Memory Last update: 15th Jun 2021
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SK Hynix buying memory biz of Intel
STT and TEL collaborating on "SRAM and DRAM replacing MRAM"
X-CEO of Sandisk is appointed as CEO and President of Micron
Global Mobile DRAM revenue grew 20% in 4Q 2016, as per DRAMeXchange
Micron completes acquisition of Inotera Memories
JEDEC approves 2016 SPD enhancement for DDR4/DDR4E and LPDDR3/LPDDR4
Three U.S. Patents related to memory storage granted to StorTrends
Non-volatile memory tech breakthrough by Micron and Intel
NAND Flash life enhanced using FPGA
8 percent q-o-q fall in Micron's fiscal 3Q 2015 revenue
JEDEC to update solid state drive standard subcommittee
Cypress offers higher bid to acquire ISSI
Imec and sureCore collaborate on SRAM Design IP
India based memory semiconductor fab is more essential
Spansion and XMC joins hands on 3D NAND flash
DRAM bit growth falls, as per study by IC Insights
2014 looks to be a good year for flash memory
Samsung memory chip fab in China starts full production
Toshiba Starts 15nm NAND flash chip volume production
ISSI and Spansion sign patent license agreement
Spansion and Macronix fight over patent violation in flash memory manufacturing
eMemory and SMIC expand non-volatile memory partnership
Adesto presents a paper at IEDM on its NV memory withstanding 200 Deg C
DRAM supply eases
Date storage growth by unit of Zettabytes, Video is the major factor
Fire accident at SK Hynix fab causes DRAM price hike
TrendForce: Market penetration of USB 3.0 Flash drive is only 10%
Spansion Files Patent Complaints Against Macronix
SPA, a new association for storage tech launched
SanDisk invests in Tegile Systems
DRAM market is achieving profit stability by controlling production
Seagate invests in eASIC
Sony and Panasonic partner to develop 300 GB optical discs by 2015
Toshiba to add 4th fab to make advanced NAND flash memory chips
Hard disk-drive use in video-surveillance to grow by 23% in 2013, says IHS
Toshiba presents new MROM tech at VLSI design event in Japan
SK Hynix and Rambus sign five-year patent license agreement
ITC determines GSI does not infringe four SRAM patents by Cypress
Microchip's subsidiary SST to acquire Novocell Semiconductor
Imec and GLOBALFOUNDRIES collaborate in developing STT-MRAM
TrendForce: NAND Flash revenues fell by 2.1% in 1Q13
Samsung starts production of 4 Gb LPDDR3 Mobile DRAM using 20nm node
Flash memory maker Spansion to buy analog and MCU biz of Fujitsu
NAND flash sales in 2013 pushed by smartphones, tablets and SSDs
DRAM makers cutting production to prevent price-decline
TSMC's 55 nm process to shrink flash memory by 80% SRAM by 70%
Spansion and XMC expand partnership to include 32nm flash production
Toshiba develops low-power technology for embedded SRAM
Micron amends Inotera Memories JV with Nanya
2013: Stable growth for NAND flash memory is forecasted
High speed CompactFlash memory cards from Toshiba for digital cameras
Standard for NAND flash device interface interoperability by JEDEC and ONFI
Toshiba develops STT-MRAM chip outperforming SRAM in power consumption
Smartphones to consume more flash mem chips than feature phones
Micron and AgigA Tech collaborate on NVDIMM
Imec and Nantero to make non-silicon memory using carbon nanotubes
Windows 8 not to trigger DRAM demand like its predecessors
Chipmakers cut commodity DRAM and increase mobile and server DRAM
Server and mobile DRAM production ratio to account >40% in 2012: TrendForce
7.5%-11% rise in 2H Sept mainstream NAND Flash contract prices: TrendForce
Micron captures 20% share in NAND flash market for the 1st time: IHS
DRAM usage in smartphones to surge by 50% in 2012: IHS
Rambus signs 6-year patent license agreement with Fujitsu
Cypress Semiconductor finally wins in acquiring Ramtron
Kilopass ups eNVM memory capacity by 4x to 32Mb
Kilopass expands XPM NVM IP on 180nm Dongbu HiTek BCD process
DRAM price decline forcing vendors to cut production
Mobile DRAM estimated to grow at 10% in 2012
Rambus tests its memory arch using GLOBALFOUNDRIES 28nm SLP
SSDs yet to shake up HDD use in PC and notebook market
Cypress Semiconductor not giving up Ramtron, rises the offer
NOR flash memory market: Spansion, Samsung and Micron are key players in mobile
ROHM to manufacture FRAM powered chips for Ramtron
Intel's 2nd Q 2012 revenue readings
DRAMeXchange: LPDDR3 shipments to constitute 20% of total mobile DRAM in 2H2013
Infineon uses Spansion flash memory chips to store graphic data in MCUs kits
Short-term NAND Flash market recovery by reducing 3-5% contract price: TrendForce
Rank no.3 and 4 join to overtake rank no.2 in DRAM market
ARM, HP, and SK hynix join Hybrid Memory Cube Consortium
DRAM pricing is strangely stable due to Elpida bankruptcy: IHS
Javelin selects Kilopass’ XPM memory IP Core for MIPI RFFE digital interface
Ronald Black replaces Harold Hughes as Rambus’ President and CEO
Ramtron finds Cypress offer is under value
Alliance Memory signs distribution agreement with Transfer Multisort Elektronik
19nm node flash memory chips and cards available from Toshiba and Sandisk
Revenue for mobile memory to reach $14.9 billion in 2012
6-9% dip in mainstream NAND Flash contract price in 2HMay, reports TrendForce
DFI 3.1 specification released; Supports LPDDR3 memory for smartphones and tablets
Elpida overtakes Micron in Q12012 DRAM market ranking
Elpida story and balanced sup/demand to enable 2012 DRAM market, as per IHS
Samsung hold a huge 70% share in Mobile DRAM market as per TrendForce
Common implementation of NVM IP cores by Kilopass for the 130/110nm nodes
TrendForce: Micron offers JPY$300 billion to Elpida, three major DRAM players emerge
Toshiba lauds NAND Flash memory achievement
Over 1 billion hard disk drives sold with Marvell chips inside by Western Digital
Alliance Memory appoints Jan Ornjager as the regional manager, Nordic
