Component Engineering

Toshiba’s semiconductor facilities adopt off-site PPA model for renewable energy procurement
Component Engg

Toshiba’s semiconductor facilities adopt off-site PPA model for renewable energy procurement

Toshiba Electronic Devices & Storage Corporation has implemented off-site power purchase agreements (PPAs) to secure renewable energy for its two semiconductor manufacturing facilities: Kaga Toshiba Electronics Corporation in Ishikawa Prefecture and Himeji Operations – Semiconductor in

2 min read
Keysight, NTT, and NTT Innovative Devices set 280 Gbps data rate record in 300 GHz band for 6G
Test & Measurement

Keysight, NTT, and NTT Innovative Devices set 280 Gbps data rate record in 300 GHz band for 6G

Keysight Technologies, Inc., in collaboration with NTT Corporation and NTT Innovative Devices Corporation, achieved a data rate of 280 Gbps in the 300 GHz band, surpassing the previous record of 240 Gbps. The milestone was reached using Keysight’s Vector Component Analyzer, based on the N52

2 min read
Mainland China PC shipments increase 12% in Q1 2025, tablets grow 19%
Computer

Mainland China PC shipments increase 12% in Q1 2025, tablets grow 19%

According to Canalys, now part of Omdia, Mainland China’s PC market, excluding tablets, grew 12% year-on-year in Q1 2025, reaching 8.9 million units shipped. Tablet shipments increased 19%, totaling 8.7 million units. Government subsidies supported consumer demand, driving device upgrades.

2 min read
Nota AI and Wind River partner to enhance on-device AI for edge applications
Component Engg

Nota AI and Wind River partner to enhance on-device AI for edge applications

Nota AI and Wind River announced a strategic Partner Program Agreement (PPA) to integrate Nota AI’s NetsPresso AI model optimization platform with Wind River Studio Developer. The collaboration aims to support on-device generative AI across industries such as automotive, mobile, and IoT.

2 min read
ROHM introduces AEC-Q100 qualified current sense amplifiers for automotive applications
Automotive

ROHM introduces AEC-Q100 qualified current sense amplifiers for automotive applications

ROHM announced the development of two new series of current sense amplifiers, the BD1423xFVJ-C and BD1422xG-C, both compliant with the AEC-Q100 automotive reliability standard. The BD1423xFVJ-C series, available in the TSSOP-B8J package, supports input voltages up to +80V and includes three model

2 min read
MACOM announces new RF solutions for radar systems at IMS 2025
Component Engg

MACOM announces new RF solutions for radar systems at IMS 2025

MACOM Technology Solutions Inc. introduced a suite of RF solutions for advanced radar systems, to be demonstrated at the International Microwave Symposium (IMS) from June 17 to 19, 2025, in San Francisco, CA, at booth 943.For S-Band (2–4 GHz), MACOM offers 65 V, 50-ohm GaN-on-SiC amplif

2 min read
Opengear announces integrated support model for network appliances
Component Engg

Opengear announces integrated support model for network appliances

Opengear, a Digi International company, introduced a new support model for its network infrastructure appliances, effective this month. Each new Opengear device will include five years of hardware coverage and SLA-backed support at no additional cost.The model offers two support tiers: Founda

2 min read
GATE ECE: gateway to advanced education and diverse career opportunities
For Students

GATE ECE: gateway to advanced education and diverse career opportunities

GATE ECE: gateway to advanced education and diverse career opportunities The Graduate Aptitude Test in Engineering (GATE) for Electronics and Communication Engineering (ECE) is a pivotal examination that unlocks a spectrum of academic an

35 min read
AMD EPYC processors integrated into Nokia cloud platform for 5G networks
Processors

AMD EPYC processors integrated into Nokia cloud platform for 5G networks

AMD announced that Nokia has incorporated 5th Gen AMD EPYC processors into its Nokia Cloud Platform to support next-generation telecom infrastructure. The processors are used in virtualization deployments for 5G Core, edge, and enterprise applications.

2 min read
Bourns launches thick film on steel high power resistors for extended temperature range applications
Passive

Bourns launches thick film on steel high power resistors for extended temperature range applications

Bourns, Inc. announced the introduction of its Thick Film on Steel (TFOS) product line, starting with the Model TFOS3

2 min read
Synopsys and Broadcom demonstrate PCIe 6.x interoperability at PCI-SIG DevCon 2025
Component Engg

Synopsys and Broadcom demonstrate PCIe 6.x interoperability at PCI-SIG DevCon 2025

Synopsys, Inc. announced that its PCIe 6.x IP solution, including PHY and controller, achieved interoperability with Broadcom’s PEX90000 series switch. The demonstration, conducted at 64 GT/s, involved the Synopsys solution operating as both a root complex and an endpoint. This collaboratio

2 min read
Cadence collaborates with NVIDIA to provide AI cloud solutions for industrial applications
Component Engg

Cadence collaborates with NVIDIA to provide AI cloud solutions for industrial applications

Cadence announced at NVIDIA GTC Paris a collaboration with NVIDIA to offer solutions for an industrial AI cloud, utilizing NVIDIA Grace Blackwell platforms. The solutions include the Cadence Fidelity CFD Platform, Spectre X Simulator, Voltus IC Power Integrity Solution, and Innovus Implementation

2 min read
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Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.

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