Component Engineering
Toshiba Launches 135°C-Rated S-VSON4T Photorelays for High-Temperature Automotive Semiconductor Testing
Toshiba Electronic Devices & Storage Corporation announced on February 25, 2026, the release of four voltage-driven photorelays: TLP3407SRB, TLP3412SRB, TLP3412SRHB, and TLP3412SRLB. The devices are housed in the small S-VSON4T package measuring 1.45 mm × 2.0 mm (typical), with a maximu
3 min read
Valeo Enters LexisNexis Top 100 Global Innovators 2026 for Patent Portfolio Strength
Valeo announced, its inclusion in the LexisNexis Intellectual Property Solutions Top 100 Global Innovators 2026 ranking. The annual list recognizes companies based on the power, geographic reach, and technical relevance of their patent portfolios. Valeo's entry highlights the influence of it
2 min read
Qualcomm and Siemens Demonstrate On-Premises Edge AI and Private 5G in Autonomous Factory Model at MWC Barcelona
Qualcomm Technologies, and Siemens AG presented a joint technology demonstration at Mobile World Congress Barcelona, integrating edge AI and private Industrial 5G connectivity into a Siemens autonomous production model. The showcase features a Siemens factory model with coordinated a
3 min read
Samji Electronics Adopts MaxLinear Sierra SoC for Next-Generation Macro Open RAN Radio Unit
MaxLinear, announced in Barcelona, Spain, that Samji Electronics has selected the Sierra single-chip radio system-on-chip (SoC) to power its SNOO2-44N28 Macro Open RAN Radio Unit (O-RU). The SNOO2-44N28 is designed for macro cellular networks and utilizes the Sierra SoC to achieve high outp
2 min read
Nokia and Numana Validate Quantum-Safe Network Blueprint 7 on Kirq Testbed for Critical Infrastructure Protection
Nokia Canada, Numana, and Canadian partners have completed interoperability testing on the Kirq quantum-safe testbed, validating Blueprint 7 as a repeatable network architecture for integrating quantum-safe encryption technologies. The testing, conducted in late 2025, demonstrated how quan
4 min read
UCLA Professor and Kneron Co-Founder M.C. Frank Chang Receives 2025 John Fritz Medal for Semiconductor Contributions
Dr. M.C. Frank Chang, co-founder of Kneron and distinguished professor of electrical and computer engineering at UCLA Samueli School of Engineering, has been awarded the 2025 John Fritz Medal. The medal, established in 1902, recognizes lifetime achievement in engineering. It is coordinated by the
3 min read
Siemens EDA Receives Packaging: Design Award at 2026 Chiplet Summit for Innovator3D IC
Siemens has received the Best of Show Award in the “Packaging: Design” category at the 2026 Chiplet Summit for its Innovator3D IC software solution. The award was presented during the fourth annual Chiplet Summit, held at the Santa Clara Convention Center. The event, organized by Semp
2 min read
QuickLogic Secures $13 Million Contract for Strategic Radiation Hardened FPGA Program
FPGA maker QuickLogic announced it has received a $13 million contract award. The funding supports continued development and demonstration of Strategic Radiation Hardened (SRH) high-reliability Field Programmable Gate Array (FPGA) technology. The program addresses current and future Departm
1 min read
SEMI North America Advisory Board Adds Executives from Chemours and Qnity Electronics
SEMI announced the election of two new members to its North America Advisory Board (NAAB): Gerardo Familiar, President of Advanced Performance Materials at The Chemours Company (Chemours), and Sam Ponzo, Interim President of Semiconductor Technologies at Qnity Electronics, (Qnity). The boa
2 min read
Vishay Launches AEC-Q200 Qualified 0201 Thick Film Chip Resistors for Automotive and Industrial Downsizing
Vishay Intertechnology, introduced the CRCW0201-AT e3 series of AEC-Q200 qualified thick film chip resistors in the 0201 case size. The devices measure 0.6 mm by 0.3 mm by 0.23 mm, providing a miniature footprint. They target automotive, industrial, and telecommunications applications as a space-
2 min read
Renesas R-Car V4H ADAS SoC Powers TSS(LSS) Control Unit in New Toyota RAV4 Model
Renesas Electronics Corporation announced that its R-Car V4H automotive system-on-chip (SoC), designed for advanced driver assistance systems (ADAS), has been selected for the TSS(LSS) control unit in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. Den
2 min read
Himax HX85200 OLED Touch Controller IC Enters Mass Production for High-End OLED Laptops
Himax Technologies, announced that its HX85200 series on-cell OLED touch controller IC has entered mass production in the first quarter of 2026. The IC has been adopted by multiple leading global IT brands and is being designed into high-end OLED laptop PCs. It integrates differentia
2 min read
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