Compound Semiconductor

ROHM introduces high power density SiC power modules for EV automotive chargers

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ROHM has developed new 4-in-1 and 6-in-1 SiC molded power modules in the HSDIP20 package, optimized for PFC and LLC converters in onboard chargers (OBCs) for electric vehicles (xEVs). The lineup includes six 750V models (BSTxxx1P4K01) and seven 1200V models (BSTxxx2P4K01). These modules integrate essential power conversion circuits into a compact package, reducing design workload and enabling smaller power conversion circuits in OBCs and other applications.

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The HSDIP20 package uses an insulating substrate with strong heat dissipation, minimizing chip temperature rise during high-power operation. Compared to a typical OBC PFC circuit with six discrete SiC MOSFETs, the 6-in-1 module operates approximately 38°C cooler at 25W, offering over three times the power density of top-side cooled discretes and 1.4 times that of similar DIP-type modules. This allows a 52% reduction in mounting area, supporting miniaturization in high-output OBCs and DC-DC converters.

The modules address the growing demand for compact, high-output solutions driven by higher battery voltages in electric vehicles, contributing to smaller and lighter powertrains. Beyond automotive OBCs and electric compressors, the HSDIP20 supports industrial applications like EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, and power conditioners.

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ROHM plans to further develop SiC modules and automotive SiC IPMs for enhanced efficiency, reliability, and miniaturization.
Sales Information
Pricing: $100/unit (samples, excluding tax)
Availability: OEM quantities (April 2025)


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