Component Engineering

Global Electronics Association Names Hisashi Kitajima Japan Representative Effective January 2026
Processors

Global Electronics Association Names Hisashi Kitajima Japan Representative Effective January 2026

The Global Electronics Association announced the appointment of Hisashi Kitajima as its Japan Representative, effective January 1, 2026. In this role, Kitajima will support the Association’s activities in Japan, with a focus on stakeholder engagement, ecosystem development, and strat

2 min read
Oversonic Robotics and STMicroelectronics Agree on Humanoid Robots for Semiconductor Plants Ahead of CES Demo
Robotics

Oversonic Robotics and STMicroelectronics Agree on Humanoid Robots for Semiconductor Plants Ahead of CES Demo

Oversonic Robotics, an Italian company specialized in cognitive humanoid robotics, signed an agreement with STMicroelectronics, a global semiconductor company, for the supply of custom RoBee cognitive humanoid robots to be introduced into production and logistics processes at several ST plants wo

3 min read
DENSO and MediaTek Partner on Automotive SoC for Autonomous Driving and Connectivity
Component Engg

DENSO and MediaTek Partner on Automotive SoC for Autonomous Driving and Connectivity

DENSO CORPORATION signed a joint development agreement with MediaTek Inc to develop next-generation automotive system-on-chips (SoCs). Automotive systems are becoming increasingly intelligent, advancing autonomous driving and vehicle connectivity. Automotive SoCs serve as high-performance

2 min read
Texas Instruments Starts Production at New 300mm Semiconductor Fab in Sherman, Texas
Semiconductor Foundry

Texas Instruments Starts Production at New 300mm Semiconductor Fab in Sherman, Texas

Texas Instruments announced the start of production at its newest 300mm semiconductor manufacturing facility, designated SM1, in Sherman, Texas. The facility began operations three and a half years after groundbreaking. A ribbon-cutting ceremony marked the opening, attended by TI President

2 min read
MaxLinear and Samsung Release White Paper on Peer-to-Peer Connectivity in Wi-Fi 8 
Component Engg

MaxLinear and Samsung Release White Paper on Peer-to-Peer Connectivity in Wi-Fi 8 

Iñaki Val, Sigurd Schelstraete, and Marcos Martinez from MaxLinear’s Standards Engineering team, along with Rubayet Shafin, Yue Qi, Peshal Nayak, Vishnu V. Ratnam, Bilal Sadiq, and Boon Loong Ng from Samsung Research America, have co-authored a white paper titled “Multi-Device

2 min read
onsemi and GlobalFoundries Collaborate on 650V GaN Power Devices for AI Data Centers and Electric Vehicles
Compound Semiconductor

onsemi and GlobalFoundries Collaborate on 650V GaN Power Devices for AI Data Centers and Electric Vehicles

onsemi announced a collaboration agreement with GlobalFoundries to develop and manufacture gallium nitride (GaN) power devices using GlobalFoundries' 200mm eMode GaN-on-silicon process, starting with 650V devices. The collaboration combines GlobalFoundries' GaN process technology with onse

3 min read
Toshiba Adopts Siemens EDA Tools for 3D IC, AI Simulation, and Power Optimization in Analog and Power Semiconductors
Software

Toshiba Adopts Siemens EDA Tools for 3D IC, AI Simulation, and Power Optimization in Analog and Power Semiconductors

Siemens announced that Toshiba Electronic Devices & Storage Corporation has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor development capabilities. Toshiba has introduced Siemens’ EDA tools and begun tr

4 min read
Siemens and GlobalFoundries Team-up for AI-based Capabilities in Semiconductor Manufacturing
Component Engg

Siemens and GlobalFoundries Team-up for AI-based Capabilities in Semiconductor Manufacturing

Siemens and GlobalFoundries have signed a memorandum of understanding for a strategic collaboration using AI-based capabilities in semiconductor manufacturing and advanced industries. The agreement addresses automation technologies for semiconductor fabrication, electrification, digital so

2 min read
Eaton $50M Investment in Virginia AI Data Center Facility
Component Engg

Eaton $50M Investment in Virginia AI Data Center Facility

 Eaton announced a new manufacturing campus in Henrico County, Virginia, for power distribution technologies including static transfer switches, power distribution units, and remote power panels. The investment exceeds $50 million. The new 350,000-square-foot facility will more than double E

2 min read
Qualcomm and CP Plus Collaborate on AI Video Security Solutions for India
Component Engg

Qualcomm and CP Plus Collaborate on AI Video Security Solutions for India

Qualcomm and CP Plus Collaborate on AI Video Security Solutions for India CP PLUS and Qualcomm  announced a collaboration to introduce AI-enabled video security solutions using Qualcomm Dragonwing processors and the Qualcomm Insight Platform integrated with CP PLUS products. Th

3 min read
Lantronix Edge AI Selected for Trillium Engineering Drone Imaging Systems
Component Engg

Lantronix Edge AI Selected for Trillium Engineering Drone Imaging Systems

Lantronix announced that its NDAA/TAA-compliant Edge AI solution and engineering services have been selected by Trillium Engineering for gimbaled imaging systems in Uncrewed Aircraft Systems (UAS). Trillium Engineering provides gimbaled imaging systems. Applications include intelligence, s

2 min read
Littelfuse Completes Basler Electric Acquisition
Component Engg

Littelfuse Completes Basler Electric Acquisition

Littelfuse, announced the completion of its acquisition of Basler Electric Company. Basler Electric designs and manufactures electrical control and protection technologies for industrial markets. Its solutions regulate and protect power equipment. Basler will operate as part of the Li

2 min read
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