JEDEC SPHBM4 Standard for HBM4 Throughput on Organic Substrates

JEDEC Solid State Technology Association announced it is nearing completion of the Standard Package High Bandwidth Memory (SPHBM4) standard.

SPHBM4 devices use the same DRAM dies as HBM4 devices on a new interface base die mountable on standard organic substrates. HBM4 is typically mounted on silicon substrates.

SPHBM4 provides the same aggregate data throughput as HBM4 using fewer pins through higher frequency operation. HBM4 has 2048 data signals. SPHBM4 will define 512 data signals with 4:1 serialization. This allows relaxed bump pitch for organic substrates.

SPHBM4 uses the same memory core layers as HBM4, providing identical memory capacity per stack. Organic substrate routing supports longer channel length from SoC to memory, potentially allowing more SPHBM stacks and higher total memory capacity.

Mian Quddus, Chairman of the JEDEC Board of Directors, stated that JEDEC members are shaping standards for next generation modules for use in AI data centers.

JEDEC standards are subject to change during and after development, including disapproval by the JEDEC Board of Directors.