IHS iSuppli: Desktops set to adopt 2.5-Inch Hard Disc Drives (HDD)
Imec to present resistive RAM papers at 2012 VLSI Technology Symposium
DDR3 memory related paper from Rambus wins DesignCon-2012 award
Kilopass NVM IP employed in SoC IC from SICMICRO
TrendForce presents possible DRAM market impact due to Elpida's situation
FPGA-RLDRAM inteface is demonstrated
MediaTek to use Rambus patented tech
Toshiba to acquire 3.5 Inch HDD machinery and IP from Western Digital
Elpida filed for bankruptcy protection
$8.5M research initiative for generating quantum memories
Everspin records 300 percent growth of its MRAM shipments in 2011
Samsung starts volume production of stacked memory chips for smartphones
Broadcom licenses Rambus patents
Panasonic, Samsung, SanDisk, Sony and Toshiba collaborate on SD Card security
Non-Volatile DIMM memory can save the desktop computers from using UPS
Walton to purchase from Elpida 7,500 preferred shares in Elpida subsidiary EBS
AMD branded DRAM memory modules available now in N.America
Toshiba develops tech for embedded SRAM to operate from wide Vcc of 0.5V to 1.0V
Inphi's iMB enabled LRDIMM modules validated by Intel
DRAMeXchange reports 19.4% fall in DRAM revenue on q-o-q basis
IDT's low-power dual-port memory in Samsung GALAXY Tab
NAND flash: 2xnm-node chips to gradually replace 3xnm-node chips
Tablets are seen as fast growing market for DRAM makers
Invensas uses IDT's DDR3 register in its xFD memory stacking technology
Elpida Memory filed a lawsuit against Nanya Technology for patent infringement
JEDEC advances DDR4 Standard with reduced power usage
IDT and Dell to present NVMe specs at the flash memory summit on Aug 9-11
Elpida sampling 2Gb DDR3 SDRAM made using 25nm process
Georgia researchers develop memory devices based on piezoelectric nanowires
Toshiba opens new 300mm fab in Japan to make 24nm NAND flash chips
Hynix and Toshiba collaborate to develop NV memory; MRAM
Imec brings down the leakage current in DRAM at lower EOT of 0.4nm
imec stacks DRAM over logic chip and connects them by TSV and micro conducting bumps
IBM researchers mitigate the problem of short-term drift in multi-bit PCM memory
Elpida makes 0.8mm DRAM package by using PoP tech
DRAMeXchange forecasts the weaker shipment momentum of NAND flash
JEDEC publishes e-MMC standard update v4.5
Elpida employs HKMG tech to make 2Gb LPDDR2 DRAM
DRAMeXchange: DRAM contract price fell by 2.74%
Mobile memory market is forecasted to grow by 25.7% to reach $16.4 billion in 2011
Open-Silicon to tech-support Micron hybrid memory cube technology
Super fast growth of tablet is driving DRAM market
Embedded NOR flash memory market in 2011 is set to grow 8 percent to 3.96 billion units
DRAM Module shipment to grow by 10.8% in 2011, predicts IHS iSuppli
Elpida, PTI, and UMC partner on 3D fabrication of semiconductor devices at 28nm
DRAMeXchange: Price increase momentum of DDR3 due to Japanese quake weakening
MRAM demand drives Everspin sales expansion
Inphi's memory buffer validated by Intel
Silicon oxide based memory chip to be tested in space for radiation
DRAMeXchange: Supply of NAND flash not affected by the Japan's quake
Spansion GL-S NOR Flash Memory enters production
Ramtron selects KYEC for assembling and testing of its F-RAM chips
Spansion and SMIC expand foundry agreement
DRAMeXchange forecasts overall notebook shipment to up by 6.5% in 2011
Rambus to acquire Cryptography Research for $342.5M
DRAMeXchange predicts DDR3 2GB contract price of US$20 in short term
Worldwide DRAM revenue declined by 4.0% in 1st Q 2011
Elpida Memory to commence mass production of its 30nm process DRAM in May
Semiconductor vendor ranking in 2010; the movers and shakers as per IHS iSuppli
Rexchip successful in pilot run of Elpida's 30nm 2Gb DDR3 DRAM
Notebook/netbook shipment slowing from 30% Y/Y growth in 2010 to 27% in 2011
Sidense 1T-OTP available in ON Semiconductor 180 nm process
Rambus renews patent license agreement with Toshiba
Japan tremors and tsunami will pass through the global semiconductor industry
Vimicro PC-CAM Processors uses Kilopass' NVM memory IP core
JEDEC publishes standards for flash memory based UFS
Tablets and smartphones enable fast growth in NAND flash consumption
Eric A. Balzer is appointed as CEO of Ramtron
Rambus achieves differential memory signaling of 20Gpbs
Powerchip to become 100% semiconductor foundry service provider
Hynix Semiconductor reported a sequential quarterly revenue drop of 0.5 trillion Won in 4Q10
Researchers develop single memory chip for system and content storage
Change in management positions at Ramtron
Sidense Memory IP Qualified in 180nm, 130nm and 65nm GLOBALFOUNDRIES Processes
Hard Disk Drive market is still not affected by SSD due to cost factor
iSuppli forecasts a fall of 11.8% in worldwide DRAM revenue in 2011
Lithography based semiconductor chip making after 15nm is less certain
Strategy Analytics's tech predictions for 2011
Rambus renews its patents license agreement with Renesas
Toshiba slims its chip manufacturing resources to become fablite
JEDEC's Flash memory standards UFS is under fast progress of implementation
Magnetic hard disk drive growth less affected by solid state memory drives
Soitec buys Altatech Semiconductor's wafer inspection system
Rambus sues Broadcom, Freescale, LSI, MediaTek, NVIDIA, and ST for patent infringement
Elpida sampling 2Gb DDR3 SDRAM for consumer devices
SanDisk, Sony and Nikon co-develop new specs for media storage in memory cards
Graphics DRAM heading downwards, forecasts iSuppli
NAND type flash memory revenue to grow by 38% to reach $18.7 billion in 2010
Elpida is shipping samples of its 32-Gigabyte LRDIMM
Record booking for single transistor per cell ROM tech expert Sidense
ZTE selects Cypress's SRAM devices for its Ethernet switches
Samsung starts mass producing 40nm-class 8GB DDR3 Module for portable apps
ATMI and Ovonyx progress towards commercialization of PCM devices
