Credo Technology has completed its acquisition of DustPhotonics. The acquisition adds DustPhotonics’ silicon photonics photonic integrated circuit (SiPho PIC) technology for optical connectivity. It expands Credo’s portfolio across 800G, 1.6T, and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO) solutions.
Credo now operates a vertically integrated connectivity stack that includes SerDes, digital signal processing (DSP), silicon photonics, and system integration. The combined capabilities address both electrical and optical interconnects for scale-out and scale-up networks in AI infrastructure.
The company stated that its combined portfolio of ZeroFlap optical transceivers, optical DSPs, and silicon photonics products is expected to serve as a significant growth driver in fiscal 2027, based on customer traction and adoption in hyperscale AI deployments.
“I am thrilled to officially welcome the talented team from DustPhotonics to Credo,” said Bill Brennan, President and CEO, Credo. “Today marks an important milestone as we join two deeply skilled organizations united by a shared commitment to innovation, execution, and customer impact. Together, we will continue to advance a powerful, end-to-end optical connectivity solution platform with reliability and power efficiency at its core, helping our customers scale AI infrastructure.”
“Today we celebrate that DustPhotonics is now a part of Credo,” said Ronnen Lovinger, Vice President, Silicon Photonics, Credo. “I am extremely proud of the silicon photonics advancements we pioneered as a team, and am excited to work alongside our new colleagues to accelerate our vision for optical interconnect. Silicon photonics will increasingly become the foundational technology for AI-driven optical connectivity enabling the bandwidth, efficiency, and scale that next-generation infrastructure demands.”
