Qualcomm Technologies, and Siemens AG presented a joint technology demonstration at Mobile World Congress Barcelona, integrating edge AI and private Industrial 5G connectivity into a Siemens autonomous production model.
The showcase features a Siemens factory model with coordinated autonomous guided vehicles (AGVs) and robotic arm operations connected over a Siemens private Industrial 5G network powered by Qualcomm technology. This setup enables real-time, on-premises decision-making for dynamic, efficient, and intelligent autonomous production.
The demonstration includes:
An AGV transporting materials through the factory model via the private 5G network.
A robotic arm performing assembly while communicating with the AGV and production cells.
A Siemens industrial PC equipped with the Qualcomm Cloud AI 100 Accelerator Card running a local AI agent that analyzes system state in real time, identifies root causes, and recommends corrective actions.
Additional AI-driven tasks on the Qualcomm Cloud AI 100 Accelerator Card, including real-time process quality inspection and on-premises industrial intelligence.
The collaboration addresses the requirements of modern industrial environments that use distributed, autonomous production cells and mobile robotics needing local, intelligent, and secure coordination without reliance on centralized Manufacturing Execution Systems.
Siemens has worked with Qualcomm Technologies for several years to deliver private 5G network technology for autonomous production environments, providing reliable, low-latency wireless connectivity for flexible, mission-critical operations. Combining this with on-premises AI supports automation, improved quality and efficiency, and on-site retention of sensitive production data.
The demonstration is located at Qualcomm booth 3E10 in Hall 3 during MWC Barcelona.
Nakul Duggal, Executive Vice President and Group General Manager, Automotive, Industrial and Embedded IoT, and Robotics at Qualcomm Technologies, stated that the demonstration combines Qualcomm’s capabilities in AI, edge computing, and connectivity with Siemens’ expertise in factory automation to show intelligent, autonomous manufacturing at the edge.
Thibault de Assi, Senior Vice President, Head of Digital Connectivity and Power at Siemens AG, noted that integrating Siemens’ edge computing, networking, and private 5G with Qualcomm’s on-device AI illustrates security-focused, adaptive, and intelligent production scalable globally.
