Advanced Packaging Market to Hit $79.4B by 2030, Driven by AI and Telecom Growth
Yole Group’s new "Status of the Advanced Packaging Industry 2025" report revealed that the advanced packaging market reached $46 billion in 2024, a 19% year-on-year increase following a 2023 downturn. The market is projected to grow to $79.4 billion by 2030, with a 9.5% CAGR from 2024 to 2030, driven by demand for AI and high-performance applications. The telecom and infrastructure segment is expected to grow fastest, with a 14.9% CAGR, fueled by AI accelerators, GPUs, and chiplet-based architectures. Mobile and consumer electronics accounted for approximately 70% of 2024 revenues, remaining the largest segment.
The 2024 ranking of advanced packaging players showed integrated device manufacturers (IDMs) leading, with Intel, Sony, Samsung, YMTC, and SK Hynix at the forefront, followed by outsourced semiconductor assembly and test (OSAT) providers and TSMC. Advanced packaging technologies, including CoWoS, SoIC, EMIB, I-Cube, and 3D stacking, are supporting increased system complexity for hyperscale infrastructure.
Investment activity has intensified:
- TSMC expanded CoWoS capacity by acquiring an Innolux facility in Taiwan and is scaling SoIC.
- ASE, Amkor, and Intel increased U.S. capacity, supported by CHIPS Act incentives, to meet demands from NVIDIA and Appl...