Hynix joins hands with HP to develop memristor semiconductor devices
Toshiba starts mass production of its 24nm, NAND flash memory
Sidense granted anti-fuse memory cell patent by USPTO
Intel and Micron to jointly develop 3bpc NAND flash memory chip on 25nm process technology
Rambus grants NVIDIA patent license for certain memory controllers
Plastic computer memory device demo using spintronics tech
Ramtron starts commercial sampling of its MaxArias Wireless Memory
Hynix begins mass production of its 64Gb NAND flash using 20nm process
IC Insights: DRAM vendors to rank up as total semiconductor sales to top $204B in 2010
Elpida to make new NAND flash based on Spansion's MirrorBit charge-trapping tech
Samsung and Toshiba join hands to develop DDR NAND flash memory with 400Mbps interface
Rambus granted its 1,000th Patent
Toshiba starts builiding Fab 5 facility for making NAND flash chips
PCT to sell Microchip's serial NOR-flash products
Semiconductor industry sales forecast for 2010: SIA; 28.4%, Gartner; 27%
Sidense says no Kilopass patent infringement
Microchip sells its NAND flash memory property to Greenliant
Infineon and Elpida settle legal dispute over patent infringement
Robust market demand for semiconductor devices in 2010
Latest semiconductor market stats from SIA and IDC
The market growth to continue for semiconductor industry in remaining quarters of 2010
Video surveillance storage market is forecasted to grow over $5.6 billion by 2013
DRAM market growth momentum continuing
Samsung shipping 20nm NAND flash memory chips
Synopsys DDR memory IP supports Six DDR Standards in single PHY
Capacitor-less below 1V operating ZRAM chips made using bulk silicon can replace DRAM
Flash memory market to grow for another 10 years
Ramtron granted with US patent for it's Ferroelectric RAM
64 GB SDXC card from SanDisk for HD video recording apps
55 nm Embedded Flash process tech from ST Micro for making automotive MCU chips
Samsung begins volume production of 4Gb DDR3 DRAM chips at 40nm node
Fujitsu and University of Toronto developed reliable read-method for MRAM
2 Gb DDR3 DRAM chip jointly developed by Micron and Nanya
Intel and Micron's 25-nanometer NAND flash tech for consumer electronic gadgets
LSI and Seagate collaborate on solid-state storage tech
OTP memory IP from Sidense drives Audium's power amplifier chip
Samsung and Rambus settle their patent related disputes and claims
Merry times for Hynix Semi with its 4th quarter 2009 revenues rose
Future Electronics to sell and stock Ramtron chips
Year 2009 is not that bad for memory chip makers and 2010 going to be even better
40nm 2-Gigabit DDR3 SDRAM volume production shipment from Elpida
65nm XS Version 1-Gigabit DDR3 SDRAM from Elpida
Elpida receives "2009 Global Warming Prevention Activity Award"
Hynix Semiconductor's 2Gb DDR3 DRAM devices Validated by Intel
DRAM test lab opened in Munich Germany
Over a billion SoCs integrate flash memory interface IP components from Arasan Chip Systems
Agilent and Nexus deliver DDR3 memory bus debug solutions
Semiconductor industry's fast recovery in 3rd Q 09 is due to processor and DRAM demand
Indilinx, Cavium and Narinet collaborated to bring SSD into networking storage systems
Intel and Numonyx achieve stacking of PCM arrays to increase memory capacity
MagnaChip offers 0.11um, 30V process technology with small SRAM cell size
Logic Devices is sampling its first DDR2 DRAM modules
Elpida memory completes the development of the 40nm 2-gigabit DDR3SDRAM
Samsung producing 512-Megabit nonvolatile memory PRAM
Semiconductor industry is cautiously optimistic on next phase of growth
IBM's on-chip DRAM prototype technology achievements
Moser Baer is quickly gaining share in USB flash memory market
DDR3 based threaded module prototype for multicore computing
Ramtron settles product defect claim of its memory product
SPMT's abridged technology specifications for mobile devices
LSI retained its top position in Host Bus RAID Controller market with further growth
Ramtron secures $6 million credit from Silicon Valley Bank
8.5 GB DVD media launched by the Moser Baer
Toshiba is shipping 43nm NAND flash in volumes to laptop OEMs
IDT powered by Tundra's expertise is allying with Micron to develop PCIe SSDs
FRAM chips from Ramtron are selected for high-rel SSD
Rambus unfolds DRAM innovations beyond DDR3
New industry consortium to promote serial interfaced DRAMs
Transistor-less semiconductor memory denser and faster than NAND
Joint development of NAND flash memory controllers by Hynix, Numonyx and Phison
Toshiba to make single chip flash memory of 32 Gb capacity using 32nm process
Rambus buys Inapac patents related to System-in-Package solutions
Samsung producing NAND flash chips in 40-nm process technology
Hynix agree to compensate Rambus for using its technology in SDR and DDR SDRAM
Q4 2008 revenues freeze semiconductor industry to a dope less silicon
Ramtron to make its FRAM chips using IBM foundry
Toshiba achieves 3-bit-per-cell 32Gb record in NAND Flash capacity
Taiwan's DRAM vendor Powerchip semiconductor posts 1.603 billion NT$ revenue for Jan-09
SST revenues for 4Q08 were $58.4 million compared with $92.4 million in 3Q
Rexchip earns TOSHMS certification
Detailed study of possibility of a $20 Laptop computer
John Kispert is the new CEO and Director of Spansion
Innovation in DRAM focuses on package and speed
California Federal District Court halts Rambus patent infringement case Against Micron
New security technology for 2.5-inch encrypted hard disk drives
Chang-Soo Choi is now the President and CEO of Samsung Electronics America
Intel's another legend Craig Barrett to Retire in May
Technology to transfer data from DRAM chips to processor @ 1 terabyte per second
Vanguard International Semiconductor reports 2008 revenue of NT$16,120 million
Qimonda is shipping Rambus XDR DRAM in volumes to PlayStation3 gaming systems
