Siemens announced significant advancements in its ongoing collaboration with Intel Foundry. This partnership has resulted in multiple product certifications, updated foundry reference flows, and enhanced technology enablement leveraging Intel Foundry’s leading-edge technologies for next-generation integrated circuits and advanced packaging.
Siemens’ industry-leading Calibre nmPlatform tool has achieved certification for the latest Intel 18A production Process Design Kit . Intel 18A represents a major technological leap, featuring innovative RibbonFET Gate-all-around transistors and the industry’s first PowerVia backside power delivery. This certification allows mutual customers to continue leveraging the Calibre nmPlatform tool as their industry-standard sign-off solution with Intel Foundry's most advanced manufacturing process, accelerating time-to-market for next-generation chip designs.
Additionally, Siemens’ Solido SPICE and Analog FastSPICE software tools have been certified for the Intel 18A production PDK. These tools are key elements of Siemens Solido Simulation Suite, an advanced portfolio of AI-accelerated simulators for intelligent IC design and verification. The Intel 18A process node is also now enabled with Open Model Interface, supported by Siemens’ Solido Simulation Suite.
Siemens’ Calibre nmPlatform and Analog FastSPICE software are now enabled through the Intel Foundry Custom Reference Flow , a comprehensive custom design methodology package. This enables mutual customers to access Siemens best-in-class simulation and sign-off flow for chiplets, extending to 3D IC designs.
The qualification of Siemens’ Calibre nmPlatform and Solido Simulation Suite for the Intel 18A-P process node is underway. Customers can request the latest Intel 18A-P PDK for early design work and IP development. Moreover, both solutions are part of the Intel 14A-E process definition and Design Technology Co-Optimization , with early runsets already available. Intel 14A-E is expected to deliver higher density and performance per watt compared to the Intel 18A process node.
“At Intel Foundry, we're building strategic alliances with industry leaders like Siemens to deliver best-in-class design solutions to our customers,” said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. “These powerful verification and design tools are rigorously tested to harness the full capabilities of our advanced process nodes. By integrating Siemens' expertise with our technology, we're not only streamlining design workflows but also creating pathways for our mutual customers to bring groundbreaking innovations to market faster and more efficiently.”
Siemens also announced the certification of a comprehensive reference workflow for Intel Foundry’s Embedded Multi-die Interconnect Bridge-T with Through Silicon Via technology. The workflow is driven by Siemens’ Innovator3D IC solution, providing a consolidated cockpit for constructing a digital twin of the complete semiconductor package assembly. This workflow supports detailed implementations and thermal analysis of the die, EMIB-T and package substrate, signal and power integrity analysis, and Package Assembly Design Kit driven assembly verification.
The collaboration has also established a prototype workflow for Embedded Multi-die Interconnect Bridge technology using Siemens’ Aprisa software. Siemens Aprisa Automatic Place and Route technology was used to implement the Power/Ground grid and bump routing of the Silicon EMIB die.
Finally, Siemens has joined the Intel Foundry Accelerator Chiplet Alliance, the newest Accelerator Alliance program aimed at defining and driving chiplet design infrastructure, interoperability, and security requirements essential for delivering today’s complex systems in the aerospace, defense, and commercial markets.
“As an industry leader in advanced packaging technologies, Siemens EDA is pleased to serve as an original member of the new Intel Foundry Accelerator Chiplet Alliance,” said Juan C. Rey, Senior Vice President and General Manager, Calibre product line, Siemens Digital Industries Software. “This alliance not only marks a significant milestone in our collaboration but also brings unparalleled value to our joint customers. Together, we are poised to accelerate development cycles and push the boundaries of semiconductor technology, creating groundbreaking solutions that meet the growing demands of the industry.”
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