Component Engineering
Keysight and Point2 Technology Partner to Validate Multi-Terabit e-Tube Interconnects for AI Scale-Up Data Centers
Keysight Technologies, and Point2 Technology announced a strategic collaboration to validate Point2’s e-Tube interconnect technology for next-generation multi-terabit connectivity in artificial intelligence and machine learning data centers. The collaboration focuses on addressing sc
3 min readMurata Releases Technical Guide on Optimizing Power Delivery Networks for AI Servers in Data Centers
Murata Manufacturing published a new technology guide titled “Optimizing Power Delivery Networks for AI Servers in Next-Generation Data Centers.” The guide is now available for download on the company’s website. It presents specific power delivery network optimization sol
3 min readNorth American EMS Industry Reports 1.24 Book-to-Bill Ratio in December 2025 Amid Year-End Bookings Surge
The Global Electronics Association released the December 2025 results from its North American Electronics Manufacturing Services (EMS) Statistical Program on February 2, 2026. The book-to-bill ratio for December 2025 stood at 1.24. This figure is based on the value of orders booked over the
4 min read
MIC Electronics Receives First PAPIS Order from Rail Coach Factory, Kapurthala
MIC Electronics Limited has secured its first order in the Passenger Announcement and Passenger Information System (PAPIS) segment from the Rail Coach Factory (RCF), Kapurthala. The company received a Letter of Acceptance (LoA) from RCF following evaluation of its bid by the competent auth
2 min read
Redington Reports 16% YoY Revenue Growth to ₹30,959 Crore in Q3 FY26, Net Profit Rises 9% to ₹436 Crore
Redington Ltd., a technology solutions provider, announced its unaudited financial results for the quarter ended December 31, 2025 (Q3 FY26) on February 4, 2026. The company recorded global revenue of ₹30,959 crore, marking a 16% increase compared to the same quarter last year. Net profit re
3 min readLockheed Martin and Fujitsu Sign MOU to Accelerate Dual-Use Technology Development in Quantum, AI, Edge Computing and Microelectronics
Lockheed Martin and Fujitsu Limited announced the signing of a new Memorandum of Understanding (MOU) aimed at jointly accelerating technology development in several key areas. The collaboration combines Lockheed Martin’s integrated systems expertise with Fujitsu’s advanced technologie
3 min readpSemi and Cirrus Logic Settle Power Conversion Patent Litigation with IP License Agreement
pSemi Corporation, a Murata company, announced that it has entered into an agreement with Cirrus Logic under which Cirrus Logic has taken a license to pSemi intellectual property related to power conversion technology. The agreement also resolves the outstanding litigation between the two co
1 min readApple Launches Second-Generation AirTag with 50% Longer Precision Finding Range, Louder Speaker, and Apple Watch Support
Apple introduced a new version of the AirTag item tracker. The updated AirTag features an expanded finding range, a louder speaker, and compatibility with Precision Finding on Apple Watch models. The new AirTag uses Apple’s second-generation Ultra Wideband chip, the same one found in
4 min readEaton Collaborates with Flexnode to Expand Modular Data Center Infrastructure for AI Workloads
Eaton, an intelligent power management company, is collaborating with Flexnode, a digital infrastructure company, to deliver modular, scalable rack and power infrastructure for data center compute applications in the U.S. Eaton will supply critical power backup, racks, and cable management t
3 min readMACOM Promotes Stephen Ferranti and Gregg Jessen to Senior Vice President Roles in Corporate Development and GaN Technology
MACOM Technology Solutions announced the promotions of two senior leaders to the level of Senior Vice President. Stephen Ferranti has been promoted to Senior Vice President, Corporate Development and Investor Relations. Ferranti joined MACOM in 2016 and most recently held the position of V
3 min readSK hynix Announces Establishment of U.S.-Based AI Company Through Solidigm Restructuring for AI Data Center Solutions
SK hynix will establish an AI solutions firm in the United States, tentatively named AI Company (AI Co.), to identify new growth opportunities in AI. The company aims to leverage its chip technologies, including HBM, to deliver optimized AI systems for customers in the AI data
2 min read
Lantronix and Safe Pro Group Enter Partnership for Qualcomm-Based Edge AI in Defense Drones and Autonomous Systems
Lantronix has signed a Memorandum of Understanding (MOU) and a Master Services Agreement (MSA) with Safe Pro Group. The agreements create a framework for joint development, integration, and commercialization of embeddable chipsets in Qualcomm-based drone and autonomous vehicle platforms.
4 min read
Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
▶ Podcast