Spansion has planned to sell its business or get merged with other similar company
Micron works with Sun Micro to achieve one million write cycles in NAND flash
Smallest Fin-FET SRAM cell with high-k/Metal gate material
Hitachi GST and Intel to jointly develop Solid State Drives (SSD)
NAND Flash to be mass-produced at 34 nm by Intel and Micron
DRAM vendors Powerchip and Elpida engaged in close talks for a possible merger
Rambus complaints on NVIDIA to International Trade Commission over patent infringement
UMC to make SRAM chips at 28nm node
Samsung steps back from acquiring SanDisk
Z-RAM memory technology breakthrough by Innovative Silicon
Synopsys and Ovonyx team-up in developing simulation models for Phase-change RAM
India's automotive electronic growth opportunities
ISSI opens sales office in Chennai
Hynix and Toshiba to cross license patents and products
Texas Instruments to make 4 MB FRAMs for ATMEL
Renesas and Powerchip agree for a joint venture to design memory devices
Intel ships in volumes it's 1GB, monolithic NOR flash memory chips to mobile phone makers ST Micro gets one NAND license from Samsung Drag and drop solution announced by Altera and Northwest logic for 667-Mbps DDR2 SDRAM interface in Stratix II FPGAs Samsung’s new flash memory development has extended maximum memory capacity of NAND flash memories to 256 MB and a scaling down to 20 nano meters Samsung semiconductor is anticipating to mass produce Phase change Random Access Memory (PRAM) by 2008
New Products ISO26262 ASIL Grade D safety certified secure flash memory device Micron ready to mass produce UFS multichip package with LPDDR5 DRAM AI demands a different procesor unit, not the present CPU, GPU and FPGA turbo 256 Kbit FRAM with SPI interface operates up to temp of up to 125°C Cypress electron-locking flash memory tech gets mass produced at UMC China based Shannon launches first 12.8TB PCIe SSD A new method by Fujitsu enables 2x response writing speed in flash storage Craving for memory, here is 256 GB MicroSD card from Samsung 1Mb no-battery serial SPI nvSRAM from Cypress and Anvo-Systems 256Gb 3-D NAND chip from Toshiba is available from September in samples AEC-Q100-qualified 2Mbit EEPROM for engine monitoring and safety applications CSP packaged 1-Mbit Serial FRAM for wearable electronic devices SSD controllers for TLC and 3-D NAND flash Non volatile memory for medical device withstands harsh gamma radiation Synchronous SRAM with on-chip error-correcting code Industrial-Plus Serial EEPROM operate at temperatures to 105°C 128GB eMMC5.0 flash storage for mainstream smart phones and tablets 3D NAND flash enables affordable 10 TB SSDs e2v inc releases the highest density MRAM device Auto-qualified serial EEPROMs from ST in tiny 2x 3mm WFDFPN8 package Samsung begin volume production of 8-Gb LPDDR4 Mobile DRAM FRAM chip integrated with binary counter save 94% energy Automotive grade NOR flash memory withstand up to 125°C Serial flash from Microchip with fast erase time of 35 ms Samsung starts production of 3-bit 3D V-NAND flash memory for SSDs 20nm 6Gb LPDDR3 Mobile DRAM chip from Samsung in mass production Pin to pin compatible nonvolatile FRAM for your battery integrated SRAM Adesto launches CBRAM tech NVRAM for medical systems Monolithic 8Gb DDR3 SDRAM chip by Micron 1 Tera byte SSD using 3D NAND chips Wider temp withstanding automotive NOR flash chips from Spansion 2.0 x 2.2 x 0.3 mm FRAM integrated MCU chips for space constraint applications Low power non-volatile memory IP for ID/tag chip design 4-Mbit FRAM from Fujitsu as a replacement for SRAM Micron's Hybrid Memory Cube in supercomputer prototype SATA 3 Gbps Compliant half slim type SSDs 19nm JEDEC compliant eMMC 5.0 NAND flash memory modules Compliance analyzers for DDR4, DDR3 and DDR3L DRAM interface specs Not a memory chip, it's a memory cube Adesto shipped 1 billion DataFlash products Fingerprint protected USB thumb drives from Moser Baer Panasonic makes microcomputer based on its ReRAM nonvolatile memory tech Micron sampling 16nm made 128Gb NAND flash chip Samsung's flash memory drives read 5GB data in six minutes 32K I2C and SPI EEPROMs offer up to 4 million erase/write cycles Toshiba to mass produce 2bit/cell 64Gb NAND flash using 19nm process 1st specs on Hybrid Memory Cube agreed 1/2 Mb FRAM memory ICs from Fujitsu guarantee 10 trillion r/ws Toshiba sampling 64 GB embedded NAND flash memory module New memory arch R+ LPDDR3 from Rambus supports 3200 Mbps speed 960GB M500 SSD from Micron at a launch price of within $600 960GB M500 SSD from Micron at a launch price of within $600 FRAM for medical equipment a better alternative compared to EEPROM Kilopass XPM IP available for IBM 65nm LPE process 4MB flash memory chip operates in the temp range of -55 to 210 Deg C NAND type flash memory controllers with support for 3 Gbps SATA FRAM from Fujitsu: 2.7V to 5.5 volts Vcc, 1012 times read/write, and 256Kb storage High speed hybrid storage drives from Toshiba for notebooks and PCs FRAM-based chip from Fujitsu for RFID tags Serial EEPROM with MAC/EUI node for internet of things applications DDR3 register for memory modules consume low power 10,500RPM speed, 900GB, 2.5-inch disk drives from Toshiba transfer 286MB/s 16 GB DDR4 DRAM R-DIMM modules for servers 16M/64M Non-volatile MRAMs from Aeroflex in flatpack package 1Mb SPI / 8-bit parallel bus SRAM for use as MCU RAM Resistive-RAM based on HfO2 demonstrate nanometer scaling Voice recognition chip packs audio-processor and high-speed memory Low power DDR3 register from Inphi for memory module applications LPDDR3 standard for low power memory devices published by JEDEC 20nm LPDDR2 DRAM chips are under production at Samsung Availability of the fully functional DDR4 DRAM from Micron SSD drive with ruggedized SATA connector for defense and high-rel apps 6Gb/s SATA controller IC for solid