Phison and Supermicro Partner to Enhance AI and Hyperscale Storage with High-Density SSD Solutions

Phison Electronics has partnered with Supermicro, an IT solution provider for AI/ML, HPC, cloud, storage, and 5G/edge, to deliver a server solution for high-density workloads. The collaboration integrates Phison’s 122.88 TB Pascari D205V SSD, featuring an E3.L form factor and Gen5 NVMe performance, into Supermicro’s Petascale Storage Family to address demands in AI, machine learning training, real-time analytics, and cloud-scale storage.

The partnership enables customers to utilize high-capacity storage per slot, reducing rack space, operational costs, and infrastructure complexity for edge and data center environments. The E3.L form factor, part of the EDSFF family in Phison’s Pascari D-Series, is designed for high-density, high-performance applications. It offers double the capacity of the E3.S form factor, improved airflow, and thermal management, and supports hot-pluggable, front-accessible designs, making it suitable for AI training clusters, hyperscale environments, and dense edge deployments.

Michael Wu, GM and President armies at Phison US, stated that the collaboration supports increasing storage demands with scalability and cost-optimizing features across drive and rack architecture. The Pascari D205V and Supermicro solutions are showcased at Supermicro’s booth #846 at FMS: the Future of Memory and Storage 2025.