News
Selecting High-Purity Valves for Semiconductor Etching and Cleaning: A Practical Guide for Fab Buyers
The semiconductor industry is in the middle of an unprecedented capacity expansion. Global sales reached approximately $800 billion in 2025 and are projected to exceed $1 trillion in 2026, driven by AI infrastructure, data centers, and advanced memory demand. New fabs are coming up across t
18 min read
Credo Completes Acquisition of DustPhotonics, Adding Silicon Photonics PIC Technology for 800G to 3.2T Optical Interconnects
Credo Technology has completed its acquisition of DustPhotonics. The acquisition adds DustPhotonics’ silicon photonics photonic integrated circuit (SiPho PIC) technology for optical connectivity. It expands Credo’s portfolio across 800G, 1.6T, and 3.2T near-packaged optics (NPO)
2 min read
Production-Ready Flows and Certified IP Strengthen Samsung Foundry 2nm and 3D-IC Design Enablement at SAFE Forum 2026
Samsung Foundry highlighted expanded ecosystem collaborations at the Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026, delivering production-ready AI-powered digital and analog design flows, certified interface and foundation IP, multiphysics signoff solutions, and silicon-validated test capa
10 min read
Intel and 3DGS to Build $3.3 Billion Glass-Core Substrate Manufacturing Plant in Odisha
Intel Corporation and 3DGS Inc. USA will invest approximately $3.3 billion to establish an advanced packaging glass core substrate manufacturing facility in Odisha. The plant will produce advanced packaging glass core substrates, high-density interconnect substrates, and related semiconductor tec
2 min read
NITI Aayog Launches 10-Year Roadmap Outlining Vision for USD 120-150 Billion Semiconductor Ecosystem by 2035
NITI Aayog’s Frontier Tech Hub has unveiled “Future of India’s Semiconductor Industry”, a 10-year roadmap. The roadmap outlines India’s vision for strengthening its position across the global semiconductor value chain. Nirmala Sitharaman, Minister of Finance a
2 min read
CEA-Leti Reports 1 μm Pitch D2W Hybrid Bonding Technology for 3D Semiconductor IC Packaging at ECTC 2026
CEA-Leti has demonstrated a functional test vehicle that uses die-to-wafer (D2W) hybrid bonding at pitches down to 1 μm. The results were presented at the Electronic Components and Technology Conference (ECTC) 2026. The work targets high-performance computing, advanced smart-vision syst
4 min read
Netrasemi Launches NETRA A2000 Edge AI SoC with Successful Silicon Bring-Up
Netrasemi has launched its flagship Edge AI System-on-Chip, the NETRA A2000, which has completed successful silicon bring-up and is now available for customers. The NETRA A2000 represents several firsts in India. It is the country’s first AI/ML processor developed in India, a Vision SoC wit
3 min read
AMD Announces Over $10 Billion Taiwan Ecosystem Investments for AI Infrastructure and Advanced Packaging
AMD announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The investments support development of leading-edge silicon, packaging, and manufacturing technologies.
3 min read
MaxLinear and Edgecore Networks Form Strategic Partnership for Edge Networking Solutions
MaxLinear,and Edgecore Networks announced a strategic partnership to accelerate the development of AI-driven networking solutions for enterprise and service provider markets. The collaboration combines MaxLinear’s high-performance connectivity platforms with Edgecore’s open netwo
3 min read
Synaptics Coralboard to Demonstrate Edge AI Use Cases with Google Research at Google I/O 2026
Synaptics Incorporated and Google Research will showcase Edge AI use cases on the Synaptics Coralboard at Google I/O 2026. The Coralboard is a development platform designed to support developers moving from prototyping to real-world Edge AI product development. It is powered by the Synaptics Astr
3 min read
Mitsubishi Electric and Chiba Institute of Technology Sign Agreement for Physical AI Research and Development
Mitsubishi Electric Corporation and Chiba Institute of Technology announced they have signed a basic agreement to jointly research and develop homegrown physical AI technologies for public and private sector applications. The parties will establish a Co-Creation Center to promote the commercializ
3 min read
Arteris FlexNoC 5 and Magillem Deployed in Li Auto L9 Livis Autonomous Driving SoC
Arteris, announced that its system IP technology has been deployed by Li Auto Inc. in the proprietary autonomous driving systems-on-chip (SoCs) of the L9 Livis high-tech flagship SUV. Arteris FlexNoC 5 network-on-chip (NoC) interconnect IP and Magillem SoC integration automation software ar
3 min read
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