Semiconductor Foundry
GlobalFoundries Qualifies SLATE Wafer-to-Wafer Bonding on 9SW RF-SOI Platform
GlobalFoundries announced the production readiness of its SLATE wafer-to-wafer bonding technology on the 9SW radio-frequency silicon-on-insulator (RF-SOI) platform for advanced 3D integration in radio frequency applications. The technology is manufactured at GF’s 300mm facility in Si
3 min read
SEMICON West 2026 Returns to San Francisco October 13-15
SEMI announced that SEMICON West 2026 will take place October 13-15 at the Moscone Center in San Francisco. The event returns to the Bay Area after last year’s event in Phoenix. Registration is now open, with early-bird rates available until June 26. The semiconductor industry is expected t
3 min read
Applied Materials Executive Says India Has Opportunity to Move from Participant to Shaper of Global Semiconductor Industry
Dr Suraj Rengarajan, Managing Director and Principal Technologist at Applied Materials India, opened his remarks at COSEIn 2026 with a personal note: he moved to India in 2007, he said, because he was told a fab was coming. "And so it's finally here." Re
5 min read
COSEIN 2026 at IISc Bengaluru Highlights Progress and Challenges in Building India's Semiconductor Ecosystem
The Conference on Semiconductor Ecosystem in India (COSEIN 2026), held at the Indian Institute of Science (IISc) in Bengaluru on 19th June, brought together more than 100 industry delegates along with academics, researchers, and government representatives. Participants engaged i
9 min read
How GeniSys is Fueling India’s Semiconductor Dreams
In an interactive talk hosted by Srinivasa Reddy N, Editor of EEHerald, executives from GeniSys GmbH shared insights into the company’s software solutions for advanced semiconductor manufacturing and their relevance to India’s expanding ecosystem of design centers and upcoming fabrica
5 min read
Intel Appoints Seok-Hee Lee as Executive Vice President of Intel Foundry to Oversee Advanced Packagi
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing. As part of th
3 min read
IQE and Tower Semiconductor Sign Multi-Year InP Epiwafer Supply Agreement for Silicon Photonics
IQE plc and Tower Semiconductor have announced a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers. The epiwafers will support Tower’s advanced silicon photonics platforms for optical connectivity solutions in AI-driven data centre infrastructure. IQE’s In
2 min read
Park Systems Launches Joint Development Program with imec for Metrology in 3D Packaging and Logic Research
Park Systems announced the launch of a new joint development program (JDP) with imec. Under the JDP, Park Systems will evaluate and develop measurement solutions using its product portfolio, including atomic force microscopy (AFM), white light interferometry (WLI), imaging spectroscopic ellipsome
2 min read
US-Made Direct-Drive V-783 Large-Aperture XY Motion Stage for Semiconductor Automation Offers 310 × 310 mm Travel and 1 nm Resolution
PI has introduced the V-783 high-precision linear motion stage. This U.S.-made direct-drive stage belongs to the V-700 series of mechanical-bearing XY stages. It offers 310 × 310 mm travel, nanometer-level resolution, and high-speed motion for precision scanning systems. The V-700 se
3 min read
Applied Materials Introduces Centris Spectral SiN ALD and Producer Selectra Mo Etch Systems for 3D Chip Scaling
Applied Materials introduced two new chipmaking systems: Centris Spectral SiN ALD and Producer Selectra Mo Etch. The systems are designed for precision materials engineering in high-aspect-ratio 3D structures in logic and memory chips. They are currently in use by leading logic and memory chipmak
4 min read
Rapidus Signs MoU with Fondazione Chips-IT Following Japan-Italy Prime Ministerial Meetings on Semiconductor Cooperation
Rising Japan based advanced node foundry Rapidus Corporation announced that it has signed a Memorandum of Understanding with Fondazione Chips-IT, an Italian private-law foundation dedicated to semiconductor circuit design. The signing occurred as part of initiatives connected to the June 1
4 min read
Sterling and Wilson Signs MoU with South Korea's Shinsung E&G for Cleanroom HVAC Projects in Semiconductor, Battery and Display Sectors
Sterling and Wilson Pvt. Ltd., an Indian MEP and EPC company, has signed a Memorandum of Understanding (MoU) with Shinsung E&G, a South Korean HVAC and MEP company. The MoU covers joint bidding, participation, acquisition and execution of cleanroom and dryroom HVAC projects for semiconductor,
3 min read
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