Resonac Opens US-JOINT R&D Center in Silicon Valley for Next-Generation Semiconductor Packaging

Resonac Corporation inaugurated a new R&D center on April 20, 2026, marking the full-scale launch of the US-JOINT consortium. The consortium consists of 12 Japanese and U.S. material and equipment manufacturers led by Resonac. Its objective is to establish new models for developing next-generation semiconductor-packaging technologies.

A ceremony attended by government officials and participating companies from Japan and the United States was held at the consortium’s base in Silicon Valley on the same day. The facility in Union City, California, is the first R&D center in the United States dedicated to advanced semiconductor-packaging technologies.

The center will allow Resonac and its partners to validate new concepts in collaboration with major users of advanced semiconductors. It aims to capture market needs in real time by combining the capabilities of leading Japanese and U.S. manufacturers of materials and equipment. This setup is intended to accelerate research and development of materials, evaluation methods, and packaging technologies to support faster commercialization.

Hidehito Takahashi, President and CEO of Resonac, stated that US-JOINT seeks to shorten the proof-of-concept period from approximately six months to as little as one month. The approach involves conducting development in Silicon Valley, near major hyperscalers, thro...