CG Semiconductor Launches Advanced Chip Packaging Facility in Sanand, Gujarat, Strengthening India’s Tech Ecosystem

On August 28, 2025, CG Semiconductor inaugurated its G1 pilot line chip packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, marking a significant step in India’s semiconductor industry development. The event was attended by Union Minister of Electronics and Information Technology Ashwini Vaishnaw and Gujarat Chief Minister Bhupendra Patel. The G1 facility, with a peak capacity of 0.5 million units per day, is equipped for end-to-end chip assembly, packaging, testing, and post-test services. It features high-yield equipment, a Manufacturing Execution System (MES) for Level 1 automation and traceability, and in-house labs for reliability and failure analysis. The facility is currently pursuing ISO 9001 and IATF 16949 certifications, with customer qualification runs across various packages set to begin post-inauguration. Commercial production is slated to start in 2026, as committed to the India Semiconductor Mission (ISM).

A second facility, G2, located 3 km from G1, is under construction and expected to be completed by the end of 2026. G2 will scale up to a capacity of 14.5 million units per day. Together, the two facilities are projected to create over 5,000 direct and indirect jobs in the coming years. CG Semi, backed by an investment of over ₹7,600 crore (~USD 870 million) over five years in collaboration with Renesas and S...