Component Engineering
IDC Reports India Smartphone Shipments Flat at 152 Million Units in 2025, Decline Forecast for 2026
The International Data Corporation (IDC) reported that India's smartphone market recorded 152 million units shipped in 2025, a marginal year-over-year increase of 0.5%. Shipments started slowly in early 2025, rose in the second and third quarters, and fell 5% year-over-year to 34 million units in
5 min read
Infineon Supplies Semiconductors for BMW Neue Klasse Software-Defined Vehicle Architecture
Infineon Technologies AG announced its role in the electrical/electronic (E/E) architecture of BMW Group’s Neue Klasse platform. The Neue Klasse combines electrification, digitalization, and sustainability. Infineon provides components for central computing, high-speed connectivity, a
3 min read
Renesas Unveils 3nm TCAM Technology for Automotive SoCs at ISSCC 2026 with High Density and Low Power Features
Renesas Electronics Corporation has developed a configurable ternary content-addressable memory (TCAM) on a 3nm FinFET process. The technology was presented at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco. The TCAM co
3 min read
MoU was signed between the Global Electronics Association and the DGQA at IEMI 2026 held in Bengaluru
The Integrated Electronics Manufacturing & Interconnections (IEMI) 2026 conference concluded in Bengaluru on January 29–30, 2026, with key developments in India's electronics sector. Held at Hotel Taj Yeshwantpur, the two-day event was organized by the Global Electronics Associat
4 min read
ECS Summer School 2026: Applications Open for EU Undergraduate STEM Students in Microelectronics
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe in collaboration with AENEAS, EPoSS, and INSIDE, announced that applications are now open for the ECS Summer School. The programme will take place from August 23 to 28, 2026, at the University Residen
3 min read
TSMC Executive Aveek Sarkar Elected to Si2 Board of Directors
The Silicon Integration Initiative (Si2) has announced the election of Aveek Sarkar to its Board of Directors. Sarkar currently serves as Director of the Ecosystem and Alliance Management Division at TSMC, where he and his team are responsible for semiconductor design enablement through collabora
2 min read
Navitas Semiconductor Launches 5th-Generation GeneSiC SiC MOSFET Technology Platform
Navitas Semiconductor announced the launch of its 5th-generation GeneSiC technology platform. The platform introduces High Voltage SiC Trench-Assisted Planar (TAP) MOSFET technology for a 1200V line of MOSFETs. This complements the company's ultra-high voltage 2300V and 3300V technologies from th
3 min read
GigaDevice Signs Distribution Agreement with SEMITRON for DACH Region
China based GigaDevice, a semiconductor company focused on Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has signed a distribution agreement with SEMITRON, an electronic component distributor operating primarily in the DACH region (Germany, Austria, and Switzer
2 min read
JEDEC Awards 2026 Distinguished Executive Leadership to HPE CEO Antonio Neri
The JEDEC Board of Directors presented its 2026 Distinguished Executive Leadership Award to Antonio Neri, President and CEO of Hewlett Packard Enterprise (HPE), during a ceremony on February 3, 2026, at HPE’s office near Houston, Texas. The award is JEDEC’s highest honor and re
2 min read
VeriSilicon ISP8200-FS Series IP Gains ISO 26262 ASIL B Certification for Automotive ADAS
VeriSilicon announced on February 5, 2026, that its enhanced ISP8200-FS series Image Signal Processing (ISP) IP specifically the ISP8200-ES and ISP8200L-ES versions—has received ISO 26262 ASIL B functional safety certification from TÜV NORD. The certification applies to the enhan
2 min read
AMD Appoints Ariel Kelman as Chief Marketing Officer to Lead Global Marketing Strategy
AMD announced the appointment of Ariel Kelman as Senior Vice President and Chief Marketing Officer, effective immediately. In this role, Kelman will lead AMD’s global marketing organization, with responsibility for brand, communications, events, developer relations, and go-to-market s
2 min read
Avalanche Technology Announces VNX+ Storage Module with Space Grade MRAM for Military and LEO Applications
Avalanche Technology announced the introduction of its next-generation VNX+ storage module, designed for military and Low Earth Orbit (LEO) environments using the company’s Space Grade MRAM. The module is built with Avalanche’s high-density Space Grade MRAM and a Lattice Certus
3 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast
