Siemens and GlobalFoundries Team-up for AI-based Capabilities in Semiconductor Manufacturing

Siemens and GlobalFoundries have signed a memorandum of understanding for a strategic collaboration using AI-based capabilities in semiconductor manufacturing and advanced industries.

The agreement addresses automation technologies for semiconductor fabrication, electrification, digital solutions, and software covering chip development to product lifecycle management.

The collaboration involves deployment of AI-enabled software, sensors, and real-time control systems in fab automation. Centralized automation and predictive maintenance are planned to increase equipment availability and operational efficiency in chip production. Capabilities will be extended to other advanced industries. The companies intend to develop and deploy new solutions in their own operations.

Siemens contributes industrial, energy and building automation, and digitalization technologies, including software for chip design and manufacturing, fab automation, and product lifecycle management.

GlobalFoundries, together with MIPS, contributes process technology and design capabilities. GlobalFoundries operates manufacturing facilities in the USA, Asia, and Europe, including a site in Dresden with around 3,000 employees.

Cedrik Neike, Member of the Managing Board of Siemens AG and CEO Digital Industries, stated that chips are critical for applications like robotics or conn...