Intel Appoints Seok-Hee Lee as Executive Vice President of Intel Foundry to Oversee Advanced Packagi

Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing.

As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This step reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems.

“Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems,” said Lip-Bu Tan, Intel CEO. “Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution. Seok-Hee’s insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems for Intel Foundry customers. He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T and HBI, to high vo...