBM Semiconductors and VP of Hybrid Cloud, emphasized the role of High NA EUV in enabling smaller, more powerful semiconductors for AI applications. Akihiko Okamoto, President of SCREEN Semiconductor Solutions, highlighted the goal of delivering robust cleaning solutions to support sub-2nm manufacturing.

Through this joint effort, SCREEN and IBM aim to accelerate the development of cleaning technologies and provide solutions that enhance value for semiconductor device manufacturers.