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Nexalus and Intel launch 95% heat capturing liquid cooling solutions for edge computing

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Nexalus and Intel have partnered to develop thermal management solutions for high-performance edge computing and data centers, focusing on efficiency and sustainability. Announced in March 2025, the solutions were showcased at Mobile World Congress.
Nexalus’ IP66-certified edge server uses microjet cooling technology, directing liquid over CPUs and GPUs to maintain optimal temperatures. The system captures over 95% of generated heat, converting it into hot water for applications like home heating.
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The collaboration, spanning two years, involved research, prototyping, and testing to ensure durability in extreme conditions. Intel’s insights into heat-generating cores helped Nexalus optimize cooling designs, including the Intel Flex Single-Slot GPU Block and NIC cooling solutions. These enable overclocking of Intel Xeon CPUs without performance issues.
The solutions aim to enhance efficiency and sustainability in computing systems, with ongoing efforts to advance thermal management for edge and data center markets.
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“We are working with Intel to deliver cooling solutions that enhance performance and sustainability,” said Dr. Cathal Wilson, COO of Nexalus. “Our collaboration with Nexalus addresses thermal management and environmental challenges at the network edge,” said Dirk Blevins, Senior Director, Intel.
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Srinivasa Reddy N

Editor, Electronics Engineering Herald


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