EEHerald Newsletter for the 4th Week of Apr 2025
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ⓘ AI NARRATED
High Density Packaging User Group and Global Electronics Association Release IPC-TM-650-2.2.23 Copper Profile Test Method
High Density Packaging User Group (HDP) and Global Electronics Association have released IPC-TM-650-2.2.23, a new copper profile test method based…
SK hynix Presents CXL Memory-Centric AI Rack Systems at OCP Global Summit 2026
SK hynix presented next-generation memory solutions for AI infrastructure at OCP Global…

TrendForce Forecasts AR Glasses Shipments to Reach 1.31 Million Units in 2026
TrendForce forecasts global AR glasses shipments will reach 1.31 million units in…


























