Component Engineering
e-peas Debuts AEM15820 PMIC at CES 2026 for Hybrid Indoor-Outdoor PV Energy Harvesting
e-peas presented its AEM15820 power management IC (PMIC) for the first time to the public at CES 2026. The AEM15820 is described as the industry’s first single-chip PMIC capable of managing the full dynamic power range of hybrid indoor-outdoor photovoltaic (PV) cells. Hybrid PV cells
2 min read
Siemens Unveiled Industrial AI Operating System with NVIDIA at CES 2026, Launches Digital Twin Composer
Siemens presented several AI-related technologies and partnerships at CES 2026, focusing on applications across industrial sectors. Siemens and NVIDIA announced an expansion of their partnership to develop an Industrial AI Operating System. The collaboration aims to apply AI across the end
6 min read
QuickLogic Receives Orders for Strategic Radiation Hardened FPGA Development Kit on 12nm Process
QuickLogic Corporation announced it has received orders for its Strategic Radiation Hardened FPGA Development Kit (SRH FPGA Dev Kit). The development kits include Strategic Radiation Hardened FPGA test chips that QuickLogic funded and had fabricated on GlobalFoundries' 12 nm process technol
2 min read
Arteris Closes Acquisition of Cycuity to Strengthen Semiconductor Cybersecurity Assurance
Arteris, announced it has completed the acquisition of Cycuity, a provider of semiconductor cybersecurity assurance technology. The acquisition combines Arteris’ system IP with Cycuity’s silicon hardware security assurance solutions. Arteris stated that the move addresses the inc
2 min read
SST and UMC Release 28nm SuperFlash Gen 4 Automotive Grade 1 Platform for Vehicle Controllers
Silicon Storage Technology (SST), a subsidiary of Microchip Technology and United Microelectronics Corporation announced the completion of full qualification and immediate release to production of SST’s embedded SuperFlash Gen 4 (ESF4) with full Automotive Grade 1 (AG1) capability on
3 min read
Siemens Acquires ASTER Technologies to Integrate PCB Test Engineering into Xpedition and Valor Portfolios
Siemens announced the acquisition of ASTER Technologies, a privately held company based in Cesson-Sévigné, France, specializing in printed circuit board assembly (PCBA) test verification and engineering software. The acquisition integrates ASTER’s “shift-left&rdqu
4 min read
Micron Breaks Ground on $100 Billion New York Megafab in Clay, Onondaga County
Micron Technology officially broke ground today on its planned $100 billion leading-edge memory manufacturing complex in Onondaga County, New York. The project, located in the town of Clay, is expected to become the largest semiconductor manufacturing facility in the United States upon completion
4 min read
S2C Details Prodigy Prototyping Tools for Efficient SoC Bring-Up Across Design Scales
System-on-Chip (SoC) designs are increasing in scale and interface diversity, creating demands on prototype capacity, interconnect planning, and bring-up efficiency. These requirements apply to both large multi-FPGA setups and smaller designs on single devices or small FPGA clusters. Teams need t
4 min read
Samsung Completes Industry-First Commercial vRAN Call on Intel Xeon 6 SoC with Tier 1 U.S. Operator
Samsung Electronics announced the successful completion of the industry’s first commercial call using its virtualized RAN (vRAN) solution powered by the Intel Xeon 6700P-B processor series, featuring up to 72 cores, on a Tier 1 U.S. operator’s live network. This achievement fol
4 min read
e-peas Schedules Webinar on AEM15820 Hybrid Boost PMIC for Indoor-Outdoor Energy Harvesting
e-peas announced a webinar titled “AEM15820: Powering the Future of Indoor & Outdoor Energy Harvesting” to detail the capabilities of its recently introduced AEM15820 hybrid boost power management IC (PMIC). The webinar will explain how the AEM15820 enables next-generation
2 min read
BOS Semiconductors Licenses Ceva SensPro AI DSP for Eagle-A ADAS SoC with Chiplet-Based Scalability
BOS Semiconductors has licensed Ceva Inc.’s SensPro AI DSP architecture for use in its Eagle-A standalone system-on-chip (SoC) targeted at advanced driver assistance systems (ADAS) and autonomous driving platforms. The Eagle-A SoC is designed to combine a high-end neural processing u
2 min read
TCS and AMD Forge Strategic Partnership to Accelerate Enterprise AI Scale and GenAI Deployment
Tata Consultancy Services (TCS) announced a strategic collaboration with AMD aimed at assisting enterprises in scaling AI adoption from pilot projects to full production, modernizing legacy systems, and establishing secure, high-performance digital workplaces. The partnership focuses on jo
4 min read
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