JNTC Launches TGV Glass Substrate for Advanced Semiconductor Packaging

South Korea based JNTC introduced its Through-Glass-Via (TGV) glass substrate at a product launch event on June 30 at the Korea Exchange Conference Hall, attended by over 200 journalists and investors. The event, themed "Carving Semiconductors into Glass, the Dream Material," highlighted the substrate’s role in addressing limitations of plastic-based substrates.

The TGV glass substrate, designed for AI and high-performance computing, provides enhanced flatness and thermal stability to minimize warpage and heat during high-speed processing. JNTC completed its domestic production line in June, with test runs scheduled for July and full-scale manufacturing set to begin in August. The company developed most of its core production equipment in-house, reducing initial investment costs to approximately one-fifth of the industry average.

The substrates support various sizes and thicknesses, featuring high-precision via holes with no microcracks and void-free metalizing. JNTC’s proprietary etching, metalizing, and processing technologies achieve yields above 90% with minimal defects. Additional features, including alignment marks and cavities, have been verified for performance with global semiconductor companies.

CEO Andrew Cho stated that TGV glass substrates are key to next-generation semiconductor packaging. JNTC is collaborating with 16 global pa...