Component Engineering
Murata SCH16T-K20 6-Axis IMU Released for Robotics and Drones
Murata has introduced the SCH16T-K20 as an addition to its SCH16T series of inertial measurement units. The SCH16T-K20 is a 6-axis IMU targeted at industrial, prosumer, and consumer markets, including OEMs in robotics, drones, and camera systems, as well as IMU module manufacturers and system int
2 min read
S2C MachineWare and Andes Announces RISC-V Co-Emulation Solution 2025
S2C, MachineWare, and Andes Technology announced a co-emulation solution for RISC-V based chip design. The solution combines MachineWare’s SIM-V virtual platform, S2C’s Genesis Architect and Prodigy FPGA Prototyping Systems, and Andes’ AX46MPV RISC-V CPU core for hardware and so
3 min read
JEDEC SPHBM4 Standard for HBM4 Throughput on Organic Substrates
JEDEC Solid State Technology Association announced it is nearing completion of the Standard Package High Bandwidth Memory (SPHBM4) standard. SPHBM4 devices use the same DRAM dies as HBM4 devices on a new interface base die mountable on standard organic substrates. HBM4 is typically mounted
2 min read
TDK Expands Hybrid Polymer Capacitors with 30g Vibration-Resistant Design
TDK has expanded its B409x series of SMD hybrid polymer aluminum electrolytic capacitors with a vibration-resistant design capable of withstanding mechanical vibrations up to 30 g (MIL-STD-202, Method 204). The design incorporates four posts extending from the base plate to stabilize the co
2 min read
Renesas R-Car Gen 5 X5H SoC Samples Available for SDV Multi-Domain Applications
Renesas Electronics is expanding its software-defined vehicle offerings with the fifth-generation R-Car family. The R-Car X5H is a multi-domain automotive system-on-chip manufactured with 3nm process technology. It supports simultaneous operation of functions across advanced driver assistan
3 min read
Intel Announces Senior Leadership Changes in Government Affairs, Marketing, Communications, and Advanced Technology
Intel Corporation announced senior leadership appointments in government affairs, marketing and communications, and advanced technology strategy. Robin Colwell has joined Intel as senior vice president of government affairs. She will lead global engagement with policymakers, regulators, an
2 min read
Starlink Reaches 8 Million Users as STMicroelectronics and SpaceX Mark 10-Year Partnership
STMicroelectronics and SpaceX announced a decade-long collaboration on December 15, 2025, from Starbase, Texas, and Geneva, Switzerland. The partnership involves co-design of custom-made components for satellite communication, contributing to Starlink's broadband connectivity via low Earth orbit
2 min read
Diodes Launches Automotive 5.5V 4A I²C-Programmable Synchronous Buck Converter AP61406Q for ADAS, Infotainment and Telematics POL
Diodes has introduced the AP61406Q, an automotive-compliant 5.5 V, 4 A low-IQ synchronous buck converter with I²C interface. The AP61406Q is designed for automotive point-of-load applications including infotainment systems, instrument clusters, telematics, and advanced driver assistan
2 min read
onsemi Releases EliteSiC MOSFETs in T2PAK Top-Cool Package for EV, Solar and Energy Storage Applications
onsemi has launched its EliteSiC MOSFET portfolio in the T2PAK top-cool package for automotive and industrial high-power applications. The initial devices are 650 V and 950 V EliteSiC MOSFETs with Rds(on) values ranging from 12 mΩ to 60 mΩ. The T2PAK package routes heat from th
2 min read
TDK Expands BCL3520FT Automotive Power Inductor Series with 0.47 µH 5 mΩ 10 A Model Rated to 155 °C
TDK has added the BCL3520FT-R47M-D to its BCL3520FT series of small power inductors for automotive power circuits. Mass production of the series started in December 2025. The new inductor measures 3.3 × 3.5 × 2.0 mm and is intended for power supply circuits in automotive ECUs,
2 min read
Navitas Partners with Cyient Semiconductors to Build GaN Ecosystem in India for AI Data Centers, EV, and Grid Applications
Navitas and Cyient Semiconductors Form Strategic Partnership to Develop GaN Solutions for India’s AI, EV, and Industrial Markets Navitas Semiconductor and Cyient Semiconductors have entered a long-term strategic partnership to advance gallium nitride (GaN) technology adoption i
2 min read
Andes Technology Delivers AX46MPV RISC-V Vector Core to First Customer for TSMC Tape-Out in Cloud AI Acceleration
Andes has completed final database hand-off of its AX46MPV vector processor core to its first licensee for tape-out at TSMC. Additional customer tape-outs are scheduled for Q4 2025 and throughout 2026. The AX46MPV is the third-generation vector core in Andes’ lineup targeting cloud A
2 min read
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