Siemens has received the Best of Show Award in the “Packaging: Design” category at the 2026 Chiplet Summit for its Innovator3D IC software solution. The award was presented during the fourth annual Chiplet Summit, held at the Santa Clara Convention Center. The event, organized by Semper Technologies, serves technologists working with chiplets in designs for processors, memories, communications chips, and AI devices.
Innovator3D IC provides capabilities for pathfinding, planning, and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies.
AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software, stated that the recognition supports the delivery of technologies to accelerate semiconductor development. The solution applies a system-level design approach for optimizing and validating heterogeneous dies, chiplets, interposers, and packages in a unified flow.
Chuck Sobey, general chair of Chiplet Summit, noted that Innovator3D IC combines design lifecycle coverage with support for industry-standard data models. He indicated that as multi-die integration increases in complexity, the solution supplies tools for designers to proceed more quickly.
Additional winners in the 2026 Best of Show Awards included the UCIe Consortium in “Connectivity and Interoperability” for the UCIe 3.0 specification, and Sarcina Technology in “Packaging: Hardware” for its advanced chiplet-based AI package design.
