Siemens announced that Toshiba Electronic Devices & Storage Corporation has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor development capabilities.
Toshiba has introduced Siemens’ EDA tools and begun trials to advance semiconductor design sophistication, accelerate development speed, improve design accuracy in analog-digital co-design, streamline verification processes, and optimize development workflows.
Yoshinari Ojima, Senior Manager of Toshiba’s Design Engineering Development Department, IC Development Center, stated: “Toshiba has introduced Siemens’ EDA tools to advance semiconductor design sophistication and accelerate development speed and we have begun trials to strengthen our design environment using these tools, aiming to improve design accuracy in analog–digital co-design, streamline verification processes, and improving development workflows. Through these efforts, we will further reinforce the quality and reliability we have already established, not only in power devices and analog semiconductors but also in digital and mixed-signal semiconductors. Building on our long-cultivated proprietary technological expertise, Toshiba will drive innovative semiconductor development that meets market needs through collaboration with these EDA tools.”
Yukio Tsuchida, vice president for Japan, Siemens EDA, Siemens Digital Industries Software, stated: “We are delighted that Toshiba has introduced a broad range of our EDA software for its power device and analog semiconductor development design flows. We look forward to supporting Toshiba on its journey to enhanced design excellence and to help it to deliver transformational change in its design processes with the power, precision and performance of Siemens’ EDA technology.”
Toshiba’s deployment includes:
Advanced thermal design and analysis for 3D IC architectures
Toshiba has introduced Siemens’ technologies to address thermal challenges in 3D IC architectures. The company is utilizing the Innovator3D IC solution suite for creation, simulation, and management of heterogeneously integrated 2.5D/3D IC designs, along with Calibre 3DThermal software to establish an integrated chip-package thermal co-design flow from early feasibility analysis through final sign-off.
Power optimization, integrity and reliability enhancement
Toshiba plans to use Siemens’ Insight Analyzer and mPower Analog EMIR software for leakage current optimization, Electromigration and IR-drop (EMIR) verification, and power efficiency validation. Toshiba will also use Siemens’ PowerPro Designer software earlier in the flow to analyze and optimize RTL for power consumption.
Next-generation analog simulation acceleration
Toshiba is leveraging Siemens’ Solido Simulation Suite to improve efficiency of analog and mixed-signal design verification and simulation accuracy. Toshiba is also utilizing the AI capabilities of Siemens’ Solido Design Environment software for variation simulations and statistical analyses to strengthen design robustness.
For more details on the technologies, visit https://eda.sw.siemens.com/en-US/ic/ic-design/.
