Component Engineering

Addverb Technologies Enhances Warehouse Automation with Siemens Xcelerator Digital Solutions
Component Engg

Addverb Technologies Enhances Warehouse Automation with Siemens Xcelerator Digital Solutions

Addverb Technologies, an Indian company specializing in robotics and warehouse automation, has adopted software from the Siemens Xcelerator portfolio to streamline its development processes and deliver automation solutions more efficiently while maintaining product quality and scaling offerings a

3 min read
MUFG Bank and Fujitsu Partner to Build Data-Driven Preventive Health Ecosystem in Japan
Component Engg

MUFG Bank and Fujitsu Partner to Build Data-Driven Preventive Health Ecosystem in Japan

MUFG Bank, Ltd. and Fujitsu Limited have signed a Memorandum of Understanding (MOU) on August 1 to develop a preventive health ecosystem addressing Japan’s challenges of a super-aging population and rising lifestyle-related diseases. The partnership focuses on integrating data-driven health

3 min read
Renesas Unveils RZ/G3E 64-Bit MPU for AI-Enhanced HMI and Edge Computing Applications
Processors

Renesas Unveils RZ/G3E 64-Bit MPU for AI-Enhanced HMI and Edge Computing Applications

Renesas Electronics launched the RZ/G3E, a 64-bit microprocessor designed for high-performance Human Machine Interface (HMI) systems. The MPU integrates a quad-core Arm Cortex-A55 CPU running at up to 1.8GHz, a Cortex-M33 core, and an Ethos-U55 Neural Processing Unit (NPU) for AI tasks, targeting

3 min read
Tachyum Advances Prodigy Universal Processor with eBPF JIT Compiler Integration
Processors

Tachyum Advances Prodigy Universal Processor with eBPF JIT Compiler Integration

Tachyum announced the successful porting of the eBPF Just-In-Time (JIT) compiler to its Prodigy Universal Processor software emulation platform. The eBPF technology enables sandboxed programs to run in privileged contexts, such as the operating system kernel, extending capabilities for kernel tra

2 min read
Edge AI Integration: SiMa.ai Modalix Platform Enhances Cisco IE3500 Switches for Industry 4.0
Processors

Edge AI Integration: SiMa.ai Modalix Platform Enhances Cisco IE3500 Switches for Industry 4.0

SiMa.ai has announced a collaboration with Cisco to integrate AI capabilities into Industry 4.0 environments. The partnership combines SiMa.ai’s Modalix AI platform with Cisco’s IE3500 industrial Ethernet switches to enable edge AI solutions for manufacturing, logistics, and industria

4 min read
MACOM Assumes Control of Research Triangle Park Wafer Fab Ahead of Schedule
Semiconductor Foundry

MACOM Assumes Control of Research Triangle Park Wafer Fab Ahead of Schedule

MACOM Technology has taken full operational control of its recently acquired wafer fabrication facility in Research Triangle Park, North Carolina. The transfer, completed six months ahead of schedule, marks a step in MACOM’s expansion in gallium nitride on silicon carbide (GaN-on-SiC) techn

1 min read
Skyworks Introduces SKY63104/5/6 and SKY62101 Clock Devices for Ethernet and PCI Express Applications
Component Engg

Skyworks Introduces SKY63104/5/6 and SKY62101 Clock Devices for Ethernet and PCI Express Applications

Skyworks  announced the release of its SKY63104/5/6 family of jitter attenuating clocks and the SKY62101 ultra-low jitter clock generator. These devices, based on Skyworks’ fifth-generation DSPLL and MultiSynth technologies, support any-frequency, any-output clock generation and si

3 min read
Teledyne LeCroy Releases ASA ML v1.1 Compliance Test Software for Automotive SerDes
Component Engg

Teledyne LeCroy Releases ASA ML v1.1 Compliance Test Software for Automotive SerDes

Teledyne LeCroy has introduced the QPHY2-ASA compliance test software for the Automotive SerDes Alliance (ASA) Motion Link (ML) v1.1 specification, designed for in-vehicle network standards supporting data transfer in highly autonomous vehicles. SerDes devices facilitate one-directional da

2 min read
Bourns Expands MF-MSMF Multifuse PPTC Series with 32 New Part Numbers and Enhanced 60 VDC Models
Passive

Bourns Expands MF-MSMF Multifuse PPTC Series with 32 New Part Numbers and Enhanced 60 VDC Models

Bourns has expanded its Multifuse MF-MSMF Series of high-power surface mount Polymer Positive Temperature Coefficient (PPTC) resettable fuses. The company has added 32 new part numbers and increased the number of models with a maximum voltage (Vmax) capability of 60 VDC. The expansion addresses c

2 min read
Memory Market to Hit $200 Billion in 2025, Driven by HBM and AI Demand
Memory

Memory Market to Hit $200 Billion in 2025, Driven by HBM and AI Demand

On June 19, 2025, Yole Group released its Status of the Memory Industry 2025 report, stating that global memory market revenue reached $170 billion in 2024, with DRAM at $97 billion and NAND at $68 billion. The report forecasts 2025 revenue to reach $200 billion, with DRAM projected at $129 billi

3 min read
Your weekly semiconductor scoop: News and updates from top sources
Component Engg

Your weekly semiconductor scoop: News and updates from top sources

Did you miss visiting a semiconductor news source last week? No worry! Here we are providing the content from leading news and information sources around the world. On behalf of you we visit close to 100 online places including social media sites, so that you do not miss any online information on

26 min read
Nokia introduces autonomous network fabric and expands Google cloud collaboration
Communication

Nokia introduces autonomous network fabric and expands Google cloud collaboration

Nokia announced the launch of its Autonomous Network Fabric, a suite of telco-trained AI models, integrated security, and AI applications designed to enhance network automation and support new service deployment. The platform unifies observability, analytics, security, and automation across netwo

3 min read
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Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.

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