Component Engineering

Intelsat gains India approval for satellite broadcast services
Aerospace

Intelsat gains India approval for satellite broadcast services

Intelsat, a major operator of satellite and terrestrial networks, has received approval from the Indian government to provide satellite coverage directly to India’s broadcast media companies. The authorization covers four geostationary satellites—IS-17, IS-20, IS-36, and IS-39—o

2 min read
Ubitus and MacKay memorial hospital showcase AI-powered medical robots at GTC Taiwan 2025
Component Engg

Ubitus and MacKay memorial hospital showcase AI-powered medical robots at GTC Taiwan 2025

Ubitus, a provider of cloud streaming and AI solutions, and MacKay Memorial Hospital will present AI-powered multi-modal medical robots at NVIDIA GTC Taiwan 2025. The session, titled “AI-Enabled Healthcare: Multi-Modal Robot Collaboration Inspired by MacKay’s Case Study,” wi

3 min read
Nextracker expands in India with new Hyderabad facility and surpasses 10 GW in solar tracker deployments
Solar

Nextracker expands in India with new Hyderabad facility and surpasses 10 GW in solar tracker deployments

Nextracker, a global provider of solar energy solutions, has deployed over 10 gigawatts (GW) of solar trackers in India, with 1.8 GW added in the last quarter. The company has also opened an 80,000 sq. ft. office and research and development (R&D) facility in Hyderabad, which includes a 13-ac

2 min read
Achronix launches VectorPath 815 FPGA accelerator card for AI and HPC applications
FPGA

Achronix launches VectorPath 815 FPGA accelerator card for AI and HPC applications

Achronix Semiconductor releases the VectorPath 815 (VP815) PCIe accelerator card, powered by the Speedster 7t1500 FPGA, designed for AI inferencing and high-performance computing (HPC) workloads.The VP815 leverages the Speedster 7t1500 FPGA, which includes 2,560 machine learning processors (M

2 min read
 HBM4 to drive over 30% price premium amid rising complexity and AI demand
Memory

HBM4 to drive over 30% price premium amid rising complexity and AI demand

According to TrendForce, the demand for AI servers is pushing the development of HBM4, with major suppliers advancing their product roadmaps. HBM4 features a more complex chip design with a larger die size due to an increased I/O count, raising production costs. Some vendors are shifting to a log

2 min read
TDK introduces 0201 size high-frequency inductors for compact devices
Passive

TDK introduces 0201 size high-frequency inductors for compact devices

TDK Corporation announced the MUQ0201022HA series of high-frequency inductors in the 0201 size (0.25 x 0.125 x 0.2 mm), the smallest in the industry for their electrical characteristics, matching those of the larger MHQ0402PSA series (0.4 x 0.2 mm). The series offers inductances from 0.6 nH to 3.

1 min read
Vishay Intertechnology introduces 80 V MOSFET in powerPAK 8x8SW package with 0.88 mW on-resistance
Discrete

Vishay Intertechnology introduces 80 V MOSFET in powerPAK 8x8SW package with 0.88 mW on-resistance

Vishay  announced the release of an 80 V TrenchFET Gen IV n-channel power MOSFET, the SiEH4800EW, in the PowerPAK 8x8SW bond wireless package. The MOSFET has an on-resistance of 0.88 mW at 10 V, which is 15% lower than competing devices in the same footprint, and a thermal resistance (RthJC)

2 min read
Newsletter for the 3rd week of May 2025
Component Engg

Newsletter for the 3rd week of May 2025

55 min read
Qualcomm, Aetina, and Data Systems unveil enterprise AI Assistant at COMPUTEX 2025
Component Engg

Qualcomm, Aetina, and Data Systems unveil enterprise AI Assistant at COMPUTEX 2025

Qualcomm Technologies, Inc., Aetina (a subsidiary of Innodisk Group), and Data Systems Co., Ltd. announced a collaboration to introduce the Enterprise AI Assistant at COMPUTEX 2025, held from May 20 to 23 at the Taipei Nangang Exhibition Center. The solution integrates Qualcomm’s AI inferen

4 min read
MSquare technology debuts ML100 IO die chiplet at COMPUTEX 2025
AI

MSquare technology debuts ML100 IO die chiplet at COMPUTEX 2025

COMPUTEX 2025, held at the Taipei Nangang Exhibition Center, began on May 20 and runs through May 23, hosting over 50,000 professionals from 34 countries. MSquare Technology is presenting its ML100 IO Die, a chiplet solution for AI system-on-chip (SoC) architectures, focusing on chiplet integrati

2 min read
Semtech’s LoRaWAN technology supports Yorkshire water’s smart meter deployment
Smart Home

Semtech’s LoRaWAN technology supports Yorkshire water’s smart meter deployment

Semtech Corporation announced the use of its LoRa technology in a smart water metering project by Yorkshire Water, in collaboration with Netmore Group, across the U.K. The initiative, one of the largest of its kind in the region, involves deploying 1.3 million smart water meters over five years.<

2 min read
Cadence partners with Imec’s SSTS program to enhance sustainability in semiconductor design
Advanced Semiconductor

Cadence partners with Imec’s SSTS program to enhance sustainability in semiconductor design

The increasing demand for semiconductors, fueled by AI, data centers, and digital transformation, has raised concerns about their environmental impact due to energy-intensive manufacturing and waste generation. Integrating sustainability into semiconductor design and manufacturing can reduce ener

2 min read
Silicon Bridge Podcast
SILICON BRIDGE

Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.

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