Intel and 3DGS to Build $3.3 Billion Glass-Core Substrate Manufacturing Plant in Odisha

Intel Corporation and 3DGS Inc. USA will invest approximately $3.3 billion to establish an advanced packaging glass core substrate manufacturing facility in Odisha. The plant will produce advanced packaging glass core substrates, high-density interconnect substrates, and related semiconductor technologies.

The project, located in the Bhubaneswar-Khurda region at Info Valley, is expected to be implemented in phases over five to six years. It is projected to create over 1,800 direct high-skilled jobs and generate additional indirect employment.

Substrates serve as the foundational material on which semiconductor device components are attached. The facility will leverage glass-based substrate technologies and high-density interconnect packaging for applications in artificial intelligence, high-performance computing, telecommunications, and next-generation electronics. Annual output targets include around 70,000 glass substrates, 50 million assembled units, and close to 13,000 advanced 3D heterogeneous-integration modules.

Odisha Chief Minister Mohan Charan Majhi and Union Minister of Electronics and IT Ashwini Vaishnaw, along with Intel CEO Lip-Bu Tan,  witnessed the signing of the Memorandum of Understanding (MoU). Intel will serve as a technology partner, providing process expertise, technology licensing, quality systems, and workforce capability bui...