Compound Semiconductor
Wolfspeed appoints Dr. David Emerson as COO
Wolfspeed appointed Dr. David Emerson as Executive Vice President and Chief Operating Officer, effective immediately. In this newly created role, Dr. Emerson will oversee the company’s Operations, Supply Chain, and Quality divisions, focusing on operational efficiency across Wolfspeed&rsquo
2 min read
Navitas introduces industry-first AEC-Plus qualified SiC MOSFETs in HV-T2PaK package for enhanced automotive and industrial reliability
Navitas announces the launch of its groundbreaking 650 V and 1200 V trench-assisted planar SiC MOSFETs. These innovative devices, housed in the HV-T2PaK top-side cooled package, set a new industry benchmark for reliability and performance in automotive and industrial applications.
3 min read
ROHM introduces high power density SiC power modules for EV automotive chargers
ROHM has developed new 4-in-1 and 6-in-1 SiC molded power modules in the HSDIP20 package, optimized for PFC and LLC converters in onboard chargers (OBCs) for electric vehicles (xEVs). The lineup includes six 750V models (BSTxxx1P4K01) and seven 1200V models (BSTxxx2P4K01). These modules integrate
2 min read
Development of a European-based 650V GaN power device platform through IQE and X-FAB collaboration
IQE and X-FAB Silicon Foundries SE, are pleased to announce a Joint Development Agreement to create a European-based GaN Power device platform solution.With an initial two-year scope of work, IQE and X-FAB will collaborate to develop a 650V GaN device. The agreement will leverage IQE’s
3 min read
Navitas launches advanced SiCPAK power modules with Epoxy-Resin potting for superior high-temperature performance and reliability
Navitas announces the release of its latest SiCPAK power modules. These cutting-edge modules, featuring advanced epoxy-resin potting technology, set a new standard for reliability and efficiency in high-temperature environments.
3 min read
Mitsubishi introduces Full-SiC and Hybrid-SiC SLIMDIP modules for enhanced energy efficiency in home appliances
Mitsubishi Electric announced that it will begin shipping samples of two new SLIMDIP series power semiconductor modules for room air conditioners and other home appliances, the Full SiC SLIMDIP (PSF15SG1G6) and the Hybrid SiC SLIMDIP (PSH15SG1G6), on April 22. Both modules, the first SiC versions
3 min read
Navitas and GigaDevice partner to accelerate GaN & SiC adoption in high efficiency power platforms
Navitas has announced a strategic partnership with GigaDevice. This collaboration aims to create a joint R&D laboratory to accelerate the adoption of GaN and SiC technologies in AI data centers, electric vehicles, solar energy, and energy storage systems.The partnership will integrate Nav
3 min read
STMicroelectronics and Innoscience forge joint development agreement for advanced GaN power electronics
STMicroelectronics have announced a Joint Development Agreement with Innoscience to enhance GaN power solutions and strengthen supply chain resilience.Joint Development Initiative: The collaboration focuses on advancing GaN power technology for applications in consumer electronics, datacenter
2 min read
Power Integrations unveils GaN Switcher IC with 1250-Volt capacity
Power Integrations has recently introduced the latest addition to their InnoSwitch family of off-line CV/CC QR flyback switcher ICs. This release is the world's highest-voltage, single-switch gallium-nitride (GaN) power supply IC, boasting a 1250-volt PowiGaN switch. The InnoSwitch 3-EP 1250 V I
3 min read
onsemi’s expanded SiC production plant in Bucheon, South Korea is ready
onsemi announced the successful completion of expansion for its silicon carbide (SiC) fabrication facility located in Bucheon, South Korea. With the facility now operating at full capacity, it can produce over one million 200 mm SiC wafers annually. To accommodate the increased manufacturing capaci
4 min read
1200V SiC power modules in 32-pin, dual-inline, molded, through-hole package
Targeting the electric vehicle automotive power electronics applications such as on-board chargers (OBC), DC/DC converters, STMicroelectronics Unveiled its new ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package. ACEPACK 1
2 min read
New compound semiconductor equipment from Veeco and Altatech
Veeco Instruments introduces Propel Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system featuring single-wafer 200mm reactor platform to increase film uniformity, yield of compound semiconductor devices. Veeco’s new Propel Power GaN MOCVD system can process six and ei
2 min read
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