Memory
Quintauris and Everspin Technologies Collaborate to Enhance RISC-V Solutions for Automotive Applications
Quintauris and Everspin have announced a strategic partnership to integrate advanced memory solutions into the Quintauris ecosystem. The collaboration targets the development of reliable and safe RISC-V–based platforms for automotive, industrial, and edge applications, where data persistenc
2 min read
Tight Supply and Restocking Fuel 7% DRAM Module Revenue Growth in 2024, TrendForce Reports
In 2024, the global DRAM module market generated USD 13.3 billion in revenue, marking a 7% year-over-year increase, according to TrendForce. This growth reversed a 28% decline from 2023, driven by tighter supply and increased demand following inventory adjustments in the downstream consumer marke
3 min read
Kioxia and SanDisk Activate Fab2 for AI-Driven 3D Flash Memory Production in Japan
Kioxia and SanDisk announced the commencement of operations at Fab2 (K2), a new semiconductor fabrication facility at the Kitakami Plant in Iwate Prefecture, Japan. The facility is equipped to produce eighth-generation, 218-layer 3D flash memory using CMOS directly Bonded to Array (CBA) technolog
3 min read
NVIDIA Pushes for 10 Gbps HBM4 Specs to Counter AMD’s MI450 Helios, SK hynix to Lead Supply in 2026
TrendForce reports that NVIDIA is urging suppliers of its Vera Rubin server racks to enhance HBM4 specifications, targeting a per-pin speed of 10 Gbps. This move comes as AMD prepares to launch its MI450 Helios platform in 2026. The feasibility of achieving these upgrades remains uncertain, but S
2 min read
AI-Driven Data Surge Sparks Nearline HDD Shortages, Boosts QLC SSD Demand by 2026
TrendForce reported that the rapid rise in AI-generated data is straining data center storage infrastructure, leading to severe shortages of nearline hard disk drives (HDDs). Traditionally used for cold data storage, such as backups and historical records, nearline HDDs are facing supply constrai
2 min read
AI-Powered Automotive Innovation: Qualcomm and Google Cloud Expand Collaboration for Agentic AI in Vehicles
Qualcomm and Google Cloud announced an expanded collaboration to integrate Google’s Automotive AI Agent, powered by Gemini models, with Qualcomm’s Snapdragon Digital Chassis solutions. Unveiled at IAA Mobility 2025 in Munich, the partnership aims to enable automakers to deliver multim
2 min read
IBM and AMD Collaborate on Quantum-Centric Supercomputing for AI and High-Performance Workloads
IBM and AMD announced a partnership to develop quantum-centric supercomputing architectures, integrating quantum computers with high-performance computing (HPC) and AI accelerators. The collaboration aims to create scalable, open-source platforms by combining IBM’s quantum computing technol
3 min read
Kioxia Unveils 5TB, 64GB/s Flash Memory Module for AI and Edge Computing Advancements
Kioxia has developed a prototype flash memory module with a capacity of 5 terabytes (TB) and a bandwidth of 64 gigabytes per second (GB/s), designed to support large-scale artificial intelligence (AI) models and edge computing applications. The development was part of the "Post-5G Information and
2 min read
The Big Trend in Semiconductor Design: Unifying Compute and Memory
In the human brain, computing and memory reside in close proximity ensuring near instant processing. In contrast, computer systems keep the computing and memory away, causing access delays and reduced performance. To achieve human-like efficiency, processors and memory must be t
14 min read
NEO Semiconductor Unveils X-HBM Architecture with 32K-Bit Data Bus for AI Chips
NEO Semiconductor has introduced the Extreme High Bandwidth Memory (X-HBM) architecture, designed for AI chips. The X-HBM features a 32K-bit wide data bus and a potential density of 512 Gbit per die, offering 16X greater bandwidth or 10X higher density compared to traditional HBM.
2 min read
Phison and Supermicro Partner to Enhance AI and Hyperscale Storage with High-Density SSD Solutions
Phison Electronics has partnered with Supermicro, an IT solution provider for AI/ML, HPC, cloud, storage, and 5G/edge, to deliver a server solution for high-density workloads. The collaboration integrates Phison’s 122.88 TB Pascari D205V SSD, featuring an E3.L form factor and Gen5 NVMe perf
2 min read
Sandisk and SK hynix Join Forces to Standardize High Bandwidth Flash Memory for AI Workloads
Sandisk Corporation and SK hynix have signed a Memorandum of Understanding (MOU) to collaborate on establishing the specification for High Bandwidth Flash (HBF) memory technology, aimed at supporting next-generation AI inference workloads. The partnership focuses on standardizing the HBF specific
3 min read
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