Texas Instruments announced the start of production at its newest 300mm semiconductor manufacturing facility, designated SM1, in Sherman, Texas. The facility began operations three and a half years after groundbreaking.
A ribbon-cutting ceremony marked the opening, attended by TI President and CEO Haviv Ilan, Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and other company leaders.
The fab will ramp production according to customer demand and is expected to produce tens of millions of chips daily. These chips, including analog and embedded processing semiconductors, are used in smartphones, automotive systems, medical devices, industrial robots, smart home appliances, and data centers.
TI operates 15 manufacturing sites worldwide and controls its own manufacturing operations, process technology, and packaging.
Haviv Ilan stated that the start of production at the Sherman fab demonstrates TI's ownership of the manufacturing process for foundational semiconductors used in electronic systems. He noted TI's position as the largest analog and embedded processing semiconductor manufacturer in the U.S., providing 300mm capacity at scale.
The Sherman site includes plans for up to four connected wafer fabs, to be constructed and equipped based on market demand. The site is projected to support up to 3,000 direct jobs and thousands of additional jobs in related industries.
The Sherman investment forms part of TI's plan to invest more than $60 billion across seven semiconductor fabs in Texas and Utah.