state memory storage TI's Wolverine MCU embeds FRAM to cut power consumption NVM IP from Kilopass gets qualified on TowerJazz 130nm CMOS process Elpida Memory Develops Resistance RAM Prototype Memory IP platform for SoC designers supports different interfaces 2 Mb serial FRAM chip from Ramtron Toshiba to launch SLC NAND flash memory embedded ECC Elpida samples 4Gb DDR3 mobile DRAM Small sized power ICs for SSDs and hybrid disk-drives 10x10nm² measuring RRAM cell from Imec can replace NAND flash Low power register for DDR3 memory modules from IDT Ramtron samples 64Kb 20MHz bus-speed serial SPI FRAM chips Elpida makes 4-Gigabit DDR3 SDRAM using 25nm process Dual-interface EEPROM allows wireless access of data via NFC and RFID Low power embedded flash controller for Smartphones and Tablet Computers ONFI-3.0 compliant Universal Flash Controller IP core New evaluation system for AGIGARAM DDR3 Non-Volatile DIMM unveiled New 128/64/32Mb SRAM chips from Cypress offer 32-bit I/O config with 55-ns access time 256/128/64Kb FRAM chips with SPI interface from Fujitsu New NAND flash memory wafer and package test solutions from Advantest Ramtron sampling IBM made 64-Kb serial F-RAM chip Kilopass expanding its OTP NVM on SMIC's 55 nm logic CMOS process 2-Mb serial EEPROM in SO8N package for storing large size code Memory chips transit from a zero-power state to a 5+ Gb/s data transfer rate in 5 ns IDT delivers single-chip enterprise-class flash controller with native PCIe Freescale licenses memory controllers and serial links from Rambus Micron sampling its Next-Gen RLDRAM Memory Ramtron starts shipping IBM made FRAM chips NAND flash controller IP supports ONFI 3.0 32GB capacity SSD drives in BGA package with SATA AND PATA interface NAND flash memory compatible high-speed SATA controller from TDK Embedded multi-time programmable NVM in 40nm Intel and Micron's new 20nm process produce 8GB flash chip measuring 118mm2 Cadence DDR4 IP offerings: PHY IP; controller IP; memory models; verification IP; tools and methodologies Toshiba introduces new embedded-NAND flash memory with ECC function in 24nm Kilopass makes testchip of its 2T antifuse using TSMC 28nm HKMG process Sidense' OTP NV memory meet the assessment requirements of TSMC's IP9000 Elpida develops 4-Gb DDR2 Mobile DRAM 2Gb DDR4 DRAM from Hynix Semiconductor is twice faster than DDR3 Semiconductor IP startup Uniquify granted patent related to DDR2/DDR3 timing Flash memory controller for smartphones for 2/3 bit-per-cell NAND flash JEDEC-compliant memory buffer for DDR3 LRDIMMl High-rel EEPROM IP blocks designed to withstand temperature up to 170 Deg C 128 KB automotive grade FRAM chips from RAMTRON drop-in replace EEPROMs Samsung applies TSV tech to 3D stack multiple DDR3 DRAMs 4Gb LPDDR2 DRAM with speed of 1,066 Mbps from Samsung Toshiba introduces 256 GB solid state disk drives NV SRAM module from Maxim with embedded RTC and battery in a PowerCap package Registering clock driver for DDR3 DRAM module apps 2GB DDR3 SDRAM from Elpida made using 30nm process INNOVENTIONS offers memory tester for DDR3 DRAM USB 3.0 to NAND flash controller chip from VIA Isolation Memory Buffer from Inphi for data center servers and cloud computing USB 3.0 SATA RAID storage devices from Fujitsu 8GB and 16GB NAND Flash memory from Samsung for Smartphone applications Elpida and Spansion introduces charge trapping 1.8V, 4-Gigabit SLC NAND Flash Memory New USB 3.0 compliant SATA bridge ICs from Fujitsu Stamp size 64GB memory drive in BGA package from Sandisk New 2Gigabit DDR2 mobile RAM from Elpida using 40nm process New DDR3 memory controller interface for consumer electronics from Rambus Samsung starts production of 2GB DDR3 DRAM 1.8V Serial Flash memory chip from Microchip for low power electronic devices 32GB memory module from Samsung for server applications ProMOS successfully produce 1Gb DDR3 DRAM using Elpida's 63nm technology Intel introduces its SSD products to improve computing experience SD cards from Toshiba integrates Wi-Fi functionality to digital still cameras 128GB embedded NAND flash memory module from Toshiba for portable electronics Ramtron serial 1-Mbit F-RAM is automotive qualified Samsung launches multi chip packaged PRAM devices for mobile phones 2-Gb LP DDR2 DRAM from Micron for ultra-portable computers Power controller for DDR memory chips from Exar Intel's new SATA Solid-State Drive (SSD) at $125 for dual drive computers Integrated serial presence detect EEPROM memory and temperature-monitoring IC Inphi samples JEDEC-compatible memory buffer to support more memory modules Embedded DRAM Buffer ICs from NEC Electronics for mobile graphics apps 2-terabyte hard disk drive from Samsung Electronics for desktop systems 30 nanometer, 2Gb green DDR3 DRAM for handheld embedded devices Integrated NV memory, gamma-correction reference systems with MTP memory Hynix Semiconductor develops 2Gb DDR2 DRAM for mobile electronic devices 128GB, 32nm Multi-Level Cell NAND-flash-based SSDs from Toshiba SD 3.0 / eMMC 4.4 Card Controller IP targeting HD multi-media content on handheld devices 2Gb GDDR5 DRAM from Hynix Semiconductor based on 40nm tech High-density 64GB embedded NAND flash memory device from Toshiba New SSD memory from Micron targeting notebook and desktop computers Samsung's new 30nm-class 32Gb MLC NAND flash memory chips Mid-range and enterprise disk storage systems from Fujitsu Elpida sampling 32-bit I/O 2-Gigabit DDR2 SDRAM LSI storage devices inside Cray's supercomputer Memory device packs 4Gb NAND flash and 2Gb DDR DRAM 256Mbit Serial Flash from Macronix for high storage space apps 34nm MLC NAND flash memory from Micron for enterprise storage with 6x endurance A 65-nm, 144-Mbit monolithic SRAM from Cypress Semiconductor PWM controllers from IR for DDR3 memory modules New 54nm 1Gb DDR3 from Hynix Semiconductor consumes 30% less power New Magnetoresistive RAM devices from e2v for defense, avionic apps New serial nvSRAMs from Cypress Semiconductor in the range of 16Kb to 8Mb New MaxArias RF-enabled wireless memory devices from Ramtron High speed/density battery-free non-volatile RAM from AGIGA Elpida developed 2Gb DDR2 Mobile DRAM SanDisk's Extreme Pro CompactFlash memory cards with Read/Write speed of 90MB/s Eight-layer through Silicon Via based multi-layer 8-gigabit DRAM from Elpida 16-Kilobit F-RAM memory to meet AEC-Q100 grade 1 automotive standards Moorestown Platform now supports 4Gb Mobile DDR SDRAM from Hynix 3 bit-per-cell 34nm NAND flash technology jointly by Intel and Micron SC70 packaged op amp consumes little power of 0.55 microwatt Intel's 34-Nanometer NAND flash SSDs Vertical-Mount, SMT DDR2 DIMM socket with low lead coplanarity from Fujitsu New 256 Kb F-RAM devices with SPI and I2C serial interfaces from Ramtron New high speed SRAM family from Renesas targeting switches and routers STMicro packs 512-Kb of storage capacity in EEPROM of size 2 x 3mm New 8-Megabit F-RAM from Atmel pin-compatible with SRAM SAMSUNG develops SATA SSD in mini-card size for netbook computers Micron's new low power DDR3 memory module for portable computers eMMC4.4 standard based NAND flash memory devices from Micron Spansion unveiled new 32-128 Mb flash memory with SPI interface FCRAM ICs withstanding 125 Deg C temperature with DDR SDRAM interface Hynix developed mobile 1Gb DDR2 DRAM using 54nm process technology Serial FRAM in 512 Kb and 1 Mb capacities; alternative choice for NOR flash Microchip specializes its EEPROM by offering in smallest packages SAMSUNG started shipping 16GB DDR3 DRAM memory modules for servers Hynix Semiconductor validates MetaRAM based 8GB DDR3 RDIMM Block-abstracted 8GB and 16GB NAND flash memory for media players Less space consuming SD Card interface IC for cell phones New SSD memory controllers support external DRAM interfaces New EEPROM chips operating at 1.5 Volts for both read and write operations 1.2Gb and 2.5Gb DDR1 integrated memory modules for hi-reliability apps Flash memory controller for SSD, and CFCs New NAND flash, DRAM, and software from Micron to kick-start the growth DSCC approved 32Mb & 64Mb hermetic flash memory modules First validated 40-nanometer class DRAM Samsung releases 4Gb DDR3 DRAM chip amid the weak memory market 256-Kilobit serial F-RAM with I2C interface Serial SRAM with SPI interface for embedded system applications 1-Gigabit XDR DRAM works at speed of 7.2 GHz Long-wire ZIF probe tips for DDR, GDDR memory validation 4-Megabit F-RAM memory in FBGA package 512GB solid state drive using 43nm Multi-Level Cell NAND 1Gb+ serial NAND flash memory for embedded applications Hynix is first in achieving 2Gb capacity in single package Mobile DRAMs 7Gbps, 1Gb GDDR5 Graphics DRAM 512-Kilobit Serial F-RAM with high-speed read/write performance 16 Gb monolithic flash memories manufactured using 43nm technology Atmel's Low Power 1.8V 8-Megabit Serial Flash NAND flash chip of 32 Gigabit in TSOP package Hynix 512MB mobile DDR SDRAM works at 185 MHz Samsung's new 8GB NAND is shipping in samples to mobile-phone makers ST Micro Automotive grade NOR flash available up to 32 Mbit capacity 10MHz, 32Kbit SPI serial EEPROM from Microchip Samsung develops 1GB low power DDR memory for cellphones SST releases new 16MB 1.8V flash memory. Serial flash memory with 16M capacity and each sector of 4K bytes. Ramtron’s FM3130 is with 64KB of FRAM and real time clock/calender FRAM of 512KB with SPI in 8 pin TDFN package with a max price tag of $7.62 Micron leads the market by releasing 1Gbit DDR3 RAM Blue ray discs of mammoth 50 GB capacity available from TDK
New Products
ISO26262 ASIL Grade D safety certified secure flash memory device
Micron ready to mass produce UFS multichip package with LPDDR5 DRAM
AI demands a different procesor unit, not the present CPU, GPU and FPGA turbo
256 Kbit FRAM with SPI interface operates up to temp of up to 125°C
Cypress electron-locking flash memory tech gets mass produced at UMC
China based Shannon launches first 12.8TB PCIe SSD
A new method by Fujitsu enables 2x response writing speed in flash storage
Craving for memory, here is 256 GB MicroSD card from Samsung
1Mb no-battery serial SPI nvSRAM from Cypress and Anvo-Systems
256Gb 3-D NAND chip from Toshiba is available from September in samples
AEC-Q100-qualified 2Mbit EEPROM for engine monitoring and safety applications
CSP packaged 1-Mbit Serial FRAM for wearable electronic devices
SSD controllers for TLC and 3-D NAND flash
Non volatile memory for medical device withstands harsh gamma radiation
Synchronous SRAM with on-chip error-correcting code
Industrial-Plus Serial EEPROM operate at temperatures to 105°C
128GB eMMC5.0 flash storage for mainstream smart phones and tablets
3D NAND flash enables affordable 10 TB SSDs
e2v inc releases the highest density MRAM device
Auto-qualified serial EEPROMs from ST in tiny 2x 3mm WFDFPN8 package
Samsung begin volume production of 8-Gb LPDDR4 Mobile DRAM
FRAM chip integrated with binary counter save 94% energy
Automotive grade NOR flash memory withstand up to 125°C
Serial flash from Microchip with fast erase time of 35 ms
Samsung starts production of 3-bit 3D V-NAND flash memory for SSDs
20nm 6Gb LPDDR3 Mobile DRAM chip from Samsung in mass production
Pin to pin compatible nonvolatile FRAM for your battery integrated SRAM
Adesto launches CBRAM tech NVRAM for medical systems
Monolithic 8Gb DDR3 SDRAM chip by Micron
1 Tera byte SSD using 3D NAND chips
Wider temp withstanding automotive NOR flash chips from Spansion
2.0 x 2.2 x 0.3 mm FRAM integrated MCU chips for space constraint applications
Low power non-volatile memory IP for ID/tag chip design
4-Mbit FRAM from Fujitsu as a replacement for SRAM
Micron's Hybrid Memory Cube in supercomputer prototype
SATA 3 Gbps Compliant half slim type SSDs
19nm JEDEC compliant eMMC 5.0 NAND flash memory modules
Compliance analyzers for DDR4, DDR3 and DDR3L DRAM interface specs
Not a memory chip, it's a memory cube
Adesto shipped 1 billion DataFlash products
Fingerprint protected USB thumb drives from Moser Baer
Panasonic makes microcomputer based on its ReRAM nonvolatile memory tech
Micron sampling 16nm made 128Gb NAND flash chip
Samsung's flash memory drives read 5GB data in six minutes
32K I2C and SPI EEPROMs offer up to 4 million erase/write cycles
Toshiba to mass produce 2bit/cell 64Gb NAND flash using 19nm process
1st specs on Hybrid Memory Cube agreed
1/2 Mb FRAM memory ICs from Fujitsu guarantee 10 trillion r/ws
Toshiba sampling 64 GB embedded NAND flash memory module
New memory arch R+ LPDDR3 from Rambus supports 3200 Mbps speed
960GB M500 SSD from Micron at a launch price of within $600
FRAM for medical equipment a better alternative compared to EEPROM
Kilopass XPM IP available for IBM 65nm LPE process
4MB flash memory chip operates in the temp range of -55 to 210 Deg C
NAND type flash memory controllers with support for 3 Gbps SATA
FRAM from Fujitsu: 2.7V to 5.5 volts Vcc, 1012 times read/write, and 256Kb storage
High speed hybrid storage drives from Toshiba for notebooks and PCs
FRAM-based chip from Fujitsu for RFID tags
Serial EEPROM with MAC/EUI node for internet of things applications
DDR3 register for memory modules consume low power
10,500RPM speed, 900GB, 2.5-inch disk drives from Toshiba transfer 286MB/s
16 GB DDR4 DRAM R-DIMM modules for servers
16M/64M Non-volatile MRAMs from Aeroflex in flatpack package
1Mb SPI / 8-bit parallel bus SRAM for use as MCU RAM
Resistive-RAM based on HfO2 demonstrate nanometer scaling
Voice recognition chip packs audio-processor and high-speed memory
Low power DDR3 register from Inphi for memory module applications
LPDDR3 standard for low power memory devices published by JEDEC
20nm LPDDR2 DRAM chips are under production at Samsung
Availability of the fully functional DDR4 DRAM from Micron
SSD drive with ruggedized SATA connector for defense and high-rel apps
6Gb/s SATA controller IC for solid state memory storage
TI's Wolverine MCU embeds FRAM to cut power consumption
NVM IP from Kilopass gets qualified on TowerJazz 130nm CMOS process
Elpida Memory Develops Resistance RAM Prototype
Memory IP platform for SoC designers supports different interfaces
2 Mb serial FRAM chip from Ramtron
Toshiba to launch SLC NAND flash memory embedded ECC
Elpida samples 4Gb DDR3 mobile DRAM
Small sized power ICs for SSDs and hybrid disk-drives
10x10nm² measuring RRAM cell from Imec can replace NAND flash
Low power register for DDR3 memory modules from IDT
Ramtron samples 64Kb 20MHz bus-speed serial SPI FRAM chips
Elpida makes 4-Gigabit DDR3 SDRAM using 25nm process
Dual-interface EEPROM allows wireless access of data via NFC and RFID
Low power embedded flash controller for Smartphones and Tablet Computers
ONFI-3.0 compliant Universal Flash Controller IP core
New evaluation system for AGIGARAM DDR3 Non-Volatile DIMM unveiled
New 128/64/32Mb SRAM chips from Cypress offer 32-bit I/O config with 55-ns access time
256/128/64Kb FRAM chips with SPI interface from Fujitsu
New NAND flash memory wafer and package test solutions from Advantest
Ramtron sampling IBM made 64-Kb serial F-RAM chip
Kilopass expanding its OTP NVM on SMIC's 55 nm logic CMOS process
2-Mb serial EEPROM in SO8N package for storing large size code
Memory chips transit from a zero-power state to a 5+ Gb/s data transfer rate in 5 ns
IDT delivers single-chip enterprise-class flash controller with native PCIe
Freescale licenses memory controllers and serial links from Rambus
Micron sampling its Next-Gen RLDRAM Memory
Ramtron starts shipping IBM made FRAM chips
NAND flash controller IP supports ONFI 3.0
32GB capacity SSD drives in BGA package with SATA AND PATA interface
NAND flash memory compatible high-speed SATA controller from TDK
Embedded multi-time programmable NVM in 40nm
Intel and Micron's new 20nm process produce 8GB flash chip measuring 118mm2
Cadence DDR4 IP offerings: PHY IP; controller IP; memory models; verification IP; tools and methodologies
Toshiba introduces new embedded-NAND flash memory with ECC function in 24nm
Kilopass makes testchip of its 2T antifuse using TSMC 28nm HKMG process
Sidense' OTP NV memory meet the assessment requirements of TSMC's IP9000
Elpida develops 4-Gb DDR2 Mobile DRAM
2Gb DDR4 DRAM from Hynix Semiconductor is twice faster than DDR3
Semiconductor IP startup Uniquify granted patent related to DDR2/DDR3 timing
Flash memory controller for smartphones for 2/3 bit-per-cell NAND flash
JEDEC-compliant memory buffer for DDR3 LRDIMMl
High-rel EEPROM IP blocks designed to withstand temperature up to 170 Deg C
128 KB automotive grade FRAM chips from RAMTRON drop-in replace EEPROMs
Samsung applies TSV tech to 3D stack multiple DDR3 DRAMs
4Gb LPDDR2 DRAM with speed of 1,066 Mbps from Samsung
Toshiba introduces 256 GB solid state disk drives
NV SRAM module from Maxim with embedded RTC and battery in a PowerCap package
Registering clock driver for DDR3 DRAM module apps
2GB DDR3 SDRAM from Elpida made using 30nm process
INNOVENTIONS offers memory tester for DDR3 DRAM
USB 3.0 to NAND flash controller chip from VIA
Isolation Memory Buffer from Inphi for data center servers and cloud computing
USB 3.0 SATA RAID storage devices from Fujitsu
8GB and 16GB NAND Flash memory from Samsung for Smartphone applications
Elpida and Spansion introduces charge trapping 1.8V, 4-Gigabit SLC NAND Flash Memory
New USB 3.0 compliant SATA bridge ICs from Fujitsu
Stamp size 64GB memory drive in BGA package from Sandisk
New 2Gigabit DDR2 mobile RAM from Elpida using 40nm process
New DDR3 memory controller interface for consumer electronics from Rambus
Samsung starts production of 2GB DDR3 DRAM
1.8V Serial Flash memory chip from Microchip for low power electronic devices
32GB memory module from Samsung for server applications
ProMOS successfully produce 1Gb DDR3 DRAM using Elpida's 63nm technology
Intel introduces its SSD products to improve computing experience
SD cards from Toshiba integrates Wi-Fi functionality to digital still cameras
128GB embedded NAND flash memory module from Toshiba for portable electronics
Ramtron serial 1-Mbit F-RAM is automotive qualified
Samsung launches multi chip packaged PRAM devices for mobile phones
2-Gb LP DDR2 DRAM from Micron for ultra-portable computers
Power controller for DDR memory chips from Exar
Intel's new SATA Solid-State Drive (SSD) at $125 for dual drive computers
Integrated serial presence detect EEPROM memory and temperature-monitoring IC
Inphi samples JEDEC-compatible memory buffer to support more memory modules
Embedded DRAM Buffer ICs from NEC Electronics for mobile graphics apps
2-terabyte hard disk drive from Samsung Electronics for desktop systems
30 nanometer, 2Gb green DDR3 DRAM for handheld embedded devices
Integrated NV memory, gamma-correction reference systems with MTP memory
Hynix Semiconductor develops 2Gb DDR2 DRAM for mobile electronic devices
128GB, 32nm Multi-Level Cell NAND-flash-based SSDs from Toshiba
SD 3.0 / eMMC 4.4 Card Controller IP targeting HD multi-media content on handheld devices
2Gb GDDR5 DRAM from Hynix Semiconductor based on 40nm tech
High-density 64GB embedded NAND flash memory device from Toshiba
New SSD memory from Micron targeting notebook and desktop computers
Samsung's new 30nm-class 32Gb MLC NAND flash memory chips
Mid-range and enterprise disk storage systems from Fujitsu
Elpida sampling 32-bit I/O 2-Gigabit DDR2 SDRAM
LSI storage devices inside Cray's supercomputer
Memory device packs 4Gb NAND flash and 2Gb DDR DRAM
256Mbit Serial Flash from Macronix for high storage space apps
34nm MLC NAND flash memory from Micron for enterprise storage with 6x endurance
A 65-nm, 144-Mbit monolithic SRAM from Cypress Semiconductor
PWM controllers from IR for DDR3 memory modules
New 54nm 1Gb DDR3 from Hynix Semiconductor consumes 30% less power
New Magnetoresistive RAM devices from e2v for defense, avionic apps
New serial nvSRAMs from Cypress Semiconductor in the range of 16Kb to 8Mb
New MaxArias RF-enabled wireless memory devices from Ramtron
High speed/density battery-free non-volatile RAM from AGIGA
Elpida developed 2Gb DDR2 Mobile DRAM
SanDisk's Extreme Pro CompactFlash memory cards with Read/Write speed of 90MB/s
Eight-layer through Silicon Via based multi-layer 8-gigabit DRAM from Elpida
16-Kilobit F-RAM memory to meet AEC-Q100 grade 1 automotive standards
Moorestown Platform now supports 4Gb Mobile DDR SDRAM from Hynix
3 bit-per-cell 34nm NAND flash technology jointly by Intel and Micron
SC70 packaged op amp consumes little power of 0.55 microwatt
Intel's 34-Nanometer NAND flash SSDs
Vertical-Mount, SMT DDR2 DIMM socket with low lead coplanarity from Fujitsu
New 256 Kb F-RAM devices with SPI and I2C serial interfaces from Ramtron
New high speed SRAM family from Renesas targeting switches and routers
STMicro packs 512-Kb of storage capacity in EEPROM of size 2 x 3mm
New 8-Megabit F-RAM from Atmel pin-compatible with SRAM
SAMSUNG develops SATA SSD in mini-card size for netbook computers
Micron's new low power DDR3 memory module for portable computers
eMMC4.4 standard based NAND flash memory devices from Micron
Spansion unveiled new 32-128 Mb flash memory with SPI interface
FCRAM ICs withstanding 125 Deg C temperature with DDR SDRAM interface
Hynix developed mobile 1Gb DDR2 DRAM using 54nm process technology
Serial FRAM in 512 Kb and 1 Mb capacities; alternative choice for NOR flash
Microchip specializes its EEPROM by offering in smallest packages
SAMSUNG started shipping 16GB DDR3 DRAM memory modules for servers
Hynix Semiconductor validates MetaRAM based 8GB DDR3 RDIMM
Block-abstracted 8GB and 16GB NAND flash memory for media players
Less space consuming SD Card interface IC for cell phones
New SSD memory controllers support external DRAM interfaces
New EEPROM chips operating at 1.5 Volts for both read and write operations
1.2Gb and 2.5Gb DDR1 integrated memory modules for hi-reliability apps
Flash memory controller for SSD, and CFCs
New NAND flash, DRAM, and software from Micron to kick-start the growth
DSCC approved 32Mb & 64Mb hermetic flash memory modules
First validated 40-nanometer class DRAM
Samsung releases 4Gb DDR3 DRAM chip amid the weak memory market
256-Kilobit serial F-RAM with I2C interface
Serial SRAM with SPI interface for embedded system applications
1-Gigabit XDR DRAM works at speed of 7.2 GHz
Long-wire ZIF probe tips for DDR, GDDR memory validation
4-Megabit F-RAM memory in FBGA package
512GB solid state drive using 43nm Multi-Level Cell NAND
1Gb+ serial NAND flash memory for embedded applications
Hynix is first in achieving 2Gb capacity in single package Mobile DRAMs
7Gbps, 1Gb GDDR5 Graphics DRAM
512-Kilobit Serial F-RAM with high-speed read/write performance
16 Gb monolithic flash memories manufactured using 43nm technology
Atmel's Low Power 1.8V 8-Megabit Serial Flash
NAND flash chip of 32 Gigabit in TSOP package
Hynix 512MB mobile DDR SDRAM works at 185 MHz
Samsung's new 8GB NAND is shipping in samples to mobile-phone makers
ST Micro Automotive grade NOR flash available up to 32 Mbit capacity
10MHz, 32Kbit SPI serial EEPROM from Microchip
Samsung develops 1GB low power DDR memory for cellphones
SST releases new 16MB 1.8V flash memory.
Serial flash memory with 16M capacity and each sector of 4K bytes. Ramtron’s FM3130 is with 64KB of FRAM and real time clock/calender FRAM of 512KB with SPI in 8 pin TDFN package with a max price tag of $7.62 Micron leads the market by releasing 1Gbit DDR3 RAM Blue ray discs of mammoth 50 GB capacity available from TDK
Design Guide
Flash memory chips for your embedded design
The next generation of NonVolatile RAMs (NVRAM)