News
BASF Launches Yellow-Light Technology with Sub-530nm Cut-Off for Semiconductor and Photolithography Applications
BASF has introduced a yellow-light material solution for specialized industrial uses, including semiconductors, printed circuit boards (PCBs), display manufacturing, LED production, and solar energy. The technology provides a wavelength cut-off below 530nm for high-end semiconductor applications
4 min read
Applied Materials and TSMC Collaborate at EPIC Center on Next-Generation Semiconductor Technologies for AI
Applied Materials announced a new innovation partnership with TSMC to develop materials, equipment, and process technologies for scaling next-generation semiconductor devices. The companies will work together at Applied’s EPIC Center in Silicon Valley. The partnership builds on more
6 min read
Infineon Collaborates with d-Matrix on Power Solutions for AI Inference Accelerators
Infineon has entered into a collaboration with AI Inferencing chip expert d-Matrix, where Infineon’s power solutions are used in d-Matrix’s Corsair inference accelerator to support performance, energy efficiency, and system integration in high-density boards. The collaboration
3 min read
Imec Demonstrates First 3D CCD Memory Device with IGZO Channel at 2026 IEEE International Memory Workshop
Imec has presented a 3D implementation of a charge-coupled device (CCD) memory with an IGZO channel, described as the first of its kind, at the 2026 IEEE International Memory Workshop (IMW). The device consists of vertical memory holes drilled through a stack of three word-lines that function as
3 min read
HrdWyr Raises $13 Million Series A to Develop AI-Native System-on-Chips for Edge Applications
HrdWyr, a global fabless semiconductor product company, announced the closing of a $13 million Series A funding round. The round was led by Ideaspring Capital, with participation from Singularity AMC, Avatar Growth Capital, and Persistent Systems. The proceeds will be used to accelerate developme
5 min read
A Paradigm Shift in Semiconductor Manufacturing: The Power of Digital Twins and Virtual Fabs
Semiconductor chip fabs making chips in the nodes of 2nm and lower are among the most demanding manufacturing environments on earth. Producing advanced chips at scale requires sub-nanometer precision, ultraclean process conditions, hundreds of interdependent process steps, and workforces whose ex
10 min read
YT Jia Takes Helm as Global CEO at Faraday Future, Driving EAI Humanoid Robots and Automotive AI Strategy
Faraday Future announced leadership and governance changes, with its Board acknowledging and appointing founder YT Jia as Global CEO and Jerry Wang as Global Executive Chairman. The Board accepted Matthias Aydt’s resignation as Global Co-CEO and appointed independent director Chad Chen as L
4 min read
yieldWerx and WATS Partner to Integrate PCB Test Data with Semiconductor Manufacturing and Chip-Level Analytics
yieldWerx and WATS have announced a partnership to connect board-level PCB test data with upstream semiconductor manufacturing data. Board-level and semiconductor test data are typically analyzed in isolation, which limits correlation across the product lifecycle. Linking printed circuit boa
4 min read
MICROIP Presents Software-Driven Hardware Strategy at EEC 2026 for Poland-Taiwan Edge AI and ASIC Supply Chain Collaboration
At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr. James Yang participated in the "Poland-Taiwan Economic Cooperation Forum." He was joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu. Dr. Yang delivered a speech outlining MICROIP’s “Soft
3 min read
MountAIn Partners with Alif Semiconductor to Enable Cloud-Grade Computer Vision on Ensemble and Balletto Processors
MountAIn SAS, a 2026 CES Innovation Award honoree, has announced a strategic partnership with Alif Semiconductor to deliver a computer vision stack optimized for Alif's ultra-low-power Ensemble and Balletto processors. The partnership follows MountAIn's 2026 CES Innovation Award and focuse
3 min read
Ajinomoto Fine-Techno Acquires Gifu Plant Site for ABF Semiconductor Film Production
Japan based Ajinomoto announced that its consolidated subsidiary Ajinomoto Fine-Techno Co., Inc. (AFT) will acquire a new plant site in the Kani-Mitake Interchange Industrial Park in Kani City, Gifu Prefecture. The site is intended for construction of a production facility for Ajinomoto Build-up
3 min read
Resonac Opens US-JOINT R&D Center in Silicon Valley for Next-Generation Semiconductor Packaging
Resonac Corporation inaugurated a new R&D center on April 20, 2026, marking the full-scale launch of the US-JOINT consortium. The consortium consists of 12 Japanese and U.S. material and equipment manufacturers led by Resonac. Its objective is to establish new models for developing next-gener
4 min read
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