News
Toshiba and BASiC Partner on SiC and IGBT Power Module Solutions for Automotive and Industrial Markets
Toshiba and BASiC Semiconductor signed a memorandum of understanding (MOU) on August 29, 2025 to establish a strategic partnership focused on power module products. The collaboration combines Toshiba’s silicon carbide (SiC) and insulated gate bipolar transistor (IGBT) technologies wit
2 min read
2Q25 Foundry Revenue Hits Record $41.7B, TSMC Dominates with 70% Market Share, TrendForce Reports
TrendForce reported that global foundry revenue reached a record $41.7 billion in 2Q25, reflecting a 14.6% quarter-on-quarter increase. The surge was driven by China’s consumer subsidy program, which prompted early stocking, alongside rising demand for new smartphones, notebooks, PCs, and s
3 min read
North American EMS Shipments Fall 4.1% in July 2025, Bookings Climb 7.9%, Says Global Electronics Association
Global Electronics Association released its July 2025 North American Electronics Manufacturing Services (EMS) Statistical Program findings, reporting a book-to-bill ratio of 1.23. North American EMS shipments in July 2025 decreased by 4.1% compared to July 2024 and by 5.1% compared to June 2025.
2 min read
Advanced Packaging Market to Hit $79.4B by 2030, Driven by AI and Telecom Growth
Yole Group’s new "Status of the Advanced Packaging Industry 2025" report revealed that the advanced packaging market reached $46 billion in 2024, a 19% year-on-year increase following a 2023 downturn. The market is projected to grow to $79.4 billion by 2030, with a 9.5% CAGR from 2024 to 20
3 min read
Thermal Imaging Market Surpasses $7B in 2024, Fueled by Chinese Growth and Defense Demand
On August 28, 2025, Yole Group released its "Thermal Imaging & Sensing 2025", detailing that the thermal imaging and sensing market reached over $7 billion in revenue in 2024. The report highlights the significant role of Chinese manufacturers, who produced 60% of global thermal image sensors
3 min read
CG Semiconductor Launches Advanced Chip Packaging Facility in Sanand, Gujarat, Strengthening India’s Tech Ecosystem
On August 28, 2025, CG Semiconductor inaugurated its G1 pilot line chip packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, marking a significant step in India’s semiconductor industry development. The event was attended by Union Minister of Electronics
4 min read
Japan's Semiconductor Dominance and Its Emerging Partnership with India
In the 1980s and 90s, Japan dominated the global semiconductor market, commanding nearly 50% of the share, leading in DRAM, memory chips, and automotive applications, with companies like Toshiba, Fujitsu, Hitachi, Mistsubishi, and NEC leading the charge. However, the rise of South Korean gi
6 min read
Hubbell Acquires DMC Power for $825M to Enhance Utility Solutions Portfolio
Hubbell agreed to acquire DMC Power, LLC, a provider of connectors and tooling for utility substation and transmission markets, for $825 million in cash, subject to adjustments. The transaction, expected to close by the end of 2025 pending regulatory approvals, will be financed with cash and debt
3 min read
North American PCB Industry Sees 20.7% Shipment Surge in July 2025, Book-to-Bill Ratio Holds at 1.00
Global Electronics Association released its July 2025 North American Printed Circuit Board (PCB) Statistical Program results, revealing significant growth in shipments and bookings. The book-to-bill ratio for July stood at 1.00, indicating a balance between orders and shipments. North Amer
3 min read
Cadence Bolsters SoC Design Portfolio with Acquisition of Arm Artisan Foundation IP in 2025
Cadence completed acquisition of the Arm Artisan foundation IP business. The acquired assets include standard cell libraries, memory compilers, and general-purpose I/Os (GPIOs) optimized for advanced process nodes at leading foundries. This acquisition expands Cadence’s design IP portfolio,
1 min read
Semiconductor Material Engineering Expert Dr. Omkaram Nalamasu Honored with 2026 ACS Award in Industrial Chemistry
Dr. Omkaram “Om” Nalamasu, Senior Vice President and Chief Technology Officer at Applied Materials, Inc., has been named the recipient of the 2026 ACS Award in Industrial Chemistry, sponsored by the ACS Division of Industrial and Engineering Chemistry. This prestigious award, presente
2 min read
Micro Ring Modulators: Powering Next-Gen Silicon Photonics inside AI Server Chips
To support the growing data interconnect speeds of AI GPUs and any such AI Server Processor chips, silicon photonics based optical interconnects using silicon wave guides and othe silicon based optical components taking center stage in advanced AI server chips. One of the important optical compon
11 min read
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