Sandisk Corporation and SK hynix have signed a Memorandum of Understanding (MOU) to collaborate on establishing the specification for High Bandwidth Flash (HBF) memory technology, aimed at supporting next-generation AI inference workloads. The partnership focuses on standardizing the HBF specification, defining technology requirements, and exploring the development of a technology ecosystem for HBF.
HBF is designed to address the increasing memory demands of AI inference workloads in large data centers, small enterprises, and edge applications. It offers bandwidth comparable to High Bandwidth Memory (HBM) while providing 8-16 times the capacity at a similar cost. The technology leverages Sandisk’s BiCS technology and proprietary CBA wafer bonding, developed with input from AI industry players over the past year.
Alper Ilkbahar, Executive Vice President and Chief Technology Officer at Sandisk and HBF Technical Advisory Board member, stated that the collaboration addresses the need for scalable memory in the AI industry to handle growing data demands. Dr. Hyun Ahn, President and Chief Development Officer at SK hynix, noted that standardizing HBF will contribute to commercializing the technology, supporting AI and next-generation data workloads.
Sandisk has established a Technical Advisory Board, comprising industry experts and senior technical leaders, to guide HBF development, provide technical and market insights, and foster a standards-driven ecosystem. The company plans to deliver HBF memory samples in the second half of 2026, with AI-inference devices incorporating HBF expected in early 2027.
At FMS: the Future of Memory and Storage 2025, Sandisk’s HBF technology received the “Best of Show, Most Innovative Technology” award. On August 6, 2025, at 11:40 am Pacific time, Sandisk will present a keynote address at FMS 2025 in Santa Clara, California, sharing HBF updates and showcasing storage solutions at Booth #607